Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A memory device includes a plurality of memory cells disposed over a substrate and formed as an array that has a plurality of rows and a plurality of columns. Each of the plurality of memory cells includes a plurality of transistors. A first subset of the plurality of memory cells, that are disposed in first neighboring ones of the plurality of rows, are physically coupled to a corresponding one of a plurality of second interconnect structures that carries a supply voltage through a corresponding one of a plurality of first interconnect structures. The plurality of first interconnect structures extend along a first lateral direction in parallel with a lengthwise direction of a channel of each of the transistors of the memory cells, and the plurality of second interconnect structures, disposed above the plurality of first interconnect structures, extend along a second lateral direction perpendicular to the first lateral direction.

Abstract: A display panel includes a circuit substrate, light emitting elements, a side wire, and a chip-on-film package structure. The circuit substrate includes a circuit structure located on a first surface. The side wire includes a first bonding portion disposed on the first surface of the circuit substrate and bonded to the circuit structure, a first extension portion, a second extension portion, and a second bonding portion that are sequentially connected and have the same resistivity. The first extension portion is disposed on a side surface of the circuit substrate. The second extension portion is disposed on a second surface of the circuit substrate and overlapped with a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate. An orthogonal projection of the second bonding portion is overlapped with a display region. The chip-on-film package structure is bonded to the second bonding portion.

Abstract: A vacuum battery structural assembly and a vacuum multi-cell battery module composed thereof are provided and include a first repeating unit including a first frame plate and a second frame plate with respect to the first frame plate; and an electrolyte channel defined within the first frame plate and the second frame plate to accommodate a liquid electrolyte, wherein both a surface of the first frame plate and a surface of the second frame plate include a vacuum suction area, the vacuum suction area includes a vacuum aperture and a vacuum channel, wherein the vacuum aperture is formed on at least one surface of the first frame plate and the second frame plate, the vacuum channel is positioned inside the first frame plate and the second frame plate, and is configured to generate a longitudinal pressing suction force and seal the first frame plate and the second frame plate.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a first gate line, a second gate line, and a first auxiliary gate portion. The semiconductor substrate comprises a semiconductor fin. The semiconductor fin extends substantially along a first direction. The first gate line and the second gate line extend substantially along a second direction different form the first direction from a top view. The first auxiliary gate portion connects the first gate line to the second gate line from the top view.

Abstract: Disclosed herein are related to a memory device. In one aspect, a memory device includes a set of memory cells. In one aspect, the memory device includes a first bit line extending along a direction. The first bit line may be coupled to a subset of the set of memory cells disposed along the direction. In one aspect, the memory device includes a second bit line extending along the direction. In one aspect, the memory device includes a switch coupled between the first bit line and the second bit line.

Abstract: A method for evaluating a risk of a subject getting a specific disease includes steps of: storing a reference database that contains original parameter sets; selecting target alleles from an SNP profile derived from genome sequencing data of a subject; selecting target parameter sets from among the original parameter sets; calculating, for each of the target parameter sets, a race factor based on a global risk allele frequency and a group-specific risk allele frequency included in the target parameter set; calculating a genetic factor based on statistics, global reference allele frequencies, the race factors for the target parameter sets, and numbers of chromosomes in homologous chromosome pairs included in the target parameter sets; calculating a citation factor based on numbers of citation times included in the target parameter sets; and calculating a risk score based on the genetic factor and the citation factor.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: A memory device and a method for operating the memory device are provided. The memory device includes a memory cell and a bit line connected to the memory cell. A negative voltage generator is connected to the bit line. The negative voltage generator, when enabled, is operative to provide a first write path for the bit line. A control circuit is connected to the negative voltage generator and the bit line. The control circuit is operative to provide a second write path for the bit line when the negative voltage generator is not enabled.

