Abstract: A projection optical system for forming an image of a pattern in a first plane onto a second plane using exposure light in a wavelength region of shorter than 200 nm. When a projection pattern placed in the first plane and having a dark pattern and a light pattern around the dark pattern is projected onto the second plane, an average illuminance in a area where a projected image of the dark pattern is formed in the second plane is 8 or less, where an illuminance of an image of the light pattern around the dark pattern in the second plane is set to be 100.

Abstract: An exposure apparatus (PE1) and exposure method for use in photolithographically manufacturing devices such as semiconductor devices, image pickup devices, liquid crystal display devices and thin film magnetic heads. The apparatus is capable of transferring onto a substrate (W) the image of a pattern on a reticle (R) and includes a light source (2) capable of supplying an exposure energy beam (IL) with a wavelength under 200 nm, and an illumination optical system arranged to receive the exposure energy beam from said light source. The illumination optical system is designed to guide the exposure energy beam to the reticle. The apparatus also includes a projection optical system (PL) arranged between the. reticle and the substrate. The projection optical system is capable of forming an image of the reticle pattern onto the substrate based on the exposure energy beam passing through the reticle.

Abstract: An exposure apparatus (PE1) and exposure method for use in photolithographically manufacturing devices such as semiconductor devices, image pickup devices, liquid crystal display devices and thin film magnetic heads. The apparatus is capable of transferring onto a substrate (W) the image of a pattern on a reticle (R) and includes a light source (2) capable of supplying an exposure energy beam (IL) with a wavelength under 200 nm, and an illumination optical system arranged to receive the exposure energy beam from said light source. The illumination optical system is designed to guide the exposure energy beam to the reticle. The apparatus also includes a projection optical system (PL) arranged between the reticle and the substrate. The projection optical system is capable of forming an image of the reticle pattern onto the substrate based on the exposure energy beam passing through the reticle.

Abstract: Provided is a dioptric projection optical system favorably applicable to projection exposure apparatus used in the lithography step in fabrication of microdevices such as semiconductor devices. This projection optical system includes a positive, front lens unit (GF), an aperture stop (AS), and a positive, rear lens unit (GR) and is a bitelecentric optical system.

Abstract: The object of the present invention is to provide a catadioptric imaging system, or the like, which is capable of obtaining a desired image-side NA and an image circle without increasing the size of a reflecting mirror with a smaller number of lenses. This catadioptric imaging system comprises a first imaging optical system and a second imaging optical system, wherein the first imaging optical system is provided with a positive first lens group, an aperture stop, and a positive second lens group in the order from the object side, and the second imaging optical system is provided with a primary mirror comprising a concave first reflecting surface having a first radiation transmitting portion at the center thereof, and a secondary mirror comprising a second reflecting surface having a second radiation transmitting portion at the center thereof.

Abstract: The present invention relates to a projection exposure apparatus (10) for and method of imaging a reticle (R) having patterned surface onto a substrate (W) in photolithographic processes for manufacturing a variety of devices. The invention further relates to an optical system (C) having a folding member (M1) suited to the projection exposure apparatus, and a method for manufacturing the optical system. The projection exposure apparatus comprises an illumination optical system (IS) and a reticle stage (RS) capable of holding the reticle so the normal line to its patterned surface is in the direction of gravity. The apparatus also includes a substrate stage (WS) capable of holding the substrate with its surface normal parallel to the direction of gravity. The optical system includes a first imaging optical system (A) comprising a concave reflecting mirror and a dioptric optical member arranged along a first optical axis. The first imaging optical system (A) forms an intermediate image of the patterned surface.

Abstract: Disclosed is a projection optical system capable of ensuring good optical performance virtually without effects of birefringence of fluorite by for example, controlling an angle difference between an optical axis and a predetermined axis of a fluorite lens to a predetermined allowable amount. The projection optical system for forming an image of a first surface (R: reticle) on a second surface (W: wafer) includes at least two light-transmissive crystal members formed of a crystal material belonging to a cubic system. In at least the two light-transmissive crystal members, an angle difference is set at 1° between the optical axis and any one of crystal axes [111], [100] and [110].

Abstract: A projection exposure method and apparatus and method of fabricating a projection exposure apparatus that has an illumination optical system for supplying exposure light of a wavelength of not more than 200 nm to the projection master and a projection optical system for forming an image of a pattern on the projection master. The projection optical system has a front lens unit of a positive refracting power and a rear lens unit of a positive refracting power. An aperture stop is located in the vicinity of a rear focal point of the front lens unit.

Abstract: A dioptric projection optical system for imaging a reduced image of a pattern on a first surface onto a second surface using radiation-transmitting refractors. The projection optical system has a front lens unit of a positive refracting power and a rear lens unit of a positive refracting power. An aperture stop is located in the vicinity of a rear focal point of the front lens unit.

Abstract: The present invention relates to a projection exposure apparatus (10) for and method of imaging a reticle (R) having patterned surface onto a substrate (W) in photolithographic processes for manufacturing a variety of devices. The invention further relates to an optical system (C) having a folding member (M1) suited to the projection exposure apparatus, and a method for manufacturing the optical system. The projection exposure apparatus comprises an illumination optical system (IS) and a reticle stage (RS) capable of holding the reticle so the normal line to its patterned surface is in the direction of gravity. The apparatus also includes a substrate stage (WS) capable of holding the substrate with its surface normal parallel to the direction of gravity. The optical system includes a first imaging optical system (A) comprising a concave reflecting mirror and a dioptric optical member arranged along a first optical axis. The first imaging optical system (A) forms an intermediate image of the patterned surface.

