Patents by Inventor Yi Wei

Yi Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139374
    Abstract: Disclosed herein is use of collagen particles for preparation of a medicament for inducing hair follicles neogenesis or angiogenesis in a subject. The collagen particles in the present application have a diameter of about 10-200 ?m. According to some embodiments of the present disclosure, the collagen particles are administered to the subject in an amount of about 0.1 mg/cm2 to about 1,000 mg/cm2.
    Type: Application
    Filed: September 17, 2021
    Publication date: May 2, 2024
    Inventors: Dar-Jen HSIEH, Yun-Ju CHEN, Chao-Yi WEI
  • Publication number: 20240145581
    Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Wen CHIU, Yi Che CHAN, Lun-Kuang TAN, Zheng-Yang PAN, Cheng-Po CHAU, Pin-Chu LIANG, Hung-Yao CHEN, De-Wei YU, Yi-Cheng LI
  • Publication number: 20240144428
    Abstract: An image processing circuit includes a receiving circuit, a transmitting circuit, a first asynchronous handshake circuit, a super resolution scale-up model and a second asynchronous handshake circuit. The receiving circuit is arranged to receive an input image with a first pixel clock frequency. The first asynchronous handshake circuit is arranged to receive the input image from the receiving circuit according to a receiving timing. The super resolution scale-up model is arranged to scale up the input image to generate an output image with a second pixel clock frequency. The second asynchronous handshake circuit is arranged to output the output image to the transmitting circuit according to a transmitting timing to transmit the output image, wherein the first asynchronous handshake circuit, the super resolution scale-up model, and the second asynchronous handshake circuit operate at a clock frequency independent of the first pixel clock frequency and the second pixel clock frequency.
    Type: Application
    Filed: June 28, 2023
    Publication date: May 2, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Tien-Hung Lin, Chia-Wei Yu, Yi-Ting Bao
  • Publication number: 20240147646
    Abstract: A portable data accessing device and more particularly the use of multi-port interfaces on a data accessing device disclosed. The multi-port data accessing device includes an inner body, one or a plurality of moving-caps, one or a plurality of grips, a pump-action and one or a plurality of locking/releasing mechanisms.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Yi-Ting Lin, Hsien-Chih Chang, Chang-Hsing Lin, Hao-Yin Lo, Ben Wei Chen
  • Patent number: 11969447
    Abstract: A composition for promoting defecation includes a cell culture of at least one lactic acid bacterial strain which is substantially free of cells. The least one lactic acid bacterial strain is selected from the group consisting of Lactobacillus salivarius subsp. salicinius AP-32, Bifidobacterium animalis subsp. lactis CP-9, and Lactobacillus acidophilus TYCA06, which are respectively deposited at the Bioresource Collection and Research Center (BCRC) under accession numbers BCRC 910437, BCRC 910645 and BCRC 910813. Also disclosed is a method for promoting defecation, including administering to a subject in need thereof an effective amount of the composition.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: April 30, 2024
    Assignee: GLAC BIOTECH CO., LTD.
    Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yi-Wei Kuo, Yu-Fen Huang, Cheng-Chi Lin
  • Patent number: 11969450
    Abstract: Disclosed herein are methods for improving gastrointestinal barrier function, alleviating a gastrointestinal barrier dysfunction-associated disorder, and inhibiting growth of enteric pathogenic bacteria using a composition containing Lactobacillus rhamnosus MP108, Bifidobacterium longum subsp. infantis BLI-02, and Bifidobacterium animalis subsp. lactis BB-115, which are deposited at the China General Microbiological Culture Collection Center (CGMCC) respectively under accession numbers CGMCC 21225, CGMCC 15212, and CGMCC 21840. A number ratio of Lactobacillus rhamnosus MP108, Bifidobacterium longum subsp. infantis BLI-02, and Bifidobacterium animalis subsp. lactis BB-115 ranges from 1:0.2:0.67 to 1:9:9.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: April 30, 2024
    Assignee: GLAC BIOTECH CO., LTD.
    Inventors: Hsieh-Hsun Ho, Jui-Fen Chen, Yi-Wei Kuo, Chi-Huei Lin
  • Patent number: 11973124
    Abstract: In method of manufacturing a semiconductor device, a source/drain epitaxial layer is formed, one or more dielectric layers are formed over the source/drain epitaxial layer, an opening is formed in the one or more dielectric layers to expose the source/drain epitaxial layer, a first silicide layer is formed on the exposed source/drain epitaxial layer, a second silicide layer different from the first silicide layer is formed on the first silicide layer, and a source/drain contact is formed over the second silicide layer.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Wei Chang, Shahaji B. More, Yi-Ying Liu, Yueh-Ching Pai
  • Patent number: 11974371
    Abstract: A light-emitting diode LED driver and a LED driving device including the LED driver are provided. The light-emitting diode LED driver includes a decoding circuit that receives a data signal and decodes the data signal to generate display data used to drive LEDs to emit light and display and a recovered clock signal. Further provided is an encoding circuit that encodes the decoded display data by using the recovered clock signal to generate an encoded data signal, where the data signal is encoded in a first encoding format, and the encoded data signal is encoded in a second encoding format.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: April 30, 2024
    Assignee: NOVATEK MICROELECTRONICS CORP.
