Patents by Inventor Yasuo Tanaka

Yasuo Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleaning device and image forming apparatus having a cleaning brush and a collection roller that move in the same direction at a contact area therebetween
    Patent number: 7389061
    Abstract: A secondary cleaning device has a cleaning brush, collection roller, and controller. The cleaning brush is driven by a drive mechanism and thereby rotates in a state that brush fibers thereof are contacting with a secondary transfer belt to collect toner on the secondary transfer belt. The collection roller is driven by another drive mechanism and thereby rotates in a state contacting with the cleaning brush to collect toner from the cleaning brush. The collection roller rotates in such a manner that the collection roller and the cleaning brush move in the same direction with each other at a contact area between the collection roller and the cleaning brush. The controller controls the drive mechanism such that the circumferential speed ratio of the collection roller with respect to the cleaning brush is greater than one and smaller than two.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: June 17, 2008
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Hideo Yamaki, Yasunori Nakayama, Hidetoshi Noguchi, Satoru Shibuya, Tomohide Mori, Yasuo Tanaka, Hideji Higashimura
  • Semiconductor device with reduced thickness of the semiconductor substrate
    Patent number: 7388297
    Abstract: A semiconductor device includes a silicon substrate having first and second surfaces, in which a wiring pattern is formed on the first surface; a first resin layer formed over the first surface of the silicon substrate; and a second resin layer formed over the second surface of the silicon substrate. The silicon substrate has a thickness less than 150 ?m, and each of the first and second resin layers has a thickness larger than that of the silicon substrate.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: June 17, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Yasuo Tanaka
  • Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine
    Publication number: 20080139090
    Abstract: A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit is created between the adjacent grindstones, wherein both of the adjacent grindstones is arranged to make contact with an edge of the workpiece while grinding the workpiece.
    Type: Application
    Filed: October 3, 2007
    Publication date: June 12, 2008
    Inventor: Yasuo TANAKA
  • Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device
    Publication number: 20080124843
    Abstract: A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected to respective one surface electrodes, and a resin shield covering the main surface, the surface electrodes and side surfaces of the projection electrodes, the resin having a thermal expansion coefficient in the range of 8-10 ppm/° C. and a Young's modulus in the range of 1.8-2.0 Gpa.
    Type: Application
    Filed: January 16, 2008
    Publication date: May 29, 2008
    Inventors: Shinji Ohuchi, Yasuo Tanaka
  • Method for fabricating resin-molded semiconductor device having posts with bumps
    Publication number: 20080070348
    Abstract: A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.
    Type: Application
    Filed: October 29, 2007
    Publication date: March 20, 2008
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventors: Shinji Ohuchi, Yasushi Shiraishi, Yasuo Tanaka
  • Electronic file conversion program, electronic file conversion apparatus, electronic file conversion system, computer data signal, and electronic conversion method
    Publication number: 20080030759
    Abstract: An electronic file conversion program that causes a computer to perform a function including: converting a description format of an electronic file stored in a memory; detecting, from the memory, an electronic file of which description format is to be converted; and controlling to store in the memory, the electronic file of which description format is converted.
    Type: Application
    Filed: December 5, 2006
    Publication date: February 7, 2008
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Yasuo Tanaka
  • Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction
    Publication number: 20080012131
    Abstract: A semiconductor pellet is mounted on a circuit board. The pellet has a first terminal pad and a first solder layer formed on the first terminal pad. The circuit board has a second terminal pad and a second solder layer formed on the second terminal pad. A metal ball is positioned between the first and the second solder layers such that when the solder layers are reflowed, an intermetallic compound is formed between the metal ball and the first terminal pad and between the ball and the second terminal pad, the intermetallic compound including a thickness not more than 10 ?m in areas in which said metal ball is closest to the second terminal pad and to the first terminal. The metal ball has a surface neither in contact with the first solder layer nor the second solder layer.
    Type: Application
    Filed: March 19, 2007
    Publication date: January 17, 2008
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD
    Inventor: Yasuo Tanaka
  • Resin-molded semiconductor device having posts with bumps and method for fabricating the same
    Patent number: 7307337
    Abstract: A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: December 11, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shinji Ohuchi, Yasushi Shiraishi, Yasuo Tanaka
  • Semiconductor device and method of producing the same
    Publication number: 20070238289
    Abstract: A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a resin layer. The method further includes the steps of polishing the resin layer until an upper surface of the protrusion electrode is exposed; polishing the exposed upper surface of the protrusion electrode; and forming a solder terminal on the polished upper surface of the protrusion electrode.
    Type: Application
    Filed: January 11, 2007
    Publication date: October 11, 2007
    Inventor: Yasuo Tanaka
  • Semiconductor device and method for manufacturing the semiconductor device
    Publication number: 20070190908
    Abstract: A method is used for manufacturing a semiconductor device including a circuit-fabricated side on which an encapsulation layer is formed. The method includes the following steps. A semiconductor wafer is placed on the suction surface of a suction stage, the suction surface having a diameter in the range of 99 to 100.5% of a diameter of the semiconductor wafer. The semiconductor wafer is held on the suction surface of the suction stage by suction. A back surface of the semiconductor wafer is ground. The back surface of the semiconductor wafer is ground such that a surface roughness of the ground back surface is not greater than 5 nm. The encapsulation layer has a flexural modulus not smaller than 12 Gpa and not larger than 18 Gpa.
