Abstract: An out-of-order buffer includes an out-of-order queue and a controlling circuit. The out-of-order queue includes a request sequence table and a request storage device. The controlling circuit receives and temporarily stores the plural requests into the out-of-order queue. After the plural requests are transmitted to plural corresponding target devices, the controlling circuit retires the plural requests. The request sequence table contains m×n indicating units. The request sequence table contains m entry indicating rows. Each of the m entry indicating rows contains n indicating units. The request storage device includes m storage units corresponding to the m entry indicating rows in the request sequence table. The state of indicating whether one request is stored in the corresponding storage unit of the m storage units is recoded in the request sequence table. The storage sequence of the plural requests is recoded in the request sequence table.

Abstract: A method for analyzing the liquefied petroleum gas includes the following steps. Provide a sample of the liquefied petroleum gas, and one main component group of the liquefied petroleum gas includes at least one sub component group. Analyze the sample of the liquefied petroleum gas so as to obtain a first measured THC corresponding to the main component group and a second measured THC corresponding to the sub component group. Obtain a regressed THC according to the second measured THC and a predetermined relationship of THC. Obtain a result of THC according to the first measured THC, the regressed THC, and a predetermined range of THC. The predetermined range of THC corresponds to the main component group. The device for analyzing the liquefied petroleum gas includes an inlet, a multiposition valve, a first column, a second column, an analyzing apparatus, and a computing unit.

Abstract: Provided are methods for recycling liquid crystal comprising: receiving at least one liquid crystal mixture; and forming a reformulated liquid crystal mixture using at least one portion of the at least one liquid crystal mixture. Also provided are reformulated liquid crystal mixtures comprising at least one recycled liquid crystal mixture and liquid crystals displays devices having one or more reformulated liquid crystal mixtures.

Abstract: A method for analyzing the liquefied petroleum gas comprises the following steps. Provide a sample of the liquefied petroleum gas, and one main component group of the liquefied petroleum gas comprises at least one sub component group. Analyze the sample of the liquefied petroleum gas so as to obtain a first measured THC corresponding to the main component group and a second measured THC corresponding to the sub component group. Obtain a regressed THC according to the second measured THC and a predetermined relationship of THC. Obtain a result of THC according to the first measured THC, the regressed THC, and a predetermined range of THC. The predetermined range of THC corresponds to the main component group. The device for analyzing the liquefied petroleum gas comprises an inlet, a multiposition valve, a first column, a second column, an analyzing apparatus, and a computing unit.

Abstract: Provided are methods for recycling liquid crystal comprising: receiving at least one liquid crystal mixture; and forming a reformulated liquid crystal mixture using at least one portion of the at least one liquid crystal mixture. Also provided are reformulated liquid crystal mixtures comprising at least one recycled liquid crystal mixture and liquid crystals displays devices having one or more reformulated liquid crystal mixtures.

Abstract: A method for out-of-plane displacement detection is disclosed. The out-of-plane displacement is detected by analyzing all the fringe density indexes calculated using the frequency-domain information extracted from a series of interference images of the sample vibrating at different frequencies. The present invention further discloses a method and an apparatus for resonant frequency identification by detecting the peak value of all the fringe indexes calculated at different scanning frequencies. With the identified resonant frequency, the full-field vibratory surface profile of the sample in various resonance modes can be reconstructed.

Abstract: A method and apparatus for identifying dynamic characteristics of a vibratory object is provided in the present invention, in which a series of dynamic interference images of the vibratory object is acquired through a frequency sweeping procedure and a two-dimensional image scanning procedure. Thereafter, the acquired images are processed for obtaining the corresponding differential fringe density index by signal processing technique of band-pass filtering method so as to further identify the dynamic characteristics of the vibratory object.

Abstract: A method for out-of-plane displacement detection is disclosed. The out-of-plane displacement is detected by analyzing all the fringe density indexes calculated using the frequency-domain information extracted from a series of interference images of the sample vibrating at different frequencies. The present invention further discloses a method and an apparatus for resonant frequency identification by detecting the peak value of all the fringe indexes calculated at different scanning frequencies. With the identified resonant frequency, the full-field vibratory surface profile of the sample in various resonance modes can be reconstructed.

Abstract: A method for out-of-plane displacement detection is disclosed. The out-of-plane displacement is detected by analyzing all the fringe density indexes calculated using the frequency-domain information extracted from a series of interference images of the sample vibrating at different frequencies. The present invention further discloses a method and an apparatus for resonant frequency identification by detecting the peak value of all the fringe indexes calculated at different scanning frequencies. With the identified resonant frequency, the full-field vibratory surface profile of the sample in various resonance modes can be reconstructed.

