Patents by Inventor Yasunori Tsukuda

Yasunori Tsukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140254191
    Abstract: The configuration is provided with three flexible arms extending in the same circumferential direction, as a suspension for supporting the magnetic circuit unit in displaceable fashion in the vertical direction with respect to a coil support member. This assures sufficient length of each of the flexible arms, enhancing the vibration characteristics. Next, arm insertion slots having approximately the same vertical Width as the flexible arms are formed at three locations in the circumferential direction in the coil support member. The distal end of each flexible arm is then inserted into the arm insertion slot, doing so in the aforementioned same circumferential direction, causing a barb to engage an engaging part and detain the flexible arm.
    Type: Application
    Filed: May 20, 2014
    Publication date: September 11, 2014
    Applicants: STAR MICRONICS CO., LTD., KOITO MANUFACTURING CO., LTD.
    Inventors: Makoto YASUIKE, Yasunori Tsukuda, Atsushi Sugimoto, Osamu Endo, Naoki Tatara
  • Patent number: 8446139
    Abstract: Disclosed herein is a current source, including: a current control oscillator configured to output an oscillation signal of a frequency dependent on an input current; a comparator configured to compare the oscillation signal with a reference signal; a charge pump configured to output a current dependent on a comparison result by the comparator; a low-pass filter configured to include a smoothing capacitor charged and discharged by an output current of the charge pump; a loop converter configured to be connected to the smoothing capacitor and generate a current dependent on a voltage generated by the smoothing capacitor to supply the current as the input current to the current control oscillator; and an output converter configured to be connected to the low-pass filter and generate a current dependent on a voltage generated in the low-pass filter to output the current as an output current.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: May 21, 2013
    Assignee: Sony Corporation
    Inventor: Yasunori Tsukuda
  • Patent number: 8253498
    Abstract: A phase-locked loop circuit includes: a phase and frequency comparing section configured to compare a phase of an external reference clock signal with a phase of a comparison clock signal, and generate an error signal corresponding to a result of comparison; an oscillating section configured to generate an internal clock signal of an oscillation frequency corresponding to the error signal; a frequency dividing section configured to generate the comparison clock signal by frequency-dividing the internal clock signal by a predetermined frequency dividing ratio; an oscillator control section configured to generate an oscillation control signal for controlling frequency of the internal clock signal output from the oscillating section on a basis of the error signal; and a frequency divider control section configured to generate a frequency division control signal for controlling a bias current of the frequency dividing section on a basis of the error signal.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: August 28, 2012
    Assignee: Sony Corporation
    Inventors: Yuki Yagishita, Yasunori Tsukuda
  • Publication number: 20110215875
    Abstract: A phase-locked loop circuit includes: a phase and frequency comparing section configured to compare a phase of an external reference clock signal with a phase of a comparison clock signal, and generate an error signal corresponding to a result of comparison; an oscillating section configured to generate an internal clock signal of an oscillation frequency corresponding to the error signal; a frequency dividing section configured to generate the comparison clock signal by frequency-dividing the internal clock signal by a predetermined frequency dividing ratio; an oscillator control section configured to generate an oscillation control signal for controlling frequency of the internal clock signal output from the oscillating section on a basis of the error signal; and a frequency divider control section configured to generate a frequency division control signal for controlling a bias current of the frequency dividing section on a basis of the error signal.
    Type: Application
    Filed: February 15, 2011
    Publication date: September 8, 2011
    Applicant: Sony Corporation
    Inventors: Yuki Yagishita, Yasunori Tsukuda
  • Publication number: 20110080145
    Abstract: Disclosed herein is a current source, including: a current control oscillator configured to output an oscillation signal of a frequency dependent on an input current; a comparator configured to compare the oscillation signal with a reference signal; a charge pump configured to output a current dependent on a comparison result by the comparator; a low-pass filter configured to include a smoothing capacitor charged and discharged by an output current of the charge pump; a loop converter configured to be connected to the smoothing capacitor and generate a current dependent on a voltage generated by the smoothing capacitor to supply the current as the input current to the current control oscillator; and an output converter configured to be connected to the low-pass filter and generate a current dependent on a voltage generated in the low-pass filter to output the current as an output current.
    Type: Application
    Filed: September 15, 2010
    Publication date: April 7, 2011
    Applicant: Sony Corporation
    Inventor: Yasunori Tsukuda
  • Patent number: 7835532
    Abstract: By integrating plural condenser microphone constituting bodies in an array state, a condenser microphone array is obtained. The condenser microphone array is formed by dicing a laminate of a circuit board forming member, a housing forming member, a spacer forming member, diaphragm sheet, diaphragm plate forming member and a cover forming member which form a part of the plural condenser microphone constituting bodies respectively. In an air chamber of each condenser microphone constituting body constituted in the laminate, a back plate and a contact spring are built.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: November 16, 2010
    Assignee: Star Micronics Co., Ltd.
