Patents by Inventor Yasutoshi Hideshima

Yasutoshi Hideshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091851
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Patent number: 11878345
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: January 23, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shunsuke Uchizono, Setsuya Iwashita, Yasutoshi Hideshima, Fumiya Maeda, Koichi Ozaki, Tadao Fukuta
  • Patent number: 11865609
    Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 9, 2024
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Makoto Kato
  • Patent number: 11866808
    Abstract: A method for manufacturing a thixomolding material for thixomolding includes a drying step of heating a mixture containing a first powder that contains Mg as a main component, a second powder, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 9, 2024
    Assignee: Seiko Epson Corporation
    Inventors: Yasutoshi Hideshima, Hidefumi Nakamura, Makoto Kato
  • Publication number: 20230226757
    Abstract: A method of manufacturing a three-dimensional shaped object includes: a powder layer forming step of leveling a Fe-based metal powder to form a powder layer; a binder applying step of applying a binder solution to a formation region of the powder layer corresponding to a laminate-shaped body to be formed; an ink applying step of applying an ink containing carbon particles to the formation region such that an amount of the carbon particles supplied to the formation region is partially varied; a repeating step of, when the formation region to which the binder solution and the ink are applied is set as a unit layer, obtaining the laminate-shaped body in which a plurality of the unit layers are laminated; a sintering step of performing a sintering treatment on the laminate-shaped body to obtain a metal sintered body; and a quenching step of performing a quenching treatment to obtain a three-dimensional shaped object.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 20, 2023
    Inventors: Yasutoshi HIDESHIMA, Hidefumi NAKAMURA
  • Publication number: 20230201915
    Abstract: A thixomolding material includes: a metal body containing magnesium(Mg) as a primary component; a plurality of coating particles provided at a front surface of the metal body and having an average particle diameter equal to or less than 100 ?m, the plurality of coating particles being made of an inorganic material differing from the metal body; and an interposed particle interposed between the metal body and the coating particles and having an average particle diameter smaller than the coating particle, the interposed particle being made of an inorganic oxide.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 29, 2023
    Inventors: Shunsuke UCHIZONO, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Tetsuhiko TAKEUCHI, Fumiya MAEDA
  • Patent number: 11548066
    Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 10, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Hidefumi Nakamura
  • Publication number: 20220314314
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Yasutoshi HIDESHIMA, Setsuya IWASHITA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220316070
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains Si particles containing Si as a main component. An average particle diameter of the Si particles is 1 ?m or more and 100 ?m or less, and a mass fraction of the Si particles in a total mass of the metal body and the Si particles is 1.0 mass % or more and 30.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220314315
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220316035
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiO2 particles containing SiO2 as a main component. An average particle diameter of the SiO2 particles is less than 20.0 ?m, and a mass fraction of the SiO2 particles in a total mass of the metal body and the SiO2 particles is 1.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Patent number: 11420371
    Abstract: The material plasticizing device includes a rotor having a material introduction portion open on an outer peripheral side surface, and a groove forming surface on which a scroll groove kneading a material introduced from the material introduction portion is formed; a case that surrounds an outer periphery of the groove forming surface; a facing portion having a facing surface that faces the groove forming surface, a heater that heats the material in the scroll groove, and a communication hole through which the material plasticized by a heat of the heater flows; and a material supply source that stores the material, in which a coupling pipeline is formed in the case, a material supply path is formed by the case and the outer peripheral side surface of the rotor, and the material flows into the material introduction portion through the coupling pipeline and the material supply path.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: August 23, 2022
    Inventor: Yasutoshi Hideshima
  • Patent number: 11235391
    Abstract: A device for manufacturing a three-dimensional shaped object includes a table on which a layer of granulated powder is stacked, a layer formation portion that forms the granulated powder on the table into a layer having a predetermined thickness, a compression unit configured to compress the layer to crush the granulated powder in a formation region of a three-dimensional shaped object in the layer, and a binder applying unit that forms a shape of the three-dimensional shaped object by applying the binder to only a region corresponding to the surface region of the three-dimensional shaped object, in the formation region in the layer.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: February 1, 2022
    Inventor: Yasutoshi Hideshima
  • Patent number: 11230059
    Abstract: A plasticizing device includes a rotor having a rotation shaft and a groove-formed surface that includes a groove formed in the rotation direction and that inclined from the rotation shaft in a radial direction with respect to a radial direction orthogonal to the center axis, a facing unit having a facing surface inclined so as to face the groove-formed surface in the radial direction, a heater heating a material to be supplied between the facing surface and the rotor, and a communication hole through which the material plasticized by heat of the heater flows, a drive motor generating rotational driving force, a connection unit fitting to the rotor in a direction along a rotation shaft of the drive motor, connecting the rotation shaft of the drive motor and the rotor to each other, and transmitting the rotational driving force of the drive motor to the rotor, and an elastic member disposed between the rotor and the connection unit.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: January 25, 2022
    Inventor: Yasutoshi Hideshima
  • Patent number: 11148197
    Abstract: A raw material for thixomolding includes a magnesium-based alloy powder which contains calcium in an amount of 0.2 mass % or more and 5 mass % or less and aluminum in an amount of 2.5 mass % or more and 12 mass % or less, wherein the magnesium-based alloy powder includes an oxide layer which has an average thickness of 30 nm or more and 100 nm or less and contains at least one of calcium and aluminum as an outermost layer. The average dendrite secondary arm spacing of crystal structures of the magnesium-based alloy powder is preferably 5 ?m or less.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: October 19, 2021
    Inventors: Yasutoshi Hideshima, Hidefumi Nakamura, Hiroyoshi Otaka
  • Publication number: 20210291265
    Abstract: A method for manufacturing a thixomolding material for thixomolding includes a drying step of heating a mixture containing a first powder that contains Mg as a main component, a second powder, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Yasutoshi HIDESHIMA, Hidefumi NAKAMURA, Makoto KATO
  • Publication number: 20210291266
    Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Koichi OZAKI, Tadao FUKUTA, Yasutoshi HIDESHIMA, Makoto KATO
  • Publication number: 20210291262
    Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Koichi OZAKI, Tadao FUKUTA, Yasutoshi HIDESHIMA, Hidefumi NAKAMURA
  • Publication number: 20200198011
    Abstract: A method for manufacturing a three-dimensional shaped object by laminating a layer to manufacture the three-dimensional shaped object, the method including a layer forming step of forming the layer using a constituent material containing amorphous metal powder and a melting and solidifying step of irradiating the layer with a laser to melt and solidify the amorphous metal powder, in which in the melting and solidifying step, a melted and solidified portion obtained by melting and solidifying the amorphous metal powder by being irradiated with the laser is formed and irradiation of the laser is repeated so that at least one-half of a width of the melted and solidified portion overlaps, thereby allowing the layer to become a metal layer in which an amorphous region and a crystal region are formed in a mesh shape.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 25, 2020
    Inventors: Yasutoshi HIDESHIMA, Takeshi MIYASHITA
  • Patent number: 10682697
    Abstract: A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles whose constituent material is different from that of the first metal particles. It is preferred that in the secondary particles, the first metal particles are bound to one another through the binder. It is also preferred that the average particle diameter of the second metal particles is smaller than that of the first metal particles.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: June 16, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Hidefumi Nakamura, Yasutoshi Hideshima