Abstract: A manufacturing process of a carrier is disclosed. First, a first substrate is provided. A circuit layer having a number of contacts is formed on a surface of the first substrate. Then, a solder mask is formed on the circuit layer and exposes the contacts. Next, a second substrate having an opening is bonded to the surface of the first substrate to form a carrier, and the opening exposes the solder mask and the contacts of the first substrate. Since the contacts are located within the opening, a circuit layout space can be increased, and a chip disposed in the opening can be electrically connected to the contacts directly, so as to reduce the thickness of a chip package structure. Besides, the carrier is formed by laminating the first and the second substrates. Hence, the manufacturing process of the carrier is simplified and yield of the carrier is promoted.

Abstract: A semiconductor package includes a semiconductor chip, a first substrate layer and a second substrate layer. The semiconductor chip has an active surface and a plurality of pads disposed on the active surface. The first substrate layer is formed on the active surface of the semiconductor chip and has a plurality of first contacts electrically connected to the pads of the semiconductor chip. The second substrate layer is substantially smaller than the first substrate layer, is formed on the first substrate layer, and has a plurality of second contacts electrically connected to the first contacts of the first substrate layer.

Abstract: A leadframe of a leadless flip-chip package includes a plurality of inner leads, a nonconductive ink layer and a solder mask layer. The inner leads have a plurality of bump-connecting terminals, a plurality of outer terminals and a plurality of redistribution lead portions. A half-etched recession is formed on lower surfaces of the redistribution lead portions, and is filled with the non-conductive ink layer. The non-conductive ink layer fixes the redistribution lead portions onto the bump-connecting terminals. The solder mask layer is easily formed on the non-conductive ink layer and covers the inner leads.

Abstract: A leadless semiconductor package mainly includes a plurality of inner leads, a chip pad, a semiconductor chip and a molding compound. A non-conductive ink is filled between every two of the inner leads, and couples the inner leads to the chip pad so as to be in replacement of the conventional tie bars. The semiconductor chip is disposed on the chip pad and electrically connected to the inner leads. Moreover, the molding compound is formed on the inner leads and the non-conductive ink for encapsulating the semiconductor chip. The non-conductive ink prevents the exposed bottom surfaces of the inner leads from contamination by the molding compound without attaching an external tape during molding. Also the inner leads can be in a multi-row arrangement and the chip pad can be disposed in an optional location.

Abstract: A method and apparatus for identifying dynamic characteristics of a vibratory object is provided in the present invention, in which a series of dynamic interference images of the vibratory object is acquired through a frequency sweeping procedure and a two-dimensional image scanning procedure. Thereafter, the acquired images are processed for obtaining the corresponding differential fringe density index by signal processing technique of band-pass filtering method so as to further identify the dynamic characteristics of the vibratory object.

Abstract: The present invention relates to a signal analysis method for vibratory interferometry to identify the vibratory characteristics of an object under test. A vibratory stroboscopic interferometric signal of an object under vibration is obtained. The vibratory stroboscopic interferometric signal is analyzed with a deconvolution operation to obtain a reformed vibratory stroboscopic interferometric signal.

Abstract: A multi-row substrate strip mainly includes a plurality of first and second substrate units in parallel, a plurality of connecting bars, a degating metal layer and at least one plating layer. The connecting bars are used to connect the first substrate units and connect the second substrate units. The degating metal layer includes a plurality of runner portions on the connecting bars, a plurality of first gate portions and a plurality of second gate portions. The first gate portions are formed on the first substrate units, and the second gate portions are formed on the second substrate units. The plating layer is formed on the first gate portions and the second gate portions, and exposes the runner portions, so as to save the plating material.

Abstract: A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

Abstract: A signal analysis method for vibratory interferometry is disclosed in the present invention for measuring the vibratory characteristics of an object under test. The signal analysis method comprises steps of: obtaining a vibratory interferometric signal of an object under vibration; and analyzing the vibratory interferometric signal with a deconvolution operation to obtain a reformed vibratory interferometric signal.

Abstract: The present invention relates to a conversion substrate for a leadframe and the method for making the same. The conversion substrate comprises a core layer, a first copper layer, a first metal plating layer and a first brown/black oxide layer. The first copper layer is on a first surface of the core layer, and has a plurality of discontinuous sections. The first metal plating layer is on the first copper layer, and has a plurality of discontinuous sections. The first brown/black oxide layer is on the first copper layer, so as to protect the first copper layer. Thus, the polymeric solder mask is not used in the conversion substrate of the present invention, so that the metal plating layer will not be polluted, and the yield rate can be raised.

Abstract: A manufacturing process of a carrier is disclosed. First, a first substrate is provided. A circuit layer having a number of contacts is formed on a surface of the first substrate. Then, a solder mask is formed on the circuit layer and exposes the contacts. Next, a second substrate having an opening is bonded to the surface of the first substrate to form a carrier, and the opening exposes the solder mask and the contacts of the first substrate. Since the contacts are located within the opening, a circuit layout space can be increased, and a chip disposed in the opening can be electrically connected to the contacts directly, so as to reduce the thickness of a chip package structure. Besides, the carrier is formed by laminating the first and the second substrates. Hence, the manufacturing process of the carrier is simplified and yield of the carrier is promoted.