Patents by Inventor Yi Xiang Wang
Yi Xiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120280125Abstract: The present invention relates to a charged particle system for reticle or semiconductor wafer defects inspection and review, and more particularly, relates to an E-beam inspection tool for reticle or semiconductor wafer defects inspection and review without gravitational AMC settling. The charged particle system is an upside down electron beam inspection system with an electron beam aimed upward. The face down design may prevent AMC from gravitational settling on the inspected face of the specimen during inspection, thereafter having a cleaner result compared with conventional face-up inspection system.Type: ApplicationFiled: May 3, 2012Publication date: November 8, 2012Applicant: HERMES MICROVISION INC.Inventors: CHIYAN KUAN, YI-XIANG WANG, CHUNG-SHIH PAN, ZHONGHUA DONG, ZHONGWEI CHEN
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Patent number: 8294094Abstract: An apparatus and method are introduced in this invention to reduce the edge effect of a substrate that causes image variation or distortion due to applied substrate bias. An edge plate with an edge effect eliminator are provided such that substrate is inspected by a charged particle beam can capture images without distortion at substrate edge.Type: GrantFiled: August 16, 2011Date of Patent: October 23, 2012Assignee: Hermes Microvision Inc.Inventors: Yan Zhao, Jack Jau, Yi-Xiang Wang
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Patent number: 8237125Abstract: This invention provides a design to process a large range of detection beam current at low noise with a single detector. With such a design, the detection system can generate up to 1010 gain and maximum signal output at more than mini Ampere (mA) level.Type: GrantFiled: April 21, 2010Date of Patent: August 7, 2012Assignee: Hermes Microvision, Inc.Inventors: Yi-Xiang Wang, Joe Wang
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Patent number: 8218284Abstract: An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.Type: GrantFiled: July 24, 2008Date of Patent: July 10, 2012Assignee: Hermes-Microvision, Inc.Inventors: Zhong-Wei Chen, Yi Xiang Wang, Juying Dou
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Publication number: 20120145898Abstract: This invention provides a design to process a large range of detection beam current at low noise with a single detector. With such a design, the detection system can generate up to 1010 gain and maximum signal output at more than mini Ampere (mA) level. A condenser lens is configured to increase bandwidth of the detector that scan speed can be enhanced.Type: ApplicationFiled: December 14, 2010Publication date: June 14, 2012Applicant: HERMES MICROVISION, INC.Inventors: YI-XIANG WANG, JOE WANG, WEIMING REN
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Patent number: 8094924Abstract: An apparatus comprises an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column. The modified SORIL column includes a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus; and a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam. The modified SORIL column further includes a storage unit for storing wafer design database; and a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.Type: GrantFiled: December 15, 2008Date of Patent: January 10, 2012Assignee: Hermes-Microvision, Inc.Inventors: Jack Jau, Zhongwei Chen, Yi Xiang Wang, Chung-Shih Pan, Joe Wang, Xuedong Liu, Weiming Ren, Wei Fang
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Patent number: 8094428Abstract: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.Type: GrantFiled: October 27, 2008Date of Patent: January 10, 2012Assignee: Hermes-Microvision, Inc.Inventors: Yi Xiang Wang, Juying Dou, Kenichi Kanai, Jun Jiang, Zheng Fan, Qingyu Meng, Jay Chen
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Publication number: 20110291007Abstract: The present invention generally relates to a detection unit of a charged particle imaging system. More particularly, portion of the detection unit can move into or out of the detection system as imaging condition required. With the assistance of a Wein filter (also known as an E×B charged particle analyzer) and a movable detector design, the present invention provides a stereo imaging system that suitable for both low current, high resolution mode and high current, high throughput mode. Merely by way of example, the invention has been applied to a scanning electron beam inspection system. But it would be recognized that the invention could apply to other system using charged particle beam as an observation tool.Type: ApplicationFiled: May 25, 2010Publication date: December 1, 2011Applicant: HERMES MICROVISION, INC.Inventors: YI-XIANG WANG, JOE WANG, XUEDONG LIU, ZHONGWEI CHEN
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Publication number: 20110260069Abstract: This invention provides a design to process a large range of detection beam current at low noise with a single detector. With such a design, the detection system can generate up to 1010 gain and maximum signal output at more than mini Ampere (mA) level.Type: ApplicationFiled: April 21, 2010Publication date: October 27, 2011Applicant: HERMES MICROVISION, INC.Inventors: YI-XIANG WANG, JOE WANG
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Publication number: 20110260055Abstract: The present invention generally relates to dynamic focus adjustment for an image system. With the assistance of a height detection sub-system, present invention provides an apparatus and methods for micro adjusting an image focusing according the specimen surface height variation by altering the field strength of an electrostatic lens between objective lens and sample stage/or a bias voltage applied to the sample surface. Merely by way of example, the invention has been applied to a scanning electron inspection system. But it would be recognized that the invention could apply to other system using charged particle beam as observation tool with a height detection apparatus.Type: ApplicationFiled: April 21, 2010Publication date: October 27, 2011Applicant: HERMES MICROVISION, INC.Inventors: JOE WANG, VAN-DUC NGUYEN, YI-XIANG WANG, JACK JAU, ZHONGWEI CHEN
