Patents by Inventor Yasuo Tanaka

Yasuo Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7797935
    Abstract: A hydraulic drive system is provided with a generator 8 for outputting electricity corresponding to a rotation speed of an engine 7, an electric motor 11 drivable responsive to the electricity from the generator 8, hydraulic pumps 12a, 12b drivable by the electric motor 11, truck-body elevating cylinders 6 for pivoting a truck body 5 in an up-and-down direction, and a stroke detector 14 for detecting a stroke of the control apparatus of the truck-body elevating cylinders 6, and is also provided with a controller 19 for performing control of engine rotation speed. The controller 19 includes a motor electric-power computing means 19a for determining electric power for the electric motor 11, which corresponds to the stroke detected by the stroke detector 14, and a discrimination means 19b for discriminating whether or not the electricity from the generator 8 has become greater than the thus-determined electric power for the electric motor 1.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: September 21, 2010
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Tomohiko Yasuda, Takashi Yagyu, Yasuo Tanaka, Michio Fushiki, Satoru Kaneko
  • Publication number: 20100222951
    Abstract: Engine driving characteristics are achieved for driving a hydraulic system during non-traveling and traveling in an electrically driven dump truck. When a shift lever 16 is located at a neutral position, the target revolution speed Nr1 corresponding to the operation amount (p) of an accelerator pedal 1 is calculated on the basis of first target revolution speed characteristics (Nr1(p)) which are suitable for driving of a hydraulic pump for working so that an electronic governor 4a is controlled on the basis of this target revolution speed. When the shift lever 16 is located at a forward position, the target revolution speed Nr2 corresponding to the operation amount of the accelerator pedal 1 is calculated on the basis of second target revolution speed characteristics (Nr2(p)) which are suitable for driving of electric motors 12R, 12L so that the electronic governor 4a is controlled on the basis of this target revolution speed.
    Type: Application
    Filed: May 7, 2007
    Publication date: September 2, 2010
    Applicant: HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Yasuo Tanaka, Yutaka Watanabe, Kichio Nakajima, Tomohiko Yasuda, Takashi Yagyu
  • Publication number: 20100221197
    Abstract: A novel antimicrobial agent which has a high degree of safety, an excellent compounding property and strong antimicrobial activity is provided. The antimicrobial agent is characterized by containing ricinoleic acid monoglyceride or diglycerine ricinoleic acid monoester as an active ingredient. The antimicrobial agent of the present invention is suitable as a compounding component of an antimicrobial object selected from a food product, a food packaging material, tableware, a perfume cosmetic, a cosmetic, an external preparation for skin, a skin washing agent, a disinfectant, a lotion for external use, an agent for hair, a wiping sterilization agent, a pharmaceutical, a quasi drug and a hygiene material for the oral cavity.
    Type: Application
    Filed: August 22, 2008
    Publication date: September 2, 2010
    Applicant: TAIYO CORPORATION
    Inventors: Yasuo Tanaka, Shuji Kanatani
  • Patent number: 7788221
    Abstract: An electronic file conversion program that causes a computer to perform a function including: converting a description format of an electronic file stored in a memory; detecting, from the memory, an electronic file of which description format is to be converted; and controlling to store in the memory, the electronic file of which description format is converted.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: August 31, 2010
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Yasuo Tanaka
  • Patent number: 7767553
    Abstract: Conductive ink is printed onto a wafer held on a vertically movable stage by using a squeegee to force the conductive ink through a stencil. The stencil is supported from below by a supporting member adjacent to the periphery of the stage. After the conductive ink has been printed through the stencil, pneumatic pressure is applied to the stencil from above, and the stage is lowered to separate the wafer from the stencil. The supporting member holds the stencil taut while the stage is being lowered, so that the stencil does not warp downward and the printed conductive ink leaves the stencil at substantially the same time at all points on the wafer surface, preventing the premature escape of air and loss of pneumatic pressure.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: August 3, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Yasuo Tanaka
  • Patent number: 7740323
    Abstract: In a hydraulic drive device for vertical pivoting movement of a load carrying platform, a first directional control valve has only three switchover positions, including a neutral position relating to operation of stopping and holding a load carrying platform, a switching position relating to operation of lifting the load carrying platform, and a switch over position relating to operation of forced lowering of the load carrying platform. A second directional control valve has only three switchover positions, including a neutral position, a switching position, and a switchover position relating to operation of allowing the load carrying platform to fall by its own weight. The device includes a first on-off valve, a second on-off valve, and a third on-off valve that are proportional control solenoid valves for switching an appropriate one of the first and second directional control valves.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: June 22, 2010
