Abstract: Afforded are: a toilet body including a toilet bowl part, a rim conduit 36, and a rim part; and a functional component mounted on an upper surface part of the toilet body, rearward of the toilet bowl part. The upper surface part includes a cut-out part formed such as to be recessed downward from the other part of the upper surface part. The functional component is disposed on the cut-out part such as to be partially positioned downward with respect to an upper surface of the rim part, and such as to be partially stuck out into the toilet bowl part from upon the cut-out part, and, on a bottom surface of the stuck-out part, the functional component is provided with a conduit forming surface serving as an upper surface of the rim conduit.

Abstract: A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.

Abstract: A thermostable xylanase having a xylanase catalytic domain including: (A) a polypeptide including the amino acid sequence represented by SEQ ID NO: 1, (B) a polypeptide including an amino acid sequence in which at least one amino acid has been deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 1, and having xylanase activity at least under conditions of 85° C. and pH 6.0, or (C) a polypeptide including an amino acid sequence having 80% or greater sequence identity with the amino acid sequence represented by SEQ ID NO: 1, and having xylanase activity at least under conditions of 85° C. and pH 6.0.

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

Abstract: An isolated recombinant thermostable ?-glucosidase includes a polypeptide including the amino acid sequence of SEQ ID NO: 1 and at least one region selected from the group consisting of a cellulose-binding module, linker domain, a signal peptide and a tag.

Abstract: A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.

Abstract: A resonant load power conversion apparatus is provided to lower a switching frequency of each switching device and to reduce the number of main circuit conductors. The conversion apparatus includes a single-phase inverter having a dc input side (Vdc) connected with a dc voltage source and an output side (Vout) connected with a resonant load and outputting a rectangular wave voltage with a resonance frequency. Upper and lower arms on the input side and output side of the single-phase inverter are connected, respective, with switch group circuits 100U, 100V, 100V and 100V each of which includes N series combinations (N is an integer equal to or greater than 2) of two switching devices, connected in parallel with each other by main circuit conductors. The switching devices of the switch group circuits are controlled in a time division switching control mode with a control section.

Abstract: A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

Abstract: A hyperthermostable endoglucanase including an endoglucanase catalytic domain, the endoglucanase catalytic domain including: (A) a polypeptide including an amino acid sequence represented by SEQ ID NO: 1; (B) a polypeptide including an amino acid sequence in which at least one amino acid is deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 1, and having hydrolytic activity using p-nitrophenyl-?-D-cellobioside as a substrate at least under conditions of a temperature of 100° C. and a pH of 5.5; or (C) a polypeptide including an amino acid sequence having at least 70% sequence identity with the amino acid sequence represented by SEQ ID NO: 1, and having hydrolytic activity using p-nitrophenyl-?-D-cellobioside as a substrate at least under conditions of a temperature of 100° C. and a pH of 5.5.

Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

Abstract: A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.

Abstract: [Problem] There is demand for chip resistors that are compact and that have high resistivity. [Solution] A chip resistor (100) has a substrate (11), a first connection electrode (12) and a second connection electrode (13) that are formed on the substrate (11), and a resistor network that is formed on the substrate (11) and that has ends one of which is connected to the first connection electrode (12) and the other one of which is connected to the second connection electrode (13). The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line (103) that is provided along inner wall surfaces of trenches (101). The resistive element film line (103) extending along the inner wall surfaces of the trenches (101) is long and has a high resistivity as a unit resistive element. [Effect] The resistivity of the chip resistor (100) as a whole can be increased.

Abstract: A thermostable ?-xylosidase including a ?-xylosidase catalytic domain, the ?-xylosidase catalytic domain including: (A) a polypeptide including an amino acid sequence represented by SEQ ID NO: 1; (B) a polypeptide including an amino acid sequence in which at least one amino acid is deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 1, and having hydrolytic activity using p-nitrophenyl-?-D-xylopyranoside as a substrate at least under conditions of a temperature of 85° C. and a pH of 6.0; or (C) a polypeptide including an amino acid sequence having at least 80% sequence identity with the amino acid sequence represented by SEQ ID NO: 1, and having hydrolytic activity using p-nitrophenyl-?-D-xylopyranoside as a substrate at least under conditions of a temperature of 85° C. and a pH of 6.0.

Abstract: A hyperthermostable endoglucanase including an endoglucanase catalytic domain, the endoglucanase catalytic domain including: (A) a polypeptide including an amino acid sequence represented by SEQ ID NO: 3 or SEQ ID NO: 11; (B) a polypeptide including an amino acid sequence in which at least one amino acid is deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 3 or SEQ ID NO: 11, and having hydrolytic activity using carboxymethyl cellulose as a substrate at least under conditions of a temperature of 110° C. and a pH of 4.0; or (C) a polypeptide including an amino acid sequence having at least 70% sequence identity with the amino acid sequence represented by SEQ ID NO: 3 or SEQ ID NO: 11, and having hydrolytic activity using carboxymethyl cellulose as a substrate at least under conditions of a temperature of 110° C. and a pH of 4.0.

Abstract: A thermostable ?-xylosidase, having a ?-xylosidase catalytic domain including: (A) a polypeptide including the amino acid sequence represented by SEQ ID NO: 1, 3 or 5, (B) a polypeptide including an amino acid sequence in which at least one amino acid has been deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 1, 3 or 5, and having hydrolysis activity against a substrate of p-nitrophenyl-?-D-xylopyranoside at least under conditions of 80° C. and pH 4.0, or (C) a polypeptide including an amino acid sequence having 80% or greater sequence identity with the amino acid sequence represented by SEQ ID NO: 1, 3 or 5, and having hydrolysis activity against a substrate of p-nitrophenyl-?-D-xylopyranoside at least under conditions of 80° C. and pH 4.0.

Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.

Abstract: A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.

Abstract: A thermostable cellobiohydrolase including a cellobiohydrolase catalytic domain, the cellobiohydrolase catalytic domain including: (A) a polypeptide including an amino acid sequence represented by SEQ ID NO: 1; (B) a polypeptide including an amino acid sequence obtained by deletion, substitution or addition of at least one amino acid of the amino acid sequence represented by SEQ ID NO: 1, and having at least a cellobiohydrolase activity under conditions of 75° C. and pH 5.5; (C) a polypeptide including an amino acid sequence having at least 85% sequence identity with the amino acid sequence represented by SEQ ID NO: 1, and having at least a cellobiohydrolase activity under conditions of 75° C. and pH 5.

Abstract: A hyperthermostable endoglucanase, having an endoglucanase catalytic domain including: (A) a polypeptide including the amino acid sequence represented by SEQ ID NO: 1 or 2, (B) a polypeptide including an amino acid sequence in which at least one amino acid has been deleted, substituted, or added in the amino acid sequence represented by SEQ ID NO: 1 or 2, and having hydrolysis activity against a substrate of carboxymethyl cellulose at least under conditions of 90° C. and pH 5.5, or (C) a polypeptide including an amino acid sequence having 80% or greater sequence identity with the amino acid sequence represented by SEQ ID NO: 1 or 2, and having hydrolysis activity against a substrate of carboxymethyl cellulose at least under conditions of 90° C. and pH 5.5.