Abstract: An exposure apparatus (PE1) and exposure method for use in photolithographically manufacturing devices such as semiconductor devices, image pickup devices, liquid crystal display devices and thin film magnetic heads. The apparatus is capable of transferring onto a substrate (W) the image of a pattern on a reticle (R) and includes a light source (2) capable of supplying an exposure energy beam (IL) with a wavelength under 200 nm, and an illumination optical system arranged to receive the exposure energy beam from said light source. The illumination optical system is designed to guide the exposure energy beam to the reticle. The apparatus also includes a projection optical system (PL) arranged between the reticle and the substrate. The projection optical system is capable of forming an image of the reticle pattern onto the substrate based on the exposure energy beam passing through the reticle.

Abstract: A dioptric projection optical system projects an image of a first surface onto a second surface and includes a first lens group having a negative refractive power and arranged in an optical path between the first surface and the second surface, a second lens group having a positive refractive power and arranged in an optical path between the first lens group and the second surface, a third lens group having a negative refractive power and arranged in an optical path between the second lens group and the second surface, a fourth lens group having an aperture stop and arranged in an optical path between the third lens group and the second surface, and a fifth lens group having a positive refractive power and arranged in an optical path between the fourth lens group and the second surface, wherein lens components belonging to the dioptric projection optical system are formed of at least two types of fluorides, and wherein a clear aperture of a light beam in the projection optical system is at a relative maximum

Abstract: A dioptric projection optical system which projects an image of a first surface onto a second surface includes lens components formed of at least two types of fluorides, and is constituted by, in order from a first surface side, a first lens group having a negative refractive power, a second lens group having a positive refractive power, a third lens group having a negative refractive power, a fourth lens group having an aperture stop within an optical path, and a fifth lens group having a positive refractive power. An clear aperture of a light beam in the projection optical system is at a maximum within the second lens group, is at a minimum within the third lens group, is at a maximum within the third, fourth, or fifth lens group, and has only one significant minimum between the first surface and the second surface.

Abstract: A projection optical system has excellent optical performance without substantially being affected by birefringence despite the use of an optical material with intrinsic birefringence such as fluorite, for example. A projection optical system forms a reduced image of a first surface onto a second surface . A first group of radiation transmissive members is formed such that a crystal axis [100] and the optical axis nearly align and similarly a second group of radiation transmissive members is formed such that the crystal axis [100] and the optical axis nearly align. The first grout of radiation transmissive members and the second group of radiation transmissive members have a positional relationship rotated relatively 45 degrees around the center of the light axis. Both the first group of radiation transmissive members and the second group of radiation transmissive members are arranged in an optical path between a pupil position on the second surface side and the second surface.

Abstract: Excellent optical performance is obtained without substantially any impact of birefringence even when a crystal material with intrinsic birefringence such as fluorite is used.

Abstract: The object of the present invention is to provide a catadioptric imaging system, or the like, which is capable of obtaining a desired image-side NA and an image circle without increasing the size of a reflecting mirror with a smaller number of lenses. This catadioptric imaging system comprises a first imaging optical system and a second imaging optical system, wherein the first imaging optical system is provided with a positive first lens group, an aperture stop, and a positive second lens group in the order from the object side, and the second imaging optical system is provided with a primary mirror comprising a concave first reflecting surface having a first radiation transmitting portion at the center thereof, and a secondary mirror comprising a second reflecting surface having a second radiation transmitting portion at the center thereof.

Abstract: An optical system attains good optical performance without substantially receiving the effects of birefringence even when using an optical material having intrinsic birefringence. An optical system that includes at least one radiation transmissive member that transmits light having a wavelength of 200 nm or less has an optical axis that substantially coincides with a crystal axis [100] or a crystal axis optically equivalent to the crystal axis [100].

Abstract: The present invention relates to a projection exposure apparatus (10) for and method of imaging a reticle (R) having patterned surface onto a substrate (W) in photolithographic processes for manufacturing a variety of devices. The invention further relates to an optical system (C) having a folding member (M1) suited to the projection exposure apparatus, and a method for manufacturing the optical system. The projection exposure apparatus comprises an illumination optical system (IS) and a reticle stage (RS) capable of holding the reticle so the normal line to its patterned surface is in the direction of gravity. The apparatus also includes a substrate stage (WS) capable of holding the substrate with its surface normal parallel to the direction of gravity. The optical system includes a first imaging optical system (A) comprising a concave reflecting mirror and a dioptric optical member arranged along a first optical axis. The first imaging optical system (A) forms an intermediate image of the patterned surface.

Abstract: An optical system attains good optical performance in effect without receiving the effects of birefringence even when using a birefringent crystal material such as fluorite The optical system is provided with a first lens group having a plurality of crystal lenses in which the optical axis and the crystal axis [111] are made to coincide, and a second lens group comprising a plurality of crystal lenses in which the optical axis and the crystal axis [100] are made to coincide. The first lens group has a first A lens group and a first B lens group that have a positional relationship rotated by a first angle relative to each other, and the second lens group has a second lens A group and a second lens B group that have a positional relationship rotated by a second angle relative to each other.

Abstract: A projection exposure apparatus includes a projection optical system, which is arranged in an optical path between a first surface and a second surface, projects a pattern on a negative plate arranged on the first surface onto a workpiece arranged on the second surface and exposes the pattern thereon. The projection optical system includes a first imaging optical subsystem having a dioptric imaging optical system; a second imaging optical subsystem having a concave reflecting system; a third imaging optical subsystem having a dioptric imaging optical system; a first folding mirror arranged in an optical path between the first imaging optical subsystem and the second imaging optical subsystem; and a second folding mirror arranged in an optical path between the second imaging optical subsystem and the third imaging optical subsystem.