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Satoru Kaneko, Tomohiko Yasuda, Takashi Yagyu, Yasuo Tanaka, Michio Fushiki
  • Patent number: 7704801
    Abstract: A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected to respective one surface electrodes, and a resin shield covering the main surface, the surface electrodes and side surfaces of the projection electrodes, the resin having a thermal expansion coefficient in the range of 8-10 ppm/° C. and a Young's modulus in the range of 1.8-2.0 Gpa.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: April 27, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Shinji Ohuchi, Yasuo Tanaka
  • Patent number: 7696009
    Abstract: A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and scribe lines which are arranged between the device areas. After the heat spreading material is formed on rear surface of the semiconductor wafer, the semiconductor wafer is separated at the scribe lines.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: April 13, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Makoto Terui, Yasuo Tanaka, Takashi Noguchi
  • Patent number: 7601051
    Abstract: A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit is created between the adjacent grindstones, wherein both of the adjacent grindstones is arranged to make contact with an edge of the workpiece while grinding the workpiece.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: October 13, 2009
    Assignee: Oki Semiconductor Co., Ltd
    Inventor: Yasuo Tanaka
  • Publication number: 20090251090
    Abstract: A drive system for an electrically driven dump truck is capable of preventing a prime mover from stalling and is also capable of enabling electric motors for traveling to make full use of the output horsepower of the prime mover up to an output limit of the prime mover. The target motor horsepower Mr1 corresponding to the operation amount p of an accelerator pedal 1 is calculated and the available maximum horsepower Mr2 for motors 12R, 12L out of the maximum output horsepower of the prime mover 4, is calculated in response to the actual revolution speed Ne of the prime mover 4. The horsepower coefficient Kp corresponding to the instantaneous revolution speed deviation ?N is calculated. The available maximum horsepower for the electric motors is modified by the horsepower coefficient to determine the second target motor horsepower Mr3.
    Type: Application
    Filed: May 7, 2007
    Publication date: October 8, 2009
    Inventors: Yasuo Tanaka, Tomohiko Yasuda, Takashi Yagyu, Yutaka Watanabe
  • Patent number: 7547624
    Abstract: A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a resin layer. The method further includes the steps of polishing the resin layer until an upper surface of the protrusion electrode is exposed; polishing the exposed upper surface of the protrusion electrode; and forming a solder terminal on the polished upper surface of the protrusion electrode.
    Type: Grant
    Filed: January 11, 2007
    Date of Patent: June 16, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Yasuo Tanaka
  • Publication number: 20090145121
    Abstract: [OBJECT] To provide a hydraulic drive system for a dump truck, which can prevent an excessive increase in engine rotation speed upon operation of a truck body. [MEANS FOR ACHIEVING THE OBJECT] A hydraulic drive system is provided with a generator 8 for outputting electricity corresponding to a rotation speed of an engine 7, an electric motor 11 drivable responsive to the electricity from the generator 8, hydraulic pumps 12a, 12b drivable by the electric motor 11, truck-body elevating cylinders 6 for pivoting a truck body 5 in an up-and-down direction, and a stroke detector 14 for detecting a stroke of the control apparatus of the truck-body elevating cylinders 6, and is also provided with a controller 19 for performing control of engine rotation speed.
    Type: Application
    Filed: August 22, 2006
    Publication date: June 11, 2009
    Applicant: Hitachi Construction Machinery Co., Ltd.
    Inventors: Tomohiko Yasuda, Takashi Yagyu, Yasuo Tanaka, Michio Fushiki, Satoru Kaneko
  • Publication number: 20090132116
    Abstract: A drive system of an electrically driven dump truck that includes a prime mover, an electric generator, electric motors for traveling, each of which is driven by the electric power supplied from the electric generator 5 and inverters for controlling the electric motors, respectively. A total control unit calculates a correction coefficient Kp in response to the hydraulic fluid temperature detected by a thermometer 20, and then subtracts the horsepower g(Ne) for driving the other prime mover loads, which have been corrected by use of the correction coefficient Kp, from the maximum output horsepower f(Ne) of the prime mover to determine the maximum horsepower Mr that can be used by the electric motors An inverter control unit 7 determines a target torque of the electric motors on the basis of the maximum horsepower Mr so that the inverters are controlled respectively.