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito
  • Patent number: 7835533
    Abstract: A circuit board forming member, a case forming member, a spacer forming member, a diaphragm sheet and a diaphragm plate forming member are laminated to form a portion, as excepting a back plate and a contact spring, of a condenser microphone, in plurality in a laminate. Moreover, the back plate and the contact spring are arranged in the air chamber, which is defined by the individual forming members, to form a plurality of condenser microphone constituents in the laminate. Next, the laminate is cut to separate the individual condenser microphone constituents thereby to manufacture the condenser microphones.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: November 16, 2010
    Assignee: Star Micronics Co., Ltd.
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito
  • Publication number: 20080267439
    Abstract: A condenser microphone includes: a casing including a sound hole; a vibration film disposed in the casing so as to face the sound hole; a back plate disposed opposed to the vibration film; a spacer disposed between the vibration film and the back plate; and a hold member including a spring member. The back plate has an outer peripheral shape that is smaller than an inner peripheral shape of the casing so as to provide a clearance between an outer peripheral surface of the back plate and an inner peripheral surface of the casing. The back plate is held by the hold member from an opposite side of the vibration fills.
    Type: Application
    Filed: July 25, 2007
    Publication date: October 30, 2008
    Applicant: STAR MICRONICS CO., LTD.
    Inventors: Kentaro YONEHARA, Yoshio IMAHORI, Yasunori Tsukuda, Motoaki ITO
  • Patent number: 7403631
    Abstract: The two coil spring terminals have the structure of double coil spring terminal including a small diameter coil spring terminal and a large diameter coil spring terminal. In this case, a terminal holder is provided with a clamping portion for clamping the large diameter coil spring terminal between the terminal holder and an internal circuit board. Specifically, the terminal holder is formed, in an upper end portion of its outer peripheral surface, with an annular groove which is adapted to be engaged with a small diameter portion formed in an upper end portion of the large diameter coil spring terminal. This omits fixation of the large diameter coil spring terminal to the internal circuit board, and necessity of soldering the two coil spring terminals respectively to the internal circuit board as a conventional art, enhancing mounting workability of the terminal holder.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: July 22, 2008
    Assignee: Star Micronics Co., Ltd.
    Inventors: Norihiro Sawamoto, Hiromi Yamada, Yoshio Imahori, Yasunori Tsukuda
  • Publication number: 20080130920
    Abstract: A capacitor microphone includes: a circuit substrate; a casing substrate fixed to an upper surface of the circuit substrate; a top cover substrate fixed to the upper surface; a capacitor part including a vibration film and a plate contained in the casing substrate; an impedance conversion element for converting variations in the electrostatic capacity of the capacitor part to electrical impedance; an electromagnetic shield portion electromagnetically shielding an inside of the casing substrate, the electromagnetic shield portion being formed in an outer surface of the casing substrate; a non-electromagnetic shield portion having no electromagnetic shield portion, the non-electromagnetic shield portion being formed in an outer surface of the casing substrate; and a through hole having a conductive property, the through hole being formed in the non-electromagnetic shield portion, wherein the inside of the casing substrate is shielded electromagnetically by the electromagnetic shield portion and the through hole
    Type: Application
    Filed: November 30, 2007
    Publication date: June 5, 2008
    Applicant: STAR MICRONICS CO., LTD.
    Inventors: Kentaro YONEHARA, Yasunori TSUKUDA, Norihiro SAWAMOTO
  • Publication number: 20080044043
    Abstract: A condenser microphone includes: a base frame including a containing space; a pair of substrates laminated to the base frame to close both end openings of the containing space; a condenser portion that is contained inside of the containing space; conductive layers formed on bonding surfaces of the base frame and the substrates opposed to each other; and exposed surfaces where the surfaces of a base frame main body and a substrate main body are exposed, the exposed surfaces being formed on outer peripheries of the conductive layers, wherein: the conductive layers of the base frame and the substrate are electrically connected; the exposed surfaces of the base frame main body and the substrate main body are adhered by an adhering agent; and an electric connection between the conductive layers is maintained by utilizing an adhering force of the adhering agent.
    Type: Application
    Filed: August 21, 2007
    Publication date: February 21, 2008
    Applicant: STAR MICRONICS CO., LTD
    Inventors: Kentaro YONEHARA, Norihiro SAWAMOTO, Motoaki ITO, Yasunori TSUKUDA
  • Publication number: 20080025532
    Abstract: A microphone case includes: a plastic basic frame including a space for housing an electro-acoustic transducing unit; a plastic substrate for closing an opening of the space, the plastic substrate being bonded to the basic frame; conductive layers provided on the bonding surfaces of the basic frame and the substrate respectively, the conductive layers being electrically connected to each other; and exposed portions where the surfaces of the basic frame and the substrate are exposed, wherein the basic frame and the substrate are bonded to each other in the exposed portions.
