Patents by Inventor Ying Yang

Ying Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230340787
    Abstract: A roofing composite membrane includes a base layer including a first thermoplastic polyolefin. A weight of the base layer is between 5 and 25 grams per square foot. A coating layer at least partially coats the base layer. The coating layer includes at least one inorganic additive, and a second thermoplastic polyolefin including polypropylene and having a melt flow rate between 0.5 grams per 10 minutes and 12 grams per 10 minutes.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: Li-Ying Yang, Jeffrey Avitabile, Joseph Nigro, Daniel Podewils, Brian A. Davis, Eric R. Anderson, Matthew Gimpert, Yan Zheng, Brian E. Duffy, Yixi Xiao
  • Patent number: 11796385
    Abstract: The present application discloses an optical receiving device and an optical sensing device. The optical receiving device includes a lens assembly, a reflecting member, and a photosensitive member. The lens assembly includes at least one lens. The reflecting member is located on a transmission path of light passing through the lens assembly. The reflecting member has a reflecting surface. The reflecting surface is configured to reflect the light passing through the lens assembly. The photosensitive member has a photosensitive surface. The photosensitive surface is configured to receive light reflected by the reflecting surface. After passing through the lens assembly, a detecting echo light beam reflected back from a target object is reflected by the reflecting surface of the reflecting member, so that the light is transmitted to the photosensitive surface of the photosensitive member intensively.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: October 24, 2023
    Assignee: SUTENG INNOVATION TECHNOLOGY CO., LTD.
    Inventors: Zhihong Qi, Ying Yang
  • Publication number: 20230335695
    Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2-150.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Inventors: Min-Hsun HSIEH, Hsin-Mao LIU, Ying-Yang SU
  • Patent number: 11781177
    Abstract: Compositions comprising covalently modified and mutated biotin-binding proteins, particularly biotin-binding proteins having a negative charge at physiological pH, are provided. Methods of producing such proteins are also provided, as are methods of immobilizing, sequencing, and making nucleic acids employing such proteins.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: October 10, 2023
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Satwik Kamtekar, Lubomir Sebo, Leewin Chern, Thomas Linsky, Jeremiah Hanes, Erik Miller, Ying Yang, Stephen Yue
  • Publication number: 20230303742
    Abstract: This disclosure provides a fluorine-containing mixture and a fluorine-containing super-oleophobic microporous membrane using the fluorine-containing mixture as a raw material, as well as preparation methods and applications for the fluorine-containing mixture and the fluorine-containing super-oleophobic microporous membrane. The fluorine-containing mixture of the present disclosure comprises, by weight percentage, the following components: Component A: 50%˜90%; Component B: 3%˜25%; Component C: 0%˜35%; Component D: 0%˜3%; wherein Component A comprises high molecular weight polytetrafluoroethylene homopolymer or copolymer dispersion resin; Component B comprises one or more fluorine-containing alkyl acrylate monomers; Component C comprises one or more fluorine-free acrylates; Component D comprises high temperature free radical initiator.