    Type: Application
    Filed: May 18, 2007
    Publication date: May 21, 2009
    Inventors: Yasuo Tanaka, Tomohiko Yasuda, Takashi Yagyu, Yutaka Watanabe
  • Patent number: 7529837
    Abstract: The present invention provides a device for changing instruction description. The device includes: a receiving unit that receives an instruction description instructing a processing to be executed by an executing unit and a location of the executing unit; a judging unit that judges whether or not the location instructed by the instruction description indicates a location of a predetermined utilizable executing unit; and a changing unit that changes the location instructed by the instruction description to the location of the predetermined utilizable executing unit which can execute the processing instructed by the instruction description, when the location instructed by the instruction description is not judged to indicate the location of the predetermined utilizable executing unit.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: May 5, 2009
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Tadao Michimura, Yasuo Tanaka, Tomonari Yamauchi
  • Publication number: 20090102273
    Abstract: [Problems] To simplify switching control of a directional control valve and to simplify the structure of a directional control valve for controlling operation of a hoist cylinder. [Means for Solving Problems] In a hydraulic drive device for vertical pivoting movement of a load carrying platform, a first directional control valve (10) has only three switchover positions that are a neutral position (10A) relating to operation of stopping and holding a load carrying platform, a switching position (10B) relating to operation of lifting the load carrying platform, and a switch over position (10C) relating to operation of forced lowering of the load carrying platform.
    Type: Application
    Filed: August 30, 2006
    Publication date: April 23, 2009
    Inventors: Satoru Kaneko, Tomohiko Yasuda, Takashi Yagyu, Yasuo Tanaka, Michio Fushiki
  • Publication number: 20090085216
    Abstract: The present invention provides a semiconductor device excellent in the reliability of connection between the semiconductor device and a mounting board. The semiconductor device has external connecting terminals. Each of the external connecting terminals includes a Cu electrode, intermetallic compounds containing Cu, each formed over the Cu electrode, stopper portions which cover surfaces of the intermetallic compounds at intervals, and a solder alloy comprising Bi and an impurity containing Sn formed over the stopper portions and the intermetallic compounds.
    Type: Application
    Filed: July 18, 2008
    Publication date: April 2, 2009
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventors: Yasuo Tanaka, Yoshifumi Sakamoto
  • Publication number: 20090048064
    Abstract: A drive system of an electrically driven dump truck is capable of achieving an operational feeling in which the operation amount of the accelerator pedal is well balanced with the output horsepower of the electric motors, particularly at the time of slow traveling. To achieve this, the target motor output horsepower Pm0 corresponding to the operation amount of an accelerator pedal 1 is calculated. The target motor torque Tr1R, Tr1L is calculated on the basis of the target motor output horsepower Pm0 and the rotational speed ?R, ?L of electric motors 12R, 12L respectively. The acceleration torque limit values of the electric motors 12R, 12L corresponding to the operation amount of the accelerator pedal 1 are calculated, respectively. Then, smaller values are selected, as motor torque instruction values TrR, TrL, between the acceleration torque limit value and the target motor torque Tr1R, Tr1L to control inverters 73R, 73L, respectively.
    Type: Application
    Filed: May 7, 2007
    Publication date: February 19, 2009
    Inventors: Yasuo Tanaka, Tomohiko Yasuda, Takashi Yagyu, Yutaka Watanabe
  • Publication number: 20090017610
    Abstract: The present invention provides a semiconductor device which comprises a terminal pad (120) formed on an underlying base (105), solder (240), and a reactive product (260) comprising a component of the terminal pad and a Zn system material (230), which is formed between the terminal pad and the solder.
    Type: Application
    Filed: September 8, 2008
    Publication date: January 15, 2009
    Inventor: Yasuo Tanaka
  • Patent number: 7436073
    Abstract: A junction structure, and a semiconductor device including the same, for a junction of a terminal pad and solder, including an underlying base on which said terminal pad is formed; a nickel layer disposed on the terminal pad; a palladium layer or a gold layer disposed on the nickel layer; the solder; and a zinc system material layer provided between the palladium layer or the gold layer and the solder. The terminal pad and the solder may be provided in a semiconductor device in which the terminal pad lies inside the semiconductor device, and the zinc system material layer is formed between the terminal pad and the solder. The terminal pad may be provided over a substrate, the solder may be provided in the semiconductor device, and the zinc system material layer is then formed between the terminal pad of the substrate and the solder of the semiconductor device.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: October 14, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Yasuo Tanaka
  • Patent number: 7405138
    Abstract: A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part if wiring 104 is formed al so at the side surface of a semiconducter element 101, and bump electrodes 102 formed so as to be nearly on a same plane as the wiring 104 formed at the side surface of the semiconducter element 101, at least a part of ball electrodes 103 is formed so as to connect electrically to the wiring 104 at the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring 104, and the confronting surface of the circuit forming surface is sealed with resin.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: July 29, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shinji Ohuchi, Yasushi Shiraishi, Yasuo Tanaka