Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: In example implementations, an apparatus is provided. The apparatus includes a dielectrophoresis (DEP) separator, an electrical field generator, a tracking system, and a controller. The DEP separator is to separate a plurality of different particles. The electrical field generator is coupled to the DEP separator to apply a frequency to the DEP separator. The tracking system is to track a movement of a type of particles in the DEP separator. The controller is in communication with the electrical field generator to control the frequency and the tracking system to track the separation. The controller is to calculate a cross-over frequency from a cross-over frequency distribution for the type of particles based on a frequency sweep performed on the type of particles and the movement of the type of particles that is tracked.

Abstract: The present invention features interferon-free therapies for the treatment of HCV. Preferably, the treatment is over a shorter duration of treatment, such as no more than 12 weeks. In one aspect, the treatment comprises administering at least two direct acting antiviral agents to a subject with HCV infection, wherein the treatment lasts for 12 weeks and does not include administration of either interferon or ribavirin, and said at least two direct acting antiviral agents comprise (a) Compound 1 or a pharmaceutically acceptable salt thereof and (b) Compound 2 or a pharmaceutically acceptable salt thereof.

Abstract: A reclining foldable chair includes a support frame and a seat cover secured to the support frame. The support frame is configured to transition between a storage and use position and includes a first and second upright, a seat bottom support, a collapsible cross-brace, a seat back rest, and a reclining assembly configured to allow the chair to transition between upright and reclined positions. The reclining assembly includes a recline limiter and a pivoting link latch. The pivoting link latch includes a pivoting link and a moving link, wherein an overall length between opposite ends of the pivoting link and moving link is adjustable in order to transition the reclining foldable chair between the upright and reclined positions.

Abstract: A particle monitoring system may include a flow passage, a particle imager to image a targeted particle within the flow passage, electrodes supported proximate the flow passage, a power source connected to the electrodes and a controller to cause the power source to charge to electrodes so as to (1) apply an electric field balanced with respect to gravity so as to hold, levitate and rotate a targeted particle within the flow passage during imaging and (2) release the targeted particle following the imaging.

Abstract: A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.

Abstract: A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.

Abstract: A thermally cross-linkable polymer for forming an elastic material used as foldable intraocular lens is disclosed. The elastic material is a saturated block copolymer with a chemical formula of (Am)i(Bn)j(Af)k or (Am-Bn)pX(Bn-Af)q comprising a polymer A as a hard segment and a polymer B as a soft segment. The polymer A is a polymer formed by polymerizing at least one of a vinyl aromatic hydrocarbon and a thermal cross-linking monomer, or a polymer formed by copolymerizing at least one of a vinyl aromatic hydrocarbon and a thermal cross-linking monomer with a conjugated diene. The polymer B is a conjugated diene polymer, or a polymer formed by copolymerizing at least one of a vinyl aromatic hydrocarbon and a thermal cross-linking monomer with a conjugated diene.

Abstract: A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: A method includes encapsulating a device in an encapsulating material, planarizing the encapsulating material and the device, and forming a conductive feature over the encapsulating material and the device. The formation of the conductive feature includes depositing a first conductive material to from a first seed layer, depositing a second conductive material different from the first conductive material over the first seed layer to form a second seed layer, plating a metal region over the second seed layer, performing a first etching on the second seed layer, performing a second etching on the first seed layer, and after the first seed layer is etched, performing a third etching on the second seed layer and the metal region.

Abstract: Embodiments of the present application provide an apparatus and a method for manufacturing an electrode assembly. The apparatus includes a driving portion, used for driving pole pieces to fall them from the driving portion; and a first support portion, arranged below the driving portion, and used for receiving the falling pole pieces, so that the pole pieces are stacked on the first support portion. The distance between an initial position of the upper surface of the first support portion and the driving portion being in a range of W to 2W. The initial position is the position of the upper surface of the first support portion when receiving the first pole piece of the electrode assembly, and W is the length of each pole piece. The apparatus can effectively stack the pole pieces to obtain an electrode assembly, and has high stacking efficiency.