    Type: Application
    Filed: June 2, 2023
    Publication date: September 28, 2023
    Applicant: Zhejiang Hyproof Technology Co., Ltd
    Inventors: Huisheng WU, Ying YANG
  • Publication number: 20230305956
    Abstract: A method for accelerating reading of a storage medium, a read acceleration hardware module, and a memory are provided. The method includes: receiving logical block address (LBA) information issued from a front end (FE) of a memory; performing a table lookup operation based on a table lookup algorithm fixed in hardware to acquire valid physical media address (PMA) information corresponding to the LBA information; and converting the valid PMA information to Nand physical address (NPA) information based on an address translation algorithm fixed in the hardware, and reading corresponding data from a storage medium of the memory according to the NPA information.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 28, 2023
    Applicant: DapuStor Corporation
    Inventors: Xiang Chen, Xueming Cao, Ying Yang, Peng Huang, Zhou Yang
  • Patent number: 11767673
    Abstract: A roofing composite membrane includes a base layer including a first thermoplastic polyolefin. A weight of the base layer is between 5 and 25 grams per square foot. A coating layer at least partially coats the base layer. The coating layer includes at least one inorganic additive, and a second thermoplastic polyolefin including polypropylene and having a melt flow rate between 0.5 grams per 10 minutes and 12 grams per 10 minutes.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 26, 2023
    Assignee: BMIC LLC
    Inventors: Li-Ying Yang, Jeffrey Avitabile, Joseph Nigro, Daniel Podewils, Brian A. Davis, Eric R. Anderson, Matthew Gimpert, Yan Zheng, Brian E. Duffy, Yixi Xiao
  • Publication number: 20230287952
    Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 14, 2023
    Inventors: Yi Chen HO, Chih Ping LIAO, Chien Ting LIN, Jie-Ying YANG, Wei-Ming WANG, Ker-Hsun LIAO, Chi-Hsun LIN
  • Patent number: 11742389
    Abstract: A method for forming a semiconductor structure includes providing a substrate including a first region with a first gate structure and a second region with a second gate structure. First to third dielectric layers are formed on the substrate. The third dielectric layer is patterned to form a first portion in the first region and a second portion in the second region. The second region is covered and at least a portion of the first portion is removed to form a first mask. The second dielectric layer is pattern by using the first mask and the second portion as the second mask to expose a portion of the first dielectric layer. The portion of the first dielectric layer is removed to form a first stacked spacer on the first gate structure and a second stacked spacer on the second gate structure.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: August 29, 2023
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Hung-Chih Tan, Hsing-Chao Liu, Chih-Cherng Liao, Hsiao-Ying Yang, Kai-Chuan Kan, Jing-Da Li
  • Patent number: 11728310
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: August 15, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Patent number: 11723965
    Abstract: The invention provides eTEC linked glycoconjugates comprising a saccharide covalently conjugated to a carrier protein through a (2-((2-oxoethyl)thio)ethyl)carbamate (eTEC) spacer, immunogenic compositions comprising such glycoconjugates, and methods for the preparation and use of such glycoconjugates and immunogenic compositions.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: August 15, 2023
    Assignee: Pfizer Inc.
    Inventors: Jianxin Gu, Jin-hwan Kim, Avvari Krishna Prasad, Yu-ying Yang
  • Patent number: 11718766
    Abstract: The present invention provides alkyl substituted polysaccharide compositions and methods of repairing substrates involving use of the alkyl substituted polysaccharide compositions.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: August 8, 2023
    Assignee: Clemson University
    Inventors: Marek W. Urban, Ying Yang
  • Publication number: 20230236553
    Abstract: A training method of a semiconductor process prediction model, a semiconductor process prediction device, and a semiconductor process prediction method are provided. The training method of the semiconductor process prediction model includes the following steps. The semiconductor process was performed on several samples. A plurality of process data of the samples are obtained. A plurality of electrical measurement data of the samples are obtained. Some of the samples having physical defects are filtered out according to the process data. The semiconductor process prediction model is trained according to the process data and the electrical measurement data of the filtered samples.
    Type: Application
    Filed: March 15, 2022
    Publication date: July 27, 2023
    Inventors: Chia-Wei CHEN, Ching-Pei LIN, Chung-Yi CHIU, Te-Hsuan CHEN, Ming-Wei CHEN, Hsiao-Ying YANG
  • Publication number: 20230238262
    Abstract: A semiconductor manufacturing process prediction method and a semiconductor manufacturing process prediction device are provided. The semiconductor manufacturing process prediction method includes the following steps. A plurality of process data are obtained. According to the process data, a machine learning model is used to execute prediction and obtain a prediction confidence and a prediction yield. Whether the prediction confidence is lower than a predetermined level is determined. If the prediction confidence is lower than the predetermined level, the machine learning model is modified. According to the process data, the prediction yield is adjusted.
