Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

Abstract: A medical image processing apparatus includes: a display unit; and circuitry configured to: acquire volume data including tissues, and set a first mask region and a second mask region which include a voxel to be rendered among a plurality of voxels included in the volume data; set a first plane which intersects both the first mask region and the second mask region; display a first image in which a first region formed by cutting the first mask region by the first plane and the second mask region are rendered; receive through an operation unit a first operation for setting a second plane which is parallel to the first plane and intersects both the first mask region and the second mask region; and display a second image in which a second region formed by cutting the first mask region by the second plane and the second mask region are rendered.

Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

Abstract: The present invention addresses the problem of providing a polycyclic aromatic compound which has improved solubility in solvents, film formability, wet coatability and in-plane orientation. The above-described problem is solved by a composition for forming a light emitting layer, which contains, as a first component, at least one compound selected from the group consisting of compounds represented by general formula (A-1) and compounds represented by general formula (A-2), as a second component, at least one compound that has a triplet energy (ET) of 1.8-3.0 eV, and as a third component, at least one organic solvent. In the formulae, R represents a hydrogen atom, an aryl group, a heteroaryl group, a diarylamino group, a diheteroarylamino group or an aryl heteroarylamino group.

Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.

Abstract: The objective of the invention is to provide a polycyclic aromatic compound in which solubility to a solvent, film formability, wet coatability, thermal stability, and in-plane orientation are improved. This objective is achieved by a light emission layer-forming composition comprising: as a first component, at least one type of dopant material selected from the group consisting of polycyclic aromatic compounds represented by general formula (A) and polycyclic aromatic oligomer compounds including a plurality of structures represented by general formula (A); as a second component, a specific low-molecular-weight host material; and, as a third component, at least one type of organic solvent. In formula (A), ring A, ring B, and ring C each independently represent an aryl ring or a hetero aryl ring, Y1 is B, and X1 and X2 each independently represent O or N—R wherein at least one of X1 and X2 is N—R.

Abstract: The objective of the invention is to provide a polycyclic aromatic compound in which solubility to a solvent, film formability, wet coatability, thermal stability, and in-plane orientation are improved. This objective is achieved by a light emission layer-forming composition comprising: as a first component, at least one type of dopant material selected from the group consisting of polycyclic aromatic compounds represented by general formula (A) and polycyclic aromatic oligomer compounds including a plurality of structures represented by general formula (A); as a second component, a specific low-molecular-weight host material; and, as a third component, at least one type of organic solvent. In formula (A), ring A, ring B, and ring C each independently represent an aryl ring or a hetero aryl ring, Y1 is B, and X1 and X2 each independently represent O or N—R wherein at least one of X1 and X2 is N—R.

Abstract: The present invention provides a novel polycyclic aromatic compound having a plurality of aromatic rings linked by a boron atom, a nitrogen atom, and the like, and thus increases the number of alternatives of a material for an organic electroluminescent (EL) device. Furthermore, the present invention provides an excellent organic EL device by using a novel polycyclic aromatic compound as a material for an organic EL device.

Abstract: The present invention addresses the problem of providing a polycyclic aromatic compound which has improved solubility in solvents, film formability, wet coatability and in-plane orientation. The above-described problem is solved by a composition for forming a light emitting layer, which contains, as a first component, at least one compound selected from the group consisting of compounds represented by general formula (A-1) and compounds represented by general formula (A-2), as a second component, at least one compound that has a triplet energy (ET) of 1.8-3.0 eV, and as a third component, at least one organic solvent. In the formulae, R represents a hydrogen atom, an aryl group, a heteroaryl group, a diarylamino group, a diheteroarylamino group or an aryl heteroarylamino group.

Abstract: An in-vehicle device fixing structure includes: a base member including a bottom wall, a first side wall, and a second side wall; a box-shaped in-vehicle device including a first side face opposed to the first side wall, a second side face opposed to the second side wall, a third side face provided on a side opposite to the first side face, and a fourth side face provided on a side opposite to the second side face; a holding member including a third-side-face holding portion opposed to the third side face, a fourth-side-face holding portion opposed to the fourth side face, and a fastening portion attached to the bottom wall via a fastener and having a plate shape; and an in-vehicle device locking portion provided in at least the base member and the holding member, and configured to restrain a movement of the in-vehicle device toward the vehicle upper side.

Abstract: A chip capacitor includes a substrate having a main surface, a first conductive film including a first connecting region and a first capacitor forming region and formed on the main surface of the substrate, a dielectric film covering the first capacitor forming region of the first conductive film, a second conductive film including a second connecting region facing to the first capacitor forming region of the first conductive film across the dielectric film, and a second capacitor forming region facing to the first capacitor forming region of the first conductive film across the dielectric film, a first external electrode electrically connected to the first connecting region of the first conductive film, and a second external electrode electrically connected to the second connecting region of the second conductive film.

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

Abstract: A thermostable cellobiohydrolase, having a cellulose-binding motif domain including (A1) a polypeptide including an amino acid sequence represented by SEQ ID NO: 1, (B1) a polypeptide including an amino acid sequence in which at least one amino acid has been deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 1, and having a cellulose-binding function, or (C1) a polypeptide including an amino acid sequence having 70% or greater sequence identity with the amino acid sequence represented by SEQ ID NO: 1, and having a cellulose-binding function, and also having a cellobiohydrolase catalytic domain, wherein the thermostable cellobiohydrolase exhibits hydrolysis activity against a substrate of phosphoric acid swollen Avicel at least under conditions of 95° C. and pH 5.5.

Abstract: A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.

Abstract: A chip resistor including, a substrate having a main surface, a first resistance circuit formed at the main surface of the substrate, a second resistance circuit formed at the main surface of the substrate apart from the first resistance circuit, a common internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit and the second resistance circuit, a first internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit, a second internal electrode formed at the main surface of the substrate and electrically connected to the second resistance circuit, and a dummy resistance circuit formed in a region between the first resistance circuit and the second resistance circuit at the main surface of the substrate so as to be in an electrically floating state.

Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.

Abstract: Provided is an ink composition containing: as a first component, at least one inorganic filler having an average particle diameter of 1 to 30 nm; as a second component, at least one monomer selected from (meth)acrylate-based monomers; and as a third component, at least one polymerization initiator, in which the total weight concentration of the first to third components is 98 to 100% by weight relative to the total weight of the ink composition. The ink composition brings about a cured film having a high refractive index, a high transmittance, high flexibility, and/or a dielectric constant.

Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.

Abstract: Present invention provides resonant load power conversion device capable of decreasing switching frequency of each switching element and reducing the number of main circuit conductors. Resonant load power conversion device has single-phase inverter whose DC input side (Vdc) is connected to DC voltage source and whose output side (Vout) is connected to resonant load and which outputs rectangular wave voltage at resonance frequency. Resonant load power conversion device includes switch group circuits 100U, 100V, 100X, 100Y connected to respective upper and lower arms of input and output sides of single-phase inverter and configured so that N (N=integer of 2 or more) series bodies each having 2 switching elements are connected parallel by main circuit conductors, and controller switching each switching element (U11 to U32, V11 to V32, X11 to X32, Y11 to Y32) of switch group circuits 100U, 100V, 100X, 100Y by time division of 1/(M×N).