    Type: Application
    Filed: July 27, 2007
    Publication date: January 31, 2008
    Applicant: STAR MICRONICS CO., LTD
    Inventors: Kentaro Yonehara, Motoaki ITO, Norihiro SAWAMOTO, Yasunori TSUKUDA
  • Publication number: 20070058826
    Abstract: A microphone element having a diaphragm and a fixed electrode disposed opposite to each other on a silicon board having a central opening portion is mounted and fixed onto a base board having a sound hole. A perimeter-shaped side board and a cover board are mounted and fixed onto the board, thereby forming a back cavity on an upper side of the microphone element. The diaphragm and the fixed electrode are conducted to conductive layers of the cover board through conductive layers of the base board, and a conductive layer and a coiled spring in the side board respectively, and mounting on a surface of a printed board of an external apparatus can be carried out in a conductive layer on an upper surface thereof.
    Type: Application
    Filed: September 13, 2006
    Publication date: March 15, 2007
    Inventors: Norihiro Sawamoto, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito, Kentaro Yonehara
  • Publication number: 20070025570
    Abstract: A condenser microphone includes a condenser part in which a diaphragm is arranged opposed to a back plate, an impedance transformation element which transforms change in electrostatic capacitance of the condenser part into electric impedance, and a circuit which connects the condenser part and the impedance transformation element electrically. Further, the condenser microphone includes a casing which houses therein the condenser part, the impedance transformation element and the circuit, and is formed of an electric insulator. Herein, a conductive layer is provided on the periphery of the casing thereby to give electromagnetic shield ability to the casing.
    Type: Application
    Filed: August 1, 2006
    Publication date: February 1, 2007
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito
  • Publication number: 20070019829
    Abstract: By integrating plural condenser microphone constituting bodies in an array state, a condenser microphone array is obtained. The condenser microphone array is formed by dicing a laminate of a circuit board forming member, a housing forming member, a spacer forming member, diaphragm sheet, diaphragm plate forming member and a cover forming member which form a part of the plural condenser microphone constituting bodies respectively. In an air chamber of each condenser microphone constituting body constituted in the laminate, a back plate and a contact spring are built.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 25, 2007
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito
  • Publication number: 20070017077
    Abstract: A circuit board forming member, a case forming member, a spacer forming member, a diaphragm sheet and a diaphragm plate forming member are laminated to form a portion, as excepting a back plate and a contact spring, of a condenser microphone, in plurality in a laminate. Moreover, the back plate and the contact spring are arranged in the air chamber, which is defined by the individual forming members, to form a plurality of condenser microphone constituents in the laminate. Next, the laminate is cut to separate the individual condenser microphone constituents thereby to manufacture the condenser microphones.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 25, 2007
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito
  • Publication number: 20050181659
    Abstract: The two coil spring terminals have the structure of double coil spring terminal including a small diameter coil spring terminal and a large diameter coil spring terminal. In this case, a terminal holder is provided with a clamping portion for clamping the large diameter coil spring terminal between the terminal holder and an internal circuit board. Specifically, the terminal holder is formed, in an upper end portion of its outer peripheral surface, with an annular groove which is adapted to be engaged with a small diameter portion formed in an upper end portion of the large diameter coil spring terminal. This omits fixation of the large diameter coil spring terminal to the internal circuit board, and necessity of soldering the two coil spring terminals respectively to the internal circuit board as a conventional art, enhancing mounting workability of the terminal holder.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 18, 2005
    Inventors: Norihiro Sawamoto, Hiromi Yamada, Yoshio Imahori, Yasunori Tsukuda
  • Patent number: 6577743
    Abstract: An electroacoustic transducer to be mounted on a board of a device, includes an anode conductive part which is in press contact with the board of the device, and a cathode conductive part which is in press contact with the board of the device, wherein the anode conductive part and the cathode conductive part are respectively placed at an axial center position or at predetermined positions in a radial direction to eliminate directionality in a circumferential direction.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: June 10, 2003
    Assignee: Star Micronics Co., Ltd.
    Inventors: Mitsuhiro Masuda, Yasunori Tsukuda, Yoshio Imahori
  • Patent number: D546274
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: July 10, 2007
    Assignee: Star Micronics Co., Ltd.
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito
  • Patent number: D546275
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: July 10, 2007
    Assignee: Star Micronics Co., Ltd.
    Inventors: Kentaro Yonehara, Yoshio Imahori, Hiroshi Fujinami, Yasunori Tsukuda, Motoaki Ito