    Type: Application
    Filed: December 22, 2006
    Publication date: August 16, 2007
    Inventor: Yasuo Tanaka
  • Resin composite copper foil, printed wiring board, and production processes thereof
    Publication number: 20070172674
    Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
    Type: Application
    Filed: January 25, 2007
    Publication date: July 26, 2007
    Inventors: Mitsuru Nozaki, Morio Gaku, Yasuo Tanaka, Eiji Nagata, Yasuo Kikuchi, Masashi Yano
  • Junction structure of terminal pad and solder, semiconductor device having the junction structure, and method of manufacturing the semiconductor device
    Publication number: 20070096339
    Abstract: The present invention provides a semiconductor device which comprises a terminal pad (120) formed on an underlying base (105), solder (240), and a reactive product (260) comprising a component of the terminal pad and a Zn system material (230), which is formed between the terminal pad and the solder.
    Type: Application
    Filed: September 20, 2006
    Publication date: May 3, 2007
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventor: Yasuo Tanaka
  • Semiconductor device and method for fabricating the same
    Publication number: 20070045793
    Abstract: A semiconductor device includes a silicon substrate having first and second surfaces, in which a wiring pattern is formed on the first surface; a first resin layer formed over the first surface of the silicon substrate; and a second resin layer formed over the second surface of the silicon substrate. The silicon substrate has a thickness less than 150 ?m, and each of the first and second resin layers has a thickness larger than that of the silicon substrate.
    Type: Application
    Filed: August 26, 2005
    Publication date: March 1, 2007
    Inventor: Yasuo Tanaka
  • Clamp device for pipe or similar component
    Patent number: 7172162
    Abstract: A clamp device for mounting elongated components such as pipes on a support such as a car body comprises a first clamp to be mounted on the support and a second clamp to be mounted in a recess in the first clamp. The clamp device is constructed to permit limited transverse movement of the second clamp in the recess, to accommodate bending or curving of elongated components held by the second clamp. The first clamp may also hold elongated components.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: February 6, 2007
    Assignees: Newfrey LLC, Honda Motor Co., Ltd.
    Inventors: Suguru Mizukoshi, Tomio Shibuya, Yasuo Tanaka, Shunya Jinnai, Masato Kanbe
  • Method for modifying surface of substrate and method for manufacturing semiconductor device
    Publication number: 20070020946
    Abstract: An insulating film is formed on a substrate selected from a group containing a BT resin substrate and an epoxy resin substrate. Copper wirings and copper posts including wirings are formed on the insulating film. Plasma processing is effected on exposed surfaces of the insulating film, copper wirings and copper posts provided over the semiconductor substrate, using nitrogen-type gas. An encapsulating portion is formed which covers and seals the exposed surfaces.
    Type: Application
    Filed: June 27, 2006
    Publication date: January 25, 2007
    Inventor: Yasuo Tanaka
  • Process for the production of high-density printed wiring board
    Patent number: 7140103
    Abstract: Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 ?m or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 ?m thickness, forming an electrolytic copper plating layer of 0.5 to 3 ?m thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 ?m thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: November 28, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Morio Gaku, Nobuyuk Ikeguchi, Katsuji Komatsu, Yasuo Tanaka, Keiichi Iwata, Ken-ichi Shimizu
  • Method for fabricating a semiconductor device having a heat radiation layer
    Publication number: 20060246625
    Abstract: A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and scribe lines which are arranged between the device areas. After the heat spreading material is formed on rear surface of the semiconductor wafer, the semiconductor wafer is separated at the scribe lines.
    Type: Application
    Filed: June 21, 2006
    Publication date: November 2, 2006
    Inventors: Makoto Terui, Yasuo Tanaka, Takashi Noguchi
  • Cleaning device for collecting toner on a surface of an image forming apparatus
    Patent number: 7127191
    Abstract: A cleaning device is provided with a conductive fur brush kept in contact with a transfer belt, a conductive brush kept in contact with the transfer belt upstream of the fur brush in the feed direction, and a single of constant-current d.c. power supply. The fur brush is connected to the constant-current d.c. power supply, and the conductive brush is grounded. A current flows from the constant-current d.c. power supply via the transfer belt to the conductive brush.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: October 24, 2006
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Tomohide Mori, Hidetoshi Noguchi, Hideo Yamaki, Yasunori Nakayama, Yasuo Tanaka, Satoru Shibuya, Hideji Higashimura
  • Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing
    Patent number: 7078265
    Abstract: A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and scribe lines which are arranged between the device areas. After the heat spreading material is formed on rear surface of the semiconductor wafer, the semiconductor wafer is separated at the scribe lines.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: July 18, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Makoto Terui, Yasuo Tanaka, Takashi Noguchi
  • Projection tube having different neck diameters
    Patent number: 7075221
    Abstract: The present invention aims at maintaining the high focusing performance at a low deflection power in a single-beam projection tube which is used as a projection type TV receiver or a projector and is operated at a high voltage and with a high current. The neck outer diameter of a portion on which a deflection yoke is mounted is made smaller than the neck outer diameter of a portion which accommodates an electron gun.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: July 11, 2006
    Assignees: Hitachi, Ltd., Hitachi Electronic Devices, Ltd. Co.
    Inventors: Kouichi Saitou, Kazumasa Hirai, Tetsuo Asano, Kotaro Aoki, Yasuo Tanaka