Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

Abstract: The present disclosure relates to a method and a device for compensating for a luminance deviation. A difference in pixel value of the image capturing device between a first pixel and a second pixel in the screen and a difference in gray scale level between first and second gray scale levels are derived from a captured image at the first gray scale level and a captured image at the second gray scale level which include pixel values of the image capturing device. A pixel value for the second pixel is calculated from the captured image at the first gray scale level.

Abstract: A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.

Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and coating layers respectively covering the plating layer and including an island region exposing a portion of a surface of the plating layer.

Abstract: A coining apparatus for forming a sealing surface in an end portion of a tube includes an inner portion having a first bead forming surface and an outer portion having a second bead forming surface. The outer portion is arranged concentric to the inner portion with a radial gap formed therebetween. The first bead forming surface and the second bead forming surface each lead towards the gap and are tapered in opposing radial directions. The radial gap provides a pathway for a flow of deformed tube material or a flow of fluid during the formation of an engaging bead in the sealing surface as caused by engagement of the first bead forming surface and the second bead forming surface with the end portion of the tube. The formation of the engaging bead via the coining process results in at least a portion of the engaging bead being work hardened.

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.

Abstract: A light emitting device, includes: a substrate; a light emitting element on the substrate, the light emitting element having a first end portion and a second end portion arranged in a longitudinal direction; one or more partition walls disposed on the substrate, the one or more partition walls being spaced apart from the light emitting element; a first reflection electrode adjacent the first end portion of the light emitting element; a second reflection electrode adjacent the second end portion of the light emitting element; a first contact electrode connected to the first reflection electrode and the first end portion of the light emitting element; an insulating layer on the first contact electrode, the insulating layer having an opening exposing the second end portion of the light emitting element and the second reflection electrode to the outside; and a second contact electrode on the insulating layer.

Abstract: A multilayer capacitor includes a body including a stack structure in which dielectric layers are stacked and internal electrodes are stacked with one of the dielectric layers interposed therebetween and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode layer covering a first surface of the body to which the first internal electrode is exposed, a glass layer covering the first electrode layer and a second surface of the body connected to the first surface, and a second electrode layer covering the glass layer, and the glass layer includes an inner region having a discontinuous region and an outer region covering the second surface of the body and having an end exposed from the second electrode layer.

Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.

Abstract: An information set extraction method based on parallel decoding for extracting m information sets (where m is an arbitrary integer greater than or equal to 1) including n attributes (where n is an arbitrary integer greater than or equal to 1) from a document, the information set extraction method including: receiving, by a system comprising a neural network model of a sequence-to-sequence (seq2seq) structure, a document; and determining m information sets through a plurality of times of decoding. The determining of m information sets through a plurality of times of decoding includes determining first column information having m first attributes through decoding; and determining i-th column information having m i-th attributes based on at least one of the first to (i?1)-th column information through decoding (where i is an arbitrary integer such that 2<=i<=n).

Abstract: Disclosed herein are a method and apparatus for compressing learning parameters for training of a deep-learning model and transmitting the compressed parameters in a distributed processing environment. Multiple electronic devices in the distributed processing system perform training of a neural network. By performing training, parameters are updated. The electronic device may share the updated parameter thereof with additional electronic devices. In order to efficiently share the parameter, the residual of the parameter is provided to the additional electronic devices. When the residual of the parameter is provided, the additional electronic devices update the parameter using the residual of the parameter.

Abstract: Disclosed is an organic light emitting display having reduced thickness and weight. The organic light emitting display with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensor including a touch sensing line and a touch driving line and a color filter on the encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.

Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.

Abstract: A radio frequency (RF) chip package includes: an RF die; a first peripheral circuit chip; a second peripheral circuit chip; a substrate having a -shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no step is formed; a first mutual inductance controller for controlling the dimension of the mutual inductance between the first peripheral circuit chip and the RF die; and a second mutual inductance controller for controlling the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.

Abstract: The present invention relates to a method for preparing a culture medium containing exosomes released by umbilical cord blood stem cells. The preparation method is based on culturing the umbilical cord blood stem cells in a serum-free medium supplemented with GDF-11, EGF, FGF2, TFG-?1, and/or VEGF. The culture medium produced by treating umbilical cord blood stem cells with a serum-free medium supplemented with 5 types of growth factors and the exosomes isolated from the culture medium has a higher total protein content and extracellular matrix protein content, when compared to a culture medium produced by culturing umbilical cord blood stem cells in a serum-free medium to which the growth factor is not added. In addition, exosomes released by umbilical cord blood stem cells cultured in a serum-free medium containing five growth factors have a high concentration, a small size, and an even distribution.