Abstract: A package structure includes a die, a first redistribution circuit structure, a first redistribution circuit structure, a second redistribution circuit structure, an enhancement layer, first conductive terminals, and second conductive terminals. The first redistribution circuit structure is disposed on a rear side of the die and electrically coupled to thereto. The second redistribution circuit structure is disposed on an active side of the die and electrically coupled thereto. The enhancement layer is disposed on the first redistribution circuit structure. The first redistribution circuit structure is disposed between the enhancement layer and the die. The first conductive terminals are connected to the first redistribution circuit structure. The first redistribution circuit structure is between the first conductive terminals and the die. The second conductive terminals are connected to the second redistribution circuit structure.

Abstract: A method includes encapsulating a device in an encapsulating material, planarizing the encapsulating material and the device, and forming a conductive feature over the encapsulating material and the device. The formation of the conductive feature includes depositing a first conductive material to from a first seed layer, depositing a second conductive material different from the first conductive material over the first seed layer to form a second seed layer, plating a metal region over the second seed layer, performing a first etching on the second seed layer, performing a second etching on the first seed layer, and after the first seed layer is etched, performing a third etching on the second seed layer and the metal region.

Abstract: A three-dimensional (3D) biological cell constituent concentration reconstruction method may include capturing two-dimensional images of a biological cell at different angles, virtually partitioning the biological cell into a 3D stacks of voxels, assigning cell constituent concentration estimations to respective voxels based upon a plurality of the two-dimensional images and forming a 3D cell constituent concentration model of the biological cell based upon the voxels and respective cell constituent concentration estimations.

Abstract: The invention relates to the technical field of nucleic acid detection and discloses a novel coronavirus nucleic acid rapid hybrid capture immunofluorescence detection kit, and a preparation method and a detection method thereof. The kit includes a COVID-19 reaction solution, wherein the COVID-19 reaction solution is prepared from a COVID-19 fluorescence marker and a COVID-19 probe solution; and the COVID-19 probe solution includes: an ORFlab section probe, an N section probe and an E section probe. Compared with general fluorescence PCR and sequencing detection, the kit has the advantages of stronger signal intensity, better specificity, shorter detection time, no need of professional technicians for operation, no need of refrigeration in transportation and storage, no need of a matched laboratory and a matched PCR instrument, and convenience and rapidness in use.

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

Abstract: Disclosed are a functionalized biological matrix material, a preparation method therefor and use thereof, which belong to the technical field of medical materials. In the present invention, by means of the hybridization of a biological matrix material with 3-sulfopropyl methacrylate, the cross-linking and functionalization of the biological matrix material are achieved at the same time. A specific method comprises modifying carbon-carbon double-bond structures such as allyl, methallyl in a biological matrix material, immersing the biological matrix material in an aqueous solution containing 3-sulfopropyl methacrylate, and finally performing cross-linking and functionalization on the biological matrix material by means of radical polymerization, and using the biological matrix material to prepare materials such as valves.

Abstract: For some examples, an apparatus to effect particle separation may include a dielectrophoretic particle separator that may separate particles within a focused particle stream. The dielectrophoretic particle separator may apply an electric field to the particles. An imaging system may capture images of the particles passing through a separation region of the dielectrophoretic particle separator. An image processing and control system may process the images to obtain information regarding the particles and may adjust an operating parameter of the dielectrophoretic separator based upon the information regarding the particles.

Abstract: A method includes encapsulating a device in an encapsulating material, planarizing the encapsulating material and the device, and forming a conductive feature over the encapsulating material and the device. The formation of the conductive feature includes depositing a first conductive material to from a first seed layer, depositing a second conductive material different from the first conductive material over the first seed layer to form a second seed layer, plating a metal region over the second seed layer, performing a first etching on the second seed layer, performing a second etching on the first seed layer, and after the first seed layer is etched, performing a third etching on the second seed layer and the metal region.