    Type: Application
    Filed: March 15, 2022
    Publication date: July 27, 2023
    Inventors: Hsiao-Ying YANG, Ching-Pei LIN, Chung-Yi CHIU, Ming-Wei CHEN, Te-Hsuan CHEN, Chia-Wei CHEN, Wen-Shan HUANG
  • Patent number: 11707529
    Abstract: The present invention relates generally to glycoconjugates comprising a saccharide covalently conjugated to a carrier protein through a spacer containing ((2-oxoethyl)thio)). In an aspect the invention provides oxo-eT linked glycoconjugates comprising a saccharide covalently conjugated to a carrier protein through a ((2-oxoethyl)thio) spacer having the formula (I): wherein: A is a group (C?X)m wherein X is S or O and m is 0 or 1; B is a bond, O, or CH2; and when m is 0, B can also be (C?O); R is a C2-C16 alkylene, C2-C16 heteroakylene, NH—C(?O)—C2-C16 alkylene, or NH—C(?O)—C2-C16 heteroakylene, wherein said alkylene and heteroalkylene are optionally substituted by 1, 2 or 3 groups independently selected from COOR? where R? is selected from H, methyl, ethyl or propyl. The invention further relates to immunogenic compositions comprising such glycoconjugates, and to methods for the preparation and use of such glycoconjugates and immunogenic compositions.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: July 25, 2023
    Assignee: Pfizer Inc.
    Inventors: Jianxin Gu, Rajesh Kumar Kainthan, Jin-Hwan Kim, Avvari Krishna Prasad, Yu-Ying Yang
  • Patent number: 11710812
    Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: July 25, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Hsin-Mao Liu, Ying-Yang Su
  • Patent number: 11702494
    Abstract: This disclosure provides a fluorine-containing mixture and a fluorine-containing super-oleophobic microporous membrane using the fluorine-containing mixture as a raw material, as well as preparation methods and applications for the fluorine-containing mixture and the fluorine-containing super-oleophobic microporous membrane. The fluorine-containing mixture of the present disclosure comprises, by weight percentage, the following components: Component A: 50%˜90%; Component B: 3%˜25%; Component C: 0%˜35%; Component D: 0%˜3%; wherein Component A comprises high molecular weight polytetrafluoroethylene homopolymer or copolymer dispersion resin; Component B comprises one or more fluorine-containing alkyl acrylate monomers; Component C comprises one or more fluorine-free acrylates; Component D comprises high temperature free radical initiator.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: July 18, 2023
    Assignee: Zhejiang Hyproof Technology Co., Ltd
    Inventors: Huisheng Wu, Ying Yang
  • Publication number: 20230220244
    Abstract: Some embodiments relate to a roofing membrane. The roofing membrane comprises a scrim. The scrim has a top surface and a bottom surface. The roofing membrane comprises a cap layer on the top surface of the scrim. The cap layer comprises a first non-styrenic polypropylene polymer, a first polypropylene impact copolymer, and a first olefin block copolymer. The roofing membrane comprises a core layer on the bottom surface of the scrim. The core layer comprises a second non-styrenic polypropylene polymer, a second polypropylene impact copolymer, and a second olefin block copolymer. The roofing membrane is configured to prevent migration of at least one oil from a layer to the roofing membrane. Some embodiments relate to a roofing structure comprising the roofing membrane, a method for installing the roofing membrane, and the like.
    Type: Application
    Filed: January 6, 2023
    Publication date: July 13, 2023
    Inventors: Paul C. Lem, Li-Ying Yang
  • Publication number: 20230220675
    Abstract: Some embodiments relate to a roofing structure. The roofing structure comprises a plurality of roofing membranes positioned on a roofing substrate. Each of the plurality of roofing membranes comprises an edge portion that abuts or overlaps with, or is adjacent to, an edge portion of another roofing membrane, so as to define a plurality of seams between adjacent roofing membranes. The roofing structure further comprises a plurality of standing seam structures positioned over the plurality of seams so as to conceal the plurality of seams.
    Type: Application
    Filed: January 6, 2023
    Publication date: July 13, 2023
    Inventors: Daniel E. Boss, Li-Ying Yang, Eric R. Anderson, David Scott
  • Patent number: D993610
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: August 1, 2023
    Inventor: Ying Yang