Abstract: A method and system for inspecting a semiconductor wafer. The method includes providing an illumination flux through a pattern plate and a lens to a surface of a specimen to project a pattern onto the surface of the specimen. The pattern is associated with the pattern plate. Additionally, the method includes detecting the illumination flux reflected from the surface of the specimen with a detector, processing information associated with the detected illumination flux, and generating a first image based on at least information associated with the detected illumination flux. The first image includes a first image part for the pattern and a second image part for the specimen. Moreover, the method includes adjusting the lens to a state in order to achieve a first predetermined quality for the first image part, and moving the specimen to a first position.

Abstract: Method and apparatus for removing and neutralizing charges. The method includes loading a structure into a chamber. The structure includes a first surface and a plurality of charges away from the first surface. Additionally, the method includes supplying a first ionized gas to the first surface of the structure, and radiating the structure with a first ultraviolate light. The supplying a first ionized gas and the radiating the structure with a first ultraviolate light are performed simultaneously for a first period of time.

Abstract: Method and apparatus for removing and neutralizing charges. The method includes loading a structure into a chamber. The structure includes a first surface and a plurality of charges away from the first surface. Additionally, the method includes supplying a first ionized gas to the first surface of the structure, and radiating the structure with a first ultraviolate light. The supplying a first ionized gas and the radiating the structure with a first ultraviolate light are performed simultaneously for a first period of time.

Abstract: A method for inspecting a semiconductor wafer using an SEM having a nominal focal plane and operable for guiding a beam. The SEM having a stage movable in each of an X-, Y-, and Z-direction, including moving the SEM stage in the XY-direction to a first location for inspection, optically sensing the location of the top surface of an area in relation to the focal plane of the stage, adjusting the position of the stage in the Z-direction so that the top surface of the area is substantially at the focal plane, inspecting the areas, and moving the stage in the XY-direction to the next location such that the next area is under the SEM beam for inspection. The Z-stage using a non-contact optical sensor to provide feedback to drive a plurality of piezoelectric actuator to move the wafer to the focal plane.

Abstract: A method for inspecting a semiconductor wafer using an SEM having a nominal focal plane and operable for guiding a beam. The SEM having a stage movable in each of an X-, Y-, and Z-direction, including moving the SEM stage in the XY-direction to a first location for inspection, optically sensing the location of the top surface of an area in relation to the focal plane of the stage, adjusting the position of the stage in the Z-direction so that the top surface of the area is substantially at the focal plane, inspecting the areas, and moving the stage in the XY-direction to the next location such that the next area is under the SEM beam for inspection. The Z-stage using a non-contact optical sensor to provide feedback to drive a plurality of piezoelectric actuator to move the wafer to the focal plane.