Patents by Inventor Yasuhiro Shindo

Yasuhiro Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030201870
    Abstract: The present invention relates to the resistors used for detecting current in a current-carrying circuit as a voltage, and aims to provides a resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed. To obtain the above purpose, the resistor of the present invention comprises a sheet metal resistor element (11) and separate metal terminals (12),(13) electrically connected to both ends of the sheet resistor element(11). These terminals (12),(13) are made of metal having the same or greater electrical conductivity than that of the resistor element (11). With the above configuration, resistance of the terminals can be made smaller than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal.
    Type: Application
    Filed: April 21, 2003
    Publication date: October 30, 2003
    Inventors: Koichi Ikemoto, Yasuhiro Shindo, Norimitsu Chinomi
  • Patent number: 5889459
    Abstract: According to the present invention, there is provided a metal oxide film resistor which has an insulating substrate, a metal oxide resistive film having at least a metal oxide film having a positive temperature coefficient of resistance and/or a metal oxide film having a negative temperature coefficient of resistance, and/or a metal oxide insulating film. The metal oxide film resistor is not affected by moisture or alkali ions in the insulating substrate. The resistance of the film itself does not change. The metal oxide film resistor is extremely reliable.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: March 30, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akiyoshi Hattori, Yoshihiro Hori, Masaki Ikeda, Akihiko Yoshida, Yasuhiro Shindo, Kouzou Igarashi
  • Patent number: 5710042
    Abstract: The present invention relates to a high-speed and high-decomposition-ratio solid organic waste processing apparatus which does not scatter around unpleasant odor or a large amount of vapor, which does not need to add saw dust, rice hulls, etc.
    Type: Grant
    Filed: August 15, 1995
    Date of Patent: January 20, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Shindo, Usaburo Yamaguti, Takayuki Fushiki, Hajime Nomura, Tosio Suzuki
  • Patent number: 5587320
    Abstract: An apparatus for processing solid organic waste by crushing and/or agitating and fermenting the waste includes a solid organic matter processing device including a processing vessel provided with a crushing unit for receiving and crushing the solid organic waste and a processing unit for agitating and fermenting the crushed waste, a heat exchanger disposed outside the solid organic matter processing device which heat exchanger condenses vapor in a gas supplied from the processing vessel of the solid organic matter processing device to thereby change the vapor to liquid and to discharge the liquid, and gas circulation pipes for providing a gas circulation path through which the inside of the processing vessel of the solid organic matter processing device is operably connected to the heat exchanger and through which a gas in the processing vessel of the solid organic matter processing device is supplied into the heat exchanger and almost all of which gas processed in the heat exchanger is returned to the solid
    Type: Grant
    Filed: August 19, 1994
    Date of Patent: December 24, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Shindo, Usaburo Yamaguti, Kazuo Ioka, Tosio Suzuki, Akihiro Minagawa, Syoichi Kitabatake
  • Patent number: 4842654
    Abstract: Disclosed is a method of heat treatment of a low melting-point metal for production of spheroidal bodies formed of a low melting-point metal or alloy or heat treatment of the low-melting point metal coated on the surface of an electrode of a chip part.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: June 27, 1989
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Yasuhiro Shindo, Yukio Tsujimoto, Isami Saito, Isamu Hiraoka, Hiroshi Hirayama
  • Patent number: 4829553
    Abstract: The invention is directed to the electrode structure of a chip type component, such as a chip resistor, in which a plated film of low melting point metal is used as an outermost coating electrode film on the electrode portion, the layer underlying said plated film of low melting point metal on the electrode portion is formed of a metal material having a higher melting point than that of the plated film and also having good affinity with said plated film, and the electrode material comprising said plated film of low melting point metal is subjected to heat treatment at a temperature higher than the melting point thereof, so that the outermost surface of the electrode portion is coated with a remolten metal film.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: May 9, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiro Shindo, Yukio Tsujimoto, Isami Saito