Abstract: According to one embodiment, a memory system includes a semiconductor memory device including a memory cell capable of holding at least 4-bit data and a controller configured to control a first write operation and a second write operation based on the 4-bit data. The controller includes a conversion circuit configured to convert 4-bit data into 2-bit data. The semiconductor memory device includes a recovery controller configured to recover the 4-bit data based on the converted 2-bit data and data written in the memory cell by the first write operation. The first write operation is executed based on the 4-bit data received from the controller, and the second write operation is executed based on the 4-bit data recovered by the recovery controller.

Abstract: This vehicle body substructure includes side sill load transmitting members that are provided inside each of side sills, a floor cross-member that is provided on one of an upper surface and a lower surface of a floor panel laid between the side sills and has extending portions extending toward upper portions of the side sill load transmitting members, an underfloor mounting component that is provided below the floor panel and includes an underfloor cross-member, underfloor frames that are attached to lower portions of the underfloor mounting component and the side sills, and underfloor load transmitting members that are provided in the underfloor frames and face the underfloor cross-member. The underfloor load transmitting member has an upper half portion which faces a lower portion of the side sill load transmitting members, and a lower half portion which is fixed to a part of each of the underfloor frames attached to a lower portion of each of the side sills.

Abstract: This vehicle body substructure includes side sill load transmitting members that are provided inside each of side sills, a floor cross-member that is provided on one of an upper surface and a lower surface of a floor panel laid between the side sills and has extending portions extending toward upper portions of the side sill load transmitting members, an underfloor mounting component that is provided below the floor panel and includes an underfloor cross-member, underfloor frames that are attached to lower portions of the underfloor mounting component and the side sills, and underfloor load transmitting members that are provided in the underfloor frames and face the underfloor cross-member. The underfloor load transmitting member has an upper half portion which faces a lower portion of the side sill load transmitting members, and a lower half portion which is fixed to a part of each of the underfloor frames attached to a lower portion of each of the side sills.

Abstract: A semiconductor light emitting element includes a structure in which a first clad layer having a first conductivity type, an active layer in which a quantum well layer is enclosed between barrier layers, and a second clad layer having a second conductivity type opposite to the first conductivity type are sequentially laminated on at least a substrate, wherein the quantum well layer is constituted by an In-based compound semiconductor that does not contain Al, and the active layer contains a higher concentration of Al than at least the barrier layer in an interface between the quantum well layer and the barrier layer where changing from the quantum well layer to the barrier layer when seen from a side of the substrate.

Abstract: A body structure includes: a bumper beam extending in the vehicle width direction; a pair of front side frames separated from each other in the vehicle width direction; and a pair of bumper beam extensions provided between respective front ends of the pair of front side frames and the bumper beam. The bumper beam is connected to the pair of bumper beam extensions at positions lower than respective upper walls of the pair of front side frames; and each of front portions of the pair of bumper beam extensions includes a connection portion to which a rear wall of the bumper beam is connected, and an extension portion provided above the connection portion and extending toward the vehicle front above the bumper beam.

Abstract: In a semiconductor light-emitting device including a semiconductor body including light-emitting elements arranged in a matrix, and a support body adapted to support the semiconductor body, the semiconductor body further includes a plurality of optical shield layers each provided at one of a first side face of a first one of the light-emitting elements and a second side face of a second one of the light-emitting elements opposing the first side face of the first light-emitting element.

Abstract: A body structure includes: a bumper beam extending in the vehicle width direction; a pair of front side frames separated from each other in the vehicle width direction; and a pair of bumper beam extensions provided between respective front ends of the pair of front side frames and the bumper beam. The bumper beam is connected to the pair of bumper beam extensions at positions lower than respective upper walls of the pair of front side frames; and each of front portions of the pair of bumper beam extensions includes a connection portion to which a rear wall of the bumper beam is connected, and an extension portion provided above the connection portion and extending toward the vehicle front above the bumper beam.

Abstract: A lightening apparatus includes light-emitting elements arranged in a matrix. One of the light-emitting elements is located at each intersection between at least two first reference voltage lines and “n” first drive voltage lines. A first reference voltage driver time-divisionally switches the first reference voltage lines. A first drive voltage driver supplies first luminous drive voltages to the first drive voltage lines. One of the light-emitting elements is located at each intersection between at least one second reference voltage line and “n” second drive voltage lines. A second reference voltage driver switches the second reference voltage line. A second drive voltage driver supplies second luminous drive voltages to the second drive voltage lines.

Abstract: The stiffness in supporting an electric motor is increased in an electric motor mounting structure for mounting an electric motor for driving the wheels on the vehicle body. In an electric motor mounting structure for mounting an electric motor (60) for driving a wheel on a vehicle body (1) formed by combining a plurality of frame members, the electric motor is mounted on one of the frame members (front middle cross member) (43) via a first mount member (front mount member) (71), the one frame member is provided with a receiving hole (101), and at least a part of the first mount member projects into the receiving hole.

Abstract: The stiffness in supporting an electric motor is increased in an electric motor mounting structure for mounting an electric motor for driving the wheels on the vehicle body. In an electric motor mounting structure for mounting an electric motor (60) for driving a wheel on a vehicle body (1) formed by combining a plurality of frame members, the electric motor is mounted on one of the frame members (front middle cross member) (43) via a first mount member (front mount member) (71), the one frame member is provided with a receiving hole (101), and at least a part of the first mount member projects into the receiving hole.

