Abstract: A substrate structure is provided, in which an insulating protection layer is formed on a substrate body having a plurality of electrical contact pads, and the insulating protection layer has a plurality of openings corresponding to the plurality of exposed electrical contact pads, and the insulating protection layer is formed with a hollow portion surrounding a partial edge of at least one of the electrical contact pads at at least one of the openings, so as to reduce the barrier of the insulating protection layer.

Abstract: The present disclosure provides a use of a pharmaceutical composition including adenine and/or a pharmaceutically acceptable salt thereof in a manufacture of a medicament for treating diabetic ulcers, and the medicament can effectively accelerate and enhance wound healing of diabetic ulcers and prevent scar formation.

Abstract: The present disclosure provides a pixel circuit with pulse width compensation, and the pixel circuit includes a pulse width modulation circuit and a pulse amplitude modulation circuit, and the pulse amplitude modulation circuit is electrically connected to the pulse width modulation circuit. The pulse width modulation circuit includes a P-type pulse width compensation transistor and a first P-type control transistor, and the first P-type control transistor is electrically connected to the P-type pulse width compensation transistor. The pulse amplitude modulation circuit includes a second P-type control transistor, a first capacitor, a P-type driving transistor and a light-emitting element. The second P-type control transistor is electrically connected to the first P-type control transistor. The first capacitor is electrically connected to the second P-type control transistor.

Abstract: Disclosed herein is use of collagen particles for preparation of a medicament for inducing hair follicles neogenesis or angiogenesis in a subject. The collagen particles in the present application have a diameter of about 10-200 ?m. According to some embodiments of the present disclosure, the collagen particles are administered to the subject in an amount of about 0.1 mg/cm2 to about 1,000 mg/cm2.

Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A defoamer composition contains I) an oil phase, II) a water phase, III) at least one O/W emulsifier, and IV) at least one W/O emulsifier as co-emulsifier. In the defoamer composition, the amount of the water phase is 20-90 wt. %, preferably 60-85 wt. % based on the total weight of the composition. The oil phase is an oil-in-oil emulsion containing A) at least one or more vegetable oil as component A, B) at least one or more polyether ester as component B, C) at least one or more polyether-modified polysiloxane, and optionally D) at least one or more hydrophobic particle as component D.

Abstract: A method of controlling phase shift pulse width modulation of a power converter, the method includes a step of obtaining sampling signals of an output voltage and current of the power converter. Then, a digital signal processor is used to calculate an output power of the power converter. Next, a comparator is used to compare the output power of the power converter with a reference power. When the output power is less than the reference power, the modulation control of the switch of the power converter enters into hard-switching mode, and when the output power is greater than the reference power, the modulation control of the switch of the power converter enters into soft-switching mode.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

Abstract: Various embodiments are directed to apparatuses and methods for airflow adjustment in a respiratory protective device. In various embodiments, an air distribution system configured for selectively adjusting an airflow in a respiratory protective device, the air distribution system comprising a motor element; and one or more plate element configured for movement between a first and a second directional configurations based on an operation of the motor element; wherein the plate element is configured for arrangement relative to an air outlet of a fan component of the respiratory protective device such that the movement of the plate element between the first directional configuration and the second directional configuration defines a selective adjustment of an airflow characteristic defined by a volume of air flowing through the respiratory protective device relative to the air distribution system.

Abstract: A fabric of a cup body of a brassiere includes an inner textile layer, an outer textile layer and a middle textile layer. A first weaving region and a second weaving region of the outer textile layer respectively include a plurality of composite yarns. Each of the composite yarns includes a first yarn and a second yarn. A melting point of the first yarn is lower than a melting point of the second yarn, and an offset rate of the second yarn relative to the first yarn is from 5% to 300%. A content of the composite yarns in the first weaving region is greater than that in the second weaving region. A content of the composite yarns in a third weaving region of the outer textile layer is less than that in the second weaving region. The first weaving region is at a lifting area of the cup body.

Abstract: An ESD protection device includes a PN diode formed in a semiconductor body. The PN diode has a first contact coupled to a metal structure on a front side of the semiconductor body and a second contact coupled to a metal structure on a back side of the semiconductor body. The metal coupled to the first contact is spaced apart from the metal coupled to the second contact by a thickness of the semiconductor body. This spacing greatly reduces the capacitance associated with the metal structures, which can substantially reduce the overall capacitance added to an I/O channel by the ESD protection device and thereby improve the performance of a high-speed circuit that uses the I/O channel.

Abstract: Methods and apparatus of video coding using sub-block based affine mode are disclosed. According to this method, control-point motion vectors (MVs) associated with the affine mode are determined for a block. A sub-block MV is derived for a target sub-block of the block from the control-point MVs for the block. A prediction offset is determined for a target pixel of the target sub-block using information comprising a pixel MV offset from the sub-block MV for the target pixel according to Prediction Refinement with Optical Flow (PROF). The target pixel of the target sub-block is encoded or decoded using a modified predictor. The modified prediction is generated by clipping the prediction offset to a target range and combining the clipped prediction offset with an original predictor.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A wafer lift pin system is capable of dynamically modulating or adjusting the flow of gas into and out of lift pins of the wafer lift pin system to achieve and maintain a consistent pressure in supply lines that supply the gas to the lift pins. This enables the wafer lift pin system to precisely control the speed, acceleration, and deceleration of the lift pins to achieve consistent and repeatable lift pin rise times and fall times. A controller and various sensors and valves may control the gas pressures in the wafer lift pin system based on various factors, such as historic rise times, historic fall times, and/or the condition of the lift pins. This enables smoother and more controlled automatic operation of the lift pins, which reduces and/or minimizes wafer shifting and wafer instability, which may reduce processing defects and maintain or improve processing yields.

Abstract: Methods, systems, and devices for wireless communications are described. A first user equipment (UE) may receive, from a base station, control signaling indicating a set of resources of a sidelink channel available for sidelink communication with a second UE. The first UE may receive a sidelink preemption indication indicating that at least a first resource from the set of resources is preempted. The first UE may communicate a sidelink transmission over the sidelink channel with the second UE based on the sidelink preemption indication. In some cases, the first UE may determine whether the SPI satisfies one or more thresholds and the first UE may communicate the sidelink transmission, or refrain from communicating the sidelink transmission, based on determining whether the SPI satisfies the one or more thresholds.

Abstract: A three-dimensional ultrasonic imaging method includes transmitting an ultrasonic wave to a fetal head; receiving an ultrasonic echo, obtaining an ultrasonic echo signal, and obtaining the three-dimensional volume data of the fetal head according to the ultrasonic echo signal; according to the characteristics of a median sagittal section of the fetal head, detecting the median sagittal section in the three-dimensional volume data; and displaying the median sagittal section.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: An example operation may include one or more of generating a three-dimensional (3D) model of an object via execution of a machine learning model on one or more images of the object, capturing a plurality of snapshots of the 3D model of the object at different angles to generate a plurality of snapshot images of the object, fusing a feature into each of the plurality of snapshots to generate a plurality of fused snapshots of the 3D model of the object, and storing the plurality of fused snapshots of the 3D model of the object in memory.