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Patent number: 7919760Abstract: The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0° to 180° while performing substrate top bevel, apex and bottom bevel inspection or review.Type: GrantFiled: December 9, 2008Date of Patent: April 5, 2011Assignee: Hermes-Microvision, Inc.Inventors: Jack Jau, Hong Xiao, Joe Wang, Zhongwei Chen, Yi Xiang Wang, Edward Tseng
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Publication number: 20110051306Abstract: A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A grounding pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the grounding pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.Type: ApplicationFiled: September 1, 2009Publication date: March 3, 2011Applicant: HERMES MICROVISION, INC.Inventors: YI-XIANG WANG, JUYING DOU, KENICHI KANAI
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Patent number: 7767982Abstract: A method and system for inspecting a semiconductor wafer. The method includes providing an illumination flux through a pattern plate and a lens to a surface of a specimen to project a pattern onto the surface of the specimen. The pattern is associated with the pattern plate. Additionally, the method includes detecting the illumination flux reflected from the surface of the specimen with a detector, processing information associated with the detected illumination flux, and generating a first image based on at least information associated with the detected illumination flux. The first image includes a first image part for the pattern and a second image part for the specimen. Moreover, the method includes adjusting the lens to a state in order to achieve a first predetermined quality for the first image part, and moving the specimen to a first position.Type: GrantFiled: June 6, 2007Date of Patent: August 3, 2010Assignee: Hermes-Microvision, Inc.Inventors: Yi Xiang Wang, Van-Duc Nguyen, Jian Zhang
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Publication number: 20100155596Abstract: A method for heating a substrate in a vacuum environment and a system therefor is provided. The system includes a chamber capable of holding the substrate located in the vacuum environment and a light source capable of projecting a light beam only on a portion of the substrate. The method includes the following steps. First, the substrate is placed in the vacuumed chamber. Thereafter, the light beam emitted from the light source is projected on the portion of the substrate, such that the portion is significantly heated before whole the substrate is heated. When the light beam is a charged particle beam projected by a charged particle beam assembly and projected on defects located on the substrate, the defects are capable of being identified by an examination result provided by an examination assembly after termination of light beam projection.Type: ApplicationFiled: December 19, 2008Publication date: June 24, 2010Applicant: HERMES MICROVISION, INC.Inventors: HONG XIAO, YI-XIANG WANG
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Publication number: 20100150429Abstract: The present invention relates to a defect review system, and/or particularly, to an apparatus and method of defect review sampling, review method and classification on a semiconductor wafer or a pattern lithography reticle during integrated circuit fabrication. These objects are achieved in comparing a reviewed image with a reference image pick-up through a smart sampling filter. A clustering computer system base on high speed network will provide data cache and save operation time and memory. A smart review sampling filter automatically relocate abnormal pattern or defects and classify the device location extracted from design database and/or from golden die image on the same substrate. The column of the present defect review system is comprised of the modified SORIL type objective lens. This column provides solution of improving throughput during sample review, material identification better image quality, and topography image of defect.Type: ApplicationFiled: December 15, 2008Publication date: June 17, 2010Applicant: HERMES-MICROVISION, INC.Inventors: Jack JAU, Zhongwei CHEN, Yi Xiang WANG, Chung-Shih PAN, Joe WANG, Xuedong LIU, Weiming REN, Wei FANG
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Publication number: 20100140498Abstract: The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0° to 180° while performing substrate top bevel, apex and bottom bevel inspection or review.Type: ApplicationFiled: December 9, 2008Publication date: June 10, 2010Applicant: HERMES-MICROVISION, INC.Inventors: JACK JAU, HONG XIAO, JOE WANG, ZHONGWEI CHEN, YI XIANG WANG, EDWARD TSENG
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Publication number: 20100103583Abstract: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.Type: ApplicationFiled: October 27, 2008Publication date: April 29, 2010Applicant: HERMES-MICROVISION, INC.Inventors: YI XIANG WANG, JUYING DOU, JUN JIANT, ZHENG FAN, QINGYU MENG
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Publication number: 20100019462Abstract: An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.Type: ApplicationFiled: July 24, 2008Publication date: January 28, 2010Applicant: Hermes-Microvision, Inc.Inventors: Zhong-Wei CHEN, Yi Xiang Wang, Juying Dou
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Publication number: 20090297615Abstract: There are disclosed polyhedral superparamagnetic nanoparticles and methods for making and using the nanoparticles. There are also disclosed coated and functionalized forms of the nanoparticles, methods of using nanoparticles and methods of treatment using nanoparticles.Type: ApplicationFiled: March 9, 2009Publication date: December 3, 2009Applicant: The Chinese University of Hong KongInventors: Yi-Xiang Wang, Cham-Fai Leung, Ling Qin
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Publication number: 20090121159Abstract: A hybrid lithography system is disclosed to achieve high throughput and high resolution of sub 32 nm lithography. The hybrid system contains an optical lithographer for expose pattern area where features above 32 nm, and a cluster e-beam lithography system for expose pattern area where features is sub 32 nm.Type: ApplicationFiled: October 27, 2008Publication date: May 14, 2009Applicant: HERMES-MICROVISION, INC.Inventors: ARCHI HWANG, YI XIANG WANG, JACK JAU, CHUNG-SHIH PAN, ZHONGWEI CHEN