Abstract: In a vehicle front structure, without increasing the thickness of the material of a damper housing structure and reinforcement portions, an adequate mechanical strength in supporting the damper can be ensured, and the cost of the manufacturing facilities can be minimized. The damper housing structure is formed by a damper base, a damper housing main body, a front reinforcement portion and a rear reinforcement portion, and the damper base. Each of the damper housing main body, the front reinforcement portion and the rear reinforcement portion includes a closed cross section portion extending linearly with a same cross section.

Abstract: Some embodiments are directed to a vehicular energy management apparatus that includes a lower frame that defines a raised portion disposed longitudinally between a vehicular power source and fuel system components. The raised portion can include an inclined portion defining an acute angle relative to the longitudinal direction, and disposed to guide movement of the power source upwardly in a direction perpendicular to the longitudinal direction and away from the components of the fuel system upon movement of the power source in the longitudinal direction. A mount assembly that mounts the power source to the lower frame is configured to fail and thereby detach the power source from the lower frame upon application of a predetermined threshold impact energy being transmitted to the power source, thereby enabling the power source to move in the longitudinal direction and resulting in dissipation of at least a portion of the impact energy.

Abstract: A semiconductor light-emitting device, and a method for manufacturing the semiconductor light-emitting device, in which light propagating through a light-emitting layer and reaching an edge surface of a semiconductor film can be extracted to the exterior in an efficient manner. The semiconductor light-emitting device comprises a semiconductor film including a light-emitting layer made from a group III nitride semiconductor. The semiconductor film has a tapered edge surface inclined diagonally with respect to a light extraction surface. The light extraction surface has a relief structure comprising a plurality of protrusions having a shape originating from the crystal structure of the semiconductor film. The average size of the protrusions in a first region in the vicinity of an edge section of the light extraction surface is smaller than the average size of the protrusions in a second region.

Abstract: In a vehicle front structure, without increasing the thickness of the material of a damper housing structure and reinforcement portions, an adequate mechanical strength in supporting the damper can be ensured, and the cost of the manufacturing facilities can be minimized. The damper housing structure is formed by a damper base, a damper housing main body, a front reinforcement portion and a rear reinforcement portion, and the damper base. Each of the damper housing main body, the front reinforcement portion and the rear reinforcement portion includes a closed cross section portion extending linearly with a same cross section.

Abstract: In a semiconductor light-emitting device including a semiconductor body including light-emitting elements arranged in a matrix, and a support body adapted to support the semiconductor body, the semiconductor body further includes a plurality of optical shield layers each provided at one of a first side face of a first one of the light-emitting elements and a second side face of a second one of the light-emitting elements opposing the first side face of the first light-emitting element.

Abstract: A lightening apparatus includes light-emitting elements arranged in a matrix. One of the light-emitting elements is located at each intersection between at least two first reference voltage lines and “m” first drive voltage lines. A first reference voltage driver time-divisionally switches the first reference voltage lines. A first drive voltage driver supplies first luminous drive voltages to the first drive voltage lines. One of the light-emitting elements is located at each intersection between at least one second reference voltage line and “m” second drive voltage lines. A second reference voltage driver switches the second reference voltage line. A second drive voltage driver supplies second luminous drive voltages to the second drive voltage lines.

Abstract: A semiconductor light emitting element comprises an optical semiconductor laminated layer providing vias, an electrode that is disposed on a surface of the optical semiconductor laminated layer and separated from the second semiconductor layer in a peripheral portion of the electrode, a first transparent insulating layer that is disposed between the peripheral portion of the electrode and the optical semiconductor laminated layer, and a second transparent insulating layer that is disposed to cover the electrode, that envelops the peripheral portion of the electrode together with the first transparent insulating layer.

Abstract: A semiconductor light emitting element comprises an optical semiconductor laminated layer providing vias, an electrode that is disposed on a surface of the optical semiconductor laminated layer and separated from the second semiconductor layer in a peripheral portion of the electrode, a first transparent insulating layer that is disposed between the peripheral portion of the electrode and the optical semiconductor laminated layer, and a second transparent insulating layer that is disposed to cover the electrode, that envelops the peripheral portion of the electrode together with the first transparent insulating layer.

Abstract: Provided is a control apparatus for an internal combustion engine that can favorably achieve compatibility between suppressing deterioration of a catalyst and suppressing progression of rich poisoning thereof when the internal combustion engine has a configuration that performs valve stopping control during a fuel-cut operation. Variable valve operating apparatuses are provided having valve stop mechanisms that can respectively change an operating state of an intake valve and an exhaust valve between a valve operating state and a closed-valve stopped state. When an integrated fuel injection amount is equal to or greater than a predetermined value ? when executing a fuel-cut operation, it is determined that rich poisoning of an upstream catalyst is in a progressed state. In that case, valve stopping control of the intake and exhaust valves is prohibited to thereby supply oxygen to the upstream catalyst.

Abstract: A manufacturing method of a semiconductor light emitting element, includes forming sacrifice portions within the width of street portions in a semiconductor laminated body, and performing wet etching to remove the sacrifice portions together with their neighboring portions, thereby removing etching residuals in the streets.