Abstract: Present disclosure provides a semiconductor structure, including a semiconductor fin having a first portion and a second portion over the first portion, a first conductive region abutting a first lateral surface of the first portion and a first lateral surface of the second portion, a metal gate having a bottom portion and an upper portion, the bottom portion being between the first portion and the second portion of the semiconductor fin, and the upper portion being over the second portion of the semiconductor fin, and a first spacer between the bottom portion of the metal gate and the first conductive region. A method for manufacturing the semiconductor structure described herein is also provided.

Abstract: An electronic device including a first panel and a second panel overlapped with the first panel is provided. The first panel includes a substrate, a first medium layer, a first electrode layer and a second electrode layer. The first medium layer is disposed on the substrate. The first electrode layer is disposed between the substrate and the first medium layer. The second electrode layer is disposed between the first electrode layer and the first medium layer. A first voltage is applied to the first electrode layer, a second voltage is applied to the second electrode layer, and the first voltage is different from the second voltage.

Abstract: A flexible optical element adopting liquid crystals (LCs) as the materials for realizing electrically tunable optics is foldable. A method for manufacturing the flexible element includes patterned photo-polymerization. The LC optics can include a pair of LC layers with orthogonally aligned LC directors for polarizer-free properties, flexible polymeric alignment layers, flexible substrates, and a module for controlling the electric field. The lens power of the LC optics can be changed by controlling the distribution of electric field across the optical zone.

Abstract: An optical display system includes an augmented reality device and a lens device. The augmented reality device has an output surface which is disposed to permit a combined image from the augmented reality device to be direct to an eye of a viewer. The lens device is disposed between the output surface and the eye of the viewer, and includes a focus lens unit and a variable focus lens. The focus lens unit is disposed proximate to the output surface, and is configured to shift a focus of a combined light contributed to the combined image. The variable focus lens is disposed distal from the output surface, and is configured to continuously shift the focus of the combined light that is being focused by the focus lens unit.

Abstract: A pancake lens assembly includes a partially reflective mirror, a reflective polarizer, a quarter waveplate, a polarization-dependent optical device, and at least one polarization controller. When a light beam is introduced into the pancake lens assembly along an optical axis in a Z direction to pass through the polarization controller in a first state, a polarization direction of the light beam is converted by the polarization controller. When the light beam is introduced into the pancake lens assembly along the optical axis to pass through the polarization controller in a second state, the polarization direction of the light beam is prevented from being converted by the polarization controller.

Abstract: A display panel includes a first substrate, pixel structures, a second substrate, a display medium, a first sealant, and a second sealant. The first substrate includes an active area and a peripheral area outside the active area. The pixel structures are disposed on the active area of the first substrate. The second substrate is disposed opposite to the first substrate. The first sealant is disposed between the first substrate and the second substrate, and is located on the peripheral area of the first substrate. The second sealant is disposed on a side wall of the first substrate and a side wall of the second substrate. The second sealant includes a convex surface overlapped with the side wall of the first substrate and the side wall of the second substrate.

Abstract: A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.

Abstract: A display panel includes a first substrate, a second substrate, a plurality of light-emitting components, a bonding layer and a driving component. The first substrate includes a planar portion and a bending portion. The second substrate is disposed on the first substrate. The light-emitting components are disposed on the second substrate. The bonding layer is disposed between the planar portion of the first substrate and the second substrate. The driving component is disposed on a first surface of the bending portion of the first substrate and electrically connected to the light-emitting components. The first surface of the bending portion extends from a surface of the planar portion adjacent to the second substrate, and a projection of the bending portion in a vertical direction falls within the second substrate. A tiled display device including multiple display panels and a manufacturing method of the display panel are also provided.

Abstract: A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.

Abstract: A pancake lens assembly includes a partially reflective mirror, a reflective polarizer, a quarter waveplate, a polarization-dependent optical device, and at least one polarization controller. When a light beam is introduced into the pancake lens assembly along an optical axis in a Z direction to pass through the polarization controller in a first state, a polarization direction of the light beam is converted by the polarization controller. When the light beam is introduced into the pancake lens assembly along the optical axis to pass through the polarization controller in a second state, the polarization direction of the light beam is prevented from being converted by the polarization controller.