    Inventors: Yu-Hsiang Wang, Che-Wei Yeh, Keko-Chun Liang, Yong-Ren Fang, Yi-Chuan Liu
  • Patent number: 11972951
    Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Wei Chang, Kao-Feng Lin, Min-Hsiu Hung, Yi-Hsiang Chao, Huang-Yi Huang, Yu-Ting Lin
  • Patent number: 11974479
    Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 30, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Shun-Yuan Hu, Chin-Lung Ting, Li-Wei Mao, Ming-Chun Tseng, Kung-Chen Kuo, Yi-Hua Hsu, Ker-Yih Kao
  • Publication number: 20240132667
    Abstract: Provided is a polyamide foam molded body and method for manufacturing the same. The method includes performing polymerization with a monomer composition to form a polyamide terpolymer; mixing a supercritical carbon dioxide foaming agent and the polyamide terpolymer under a pressure to form a mixture; and releasing the pressure of the mixture to foam the polyamide terpolymer for forming the polyamide foam molded body. The monomer composition comprises 50 to 70 mole % of a caprolactam, 4 to 15 mole % of a polyetheramine, 4 to 15 mole % of a dicarboxylic acid and 15 to 30 mole % of a Nylon salt. The polyamide terpolymer includes a hard segment formed by the caprolactam, the dicarboxylic acid and the Nylon salt and a soft segment formed by the polyetheramine. The polyamide foam molded body exhibits excellent properties and is environmental-friendly.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 25, 2024
    Inventors: Yi-Huan Lee, Chia-Hsing Lin, Chia-Wei Lee
  • Publication number: 20240137546
    Abstract: An electronic apparatus performs a method of decoding video data. The method includes: receiving, from the video data, an Adaptation Parameter Set (APS) identifier associated with a number of previously used Cross-Component Sample Adaptive Offset (CCSAO) filter offset sets stored in APS; receiving, from the video data, a syntax in Picture Header (PH) or Slice Header (SH) that indicates the APS identifier used for a current picture or slice; decoding, for the current coding tree unit (CTU), a filter set index that indicates a particular previously used CCSAO filter offset set of the number of offset sets in the APS associated with the APS identifier; and applying the particular previously used CCSAO filter offset set to the current CTU of the video data.
    Type: Application
    Filed: November 27, 2023
    Publication date: April 25, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Che-Wei KUO, Xiaoyu XIU, Wei CHEN, Xianglin WANG, Yi-Wen CHEN, Hong-Jheng JHU, Ning YAN, Bing YU
  • Publication number: 20240133949
    Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yu-Lin Yang, Chin-Wei Lin, Po-Chao Tsao, Tung-Hsing Lee, Chia-Jung Ni, Chi-Ming Lee, Yi-Ju Ting
  • Publication number: 20240136191
    Abstract: A method of forming a semiconductor device includes forming source/drain regions on opposing sides of a gate structure, where the gate structure is over a fin and surrounded by a first dielectric layer; forming openings in the first dielectric layer to expose the source/drain regions; selectively forming silicide regions in the openings on the source/drain regions using a plasma-enhanced chemical vapor deposition (PECVD) process; and filling the openings with an electrically conductive material.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Min-Hsiu Hung, Chien Chang, Yi-Hsiang Chao, Hung-Yi Huang, Chih-Wei Chang
  • Patent number: 11968206
    Abstract: A mechanism for building decentralized computer applications that execute on a distributed computing system. The present technology works within a web browser, client application, or other software and provides access to decentralized computer applications through the browser. The present technology is non-custodial, wherein a public-private key pair, which represents user identity, is created on a client machine and then directly encrypted by a third-party platform without relying on one centralized computing system.
    Type: Grant
    Filed: September 15, 2023
    Date of Patent: April 23, 2024
    Assignee: Magic Labs, Inc.
    Inventors: Fei-Yang Jen, Yi Wei Chen, Jaemin Jin, Hanyu Xue, Wentao Liu, Shang Li
  • Patent number: 11966352
    Abstract: An information handling system with modular riser components for receiving expansion cards having various requirements. The system includes a riser body assembly having a common support structure for receiving expansion cards. The common support structure may be coupled to different expansion structures to provide support of expansion cards having requirements that would not be met by the common support structure alone.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: April 23, 2024
    Assignee: Dell Products L.P.
    Inventors: Yu-Feng Lin, Hao-Cheng Ku, Yi-Wei Lu
  • Patent number: 11967011
    Abstract: The present disclosure relates to systems, non-transitory computer-readable media, and methods for generating and modifying digital animations based on user interactions with a unique user interface portraying a one-dimensional layer motion element and/or elements for generating and utilizing animation path for digital design objects and animation layers. The disclosed system can provide a dynamic one-dimensional layer motion element that adapts to a selected animation layer and portrays selectable animation frames from the animation layer. The disclosed systems can provide options for generating and modifying various frames of the digital animation based on user interactions with the one-dimensional layer motion element, an animation timeline, and/or a corresponding animation canvas.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: April 23, 2024
    Assignee: Adobe Inc.
    Inventors: Kazi Rubaiat Habib, Timothy Langlois, Li-Yi Wei, John Simpson, James Corbett, Christopher Nuuja, Brooke Hopper
  • Patent number: 11968908
    Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tai-Yen Peng, Hui-Hsien Wei, Han-Ting Lin, Sin-Yi Yang, Yu-Shu Chen, An-Shen Chang, Qiang Fu, Chen-Jung Wang
  • Patent number: 11963987
    Abstract: At least one isolated lactic acid bacteria strains selected from the following: TSP05 (Lactobacillus plantarum), TSF331 (Lactobacillus fermentum) and TSR332 (Lactobacillus reuteri) is provided. The above-mentioned active or inactive lactic acid bacteria strains have a function of hepatoprotection and is used in a form of a food composition or a pharmaceutical composition.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 23, 2024
    Assignee: GLAC BIOTECH CO., LTD.
    Inventors: Hsieh-Hsun Ho, Yi Wei Kuo, Jui-Fen Chen, Ching-Wei Chen
  • Patent number: D1025074
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 30, 2024
    Assignee: CHENBRO MICOM CO., LTD.
    Inventors: Chiung-Wei Lin, Yi-Chen Chen