Patents by Inventor Yoichi Inoue
Yoichi Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040235178Abstract: A glucose sensor system comprising the steps of using as a sample discriminating parameter a ratio (I/&Dgr;I) of a measured current value I to the time-differential value of the current value &Dgr;I, defining a discrimination function that discriminates whether a sample is blood or control fluid and uses the discriminating parameter as an independent variable, quantitating as a discriminating index a numeric value obtained by substituting a discriminating parameter value into this discrimination function, and automatically discriminating, based on this index, whether the sample is blood or a control fluid, whereby a kind of the sample can be automatically quantitated by measuring electric current when a sensor system is used for quantitating the concentration of an analysis object in the sample.Type: ApplicationFiled: June 29, 2004Publication date: November 25, 2004Applicants: Matsushita Electric Industrial Co., Ltd., Arkray, Inc.Inventors: Hiroyuki Tokunaga, Shoji Miyazaki, Hideyuki Baba, Yoichi Inoue, Kazuo Iketaki, Katsumi Hamamoto
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Publication number: 20040231698Abstract: When the hatch of a substrate washing chamber 5 is opened to receive a substrate, certain valves are closed, and a valve is opened, supply CO2 to purge the substrate washing chamber 5 to and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamber so that the CO2 expels any gas and unwanted air from the substrate washing chamber 5 and the conduits. Thereafter, super critical CO2 is used to wash the substrate and clean the circulation line. The flow of supercritical CO2 is sent to the substrate washing chamber 5. After flowing through the circulation line, including a circulation channel 11, it passes through a bypass channel 12 to a decompressor 7. Any chemicals or organic substances left in the circulation line are continuously sent to a separation/recover bath 8 together with the flow.Type: ApplicationFiled: June 28, 2004Publication date: November 25, 2004Applicants: Dainippon Screen Mfg. Co., Ltd., Kobe Steel, Ltd.Inventors: Ikuo Mizobata, Yusuke Muraoka, Kimitsugu Saito, Ryuji Kitakado, Yoichi Inoue, Yoshihiko Sakashita, Katsumi Watanabe, Masahiro Yamagata, Hisanori Oshiba
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Publication number: 20040194884Abstract: A compact high-pressure process apparatus is provided, which ensures an easy loading of a material to be process to a process chamber, as well as a high reliable operation and a high productivity. For this purpose, an opening 9 is disposed in a pressure vessel 7 including a process chamber 4, and a lid member 10 for closing the opening 9 may be pressed there against by means of a press apparatus 15. In this case, a moving mechanism for moving the lid member 10 relative to the opening 9 in the direction parallel to a contact surface of the lid menber 10 and the pressure vessel 7 is further provided.Type: ApplicationFiled: April 27, 2004Publication date: October 7, 2004Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd)Inventors: Yoshihiko Sakashita, Katsumi Watanabe, Yoichi Inoue, Hideshi Yamane
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Publication number: 20040123484Abstract: Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.Type: ApplicationFiled: October 21, 2003Publication date: July 1, 2004Applicants: KABUSHIKI KAISHA KOBE SEIKO SHO, DAINIPPON SCREEN MFG. CO., LTD.Inventors: Tetsuya Yoshikawa, Yoichi Inoue, Katsumi Watanabe, Kaoru Masuda, Katsuyuki Iijima, Tomomi Iwata, Yusuke Muraoka, Kimitsugu Saito, Ikuo Mizobata
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Publication number: 20040127033Abstract: That surface of an electrode plate 20 which is opposite to a susceptor 10 has a projection shape. The electrode plate 20 is fitted in an opening 26a of shield ring 26 at a projection 20a. At this time, the thickness of the projection 20a is approximately the same as the thickness of the shield ring 26. Accordingly, the electrode plate 20 and the shield ring 26 form substantially the same plane. The major surface of the projection 20a has a diameter 1.2 to 1.5 times the diameter of a wafer W. The electrode plate 20 is formed of, for example, SiC.Type: ApplicationFiled: January 29, 2004Publication date: July 1, 2004Inventors: Koichi Takatsuki, Hiraku Yoshitaka, Shigeo Ashigaki, Yoichi Inoue, Takashi Akahori, Shuuichi Ishizuka, Syoichi Abe, Takashi Suzuki, Kohei Kawamura, Hidenori Miyoshi, Gishi Chung, Yasuhiro Oshima, Hiroyuki Takahashi
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Publication number: 20040103922Abstract: In a high pressure processing method for removing an unnecessary substrate on the surface of the surface of a workpiece by bringing it into contact with supercritical carbon dioxide and additives in a high-pressure chamber, removing the unnecessary substance on the workpiece, first rinsing and second rinsing are performed under a substantially same pressure with continuous flowing of supercritical carbon dioxide.Type: ApplicationFiled: October 1, 2003Publication date: June 3, 2004Inventors: Yoichi Inoue, Kaoru Masuda, Katsuyuki Iijima
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Patent number: 6733592Abstract: The present invention has an object to obtain a small-size, high-temperature and high-pressure treatment device adapted to treat semiconductor wafers. The high-temperature and high-pressure device of the invention is intended to treat semiconductor wafers in an atmosphere of high-temperature and high-pressure gas, and comprises a pressure vessel having at a lower portion thereof an opening for putting the semiconductor wafers in and out, a lower lid disposed so as to be vertically movable for opening and closing the lower opening, wafer transfer means for stacking and unstacking the semiconductor wafers onto and from the lower lid, and a heater attached to the lower lid for heating the semiconductor wafers.Type: GrantFiled: May 13, 2002Date of Patent: May 11, 2004Assignee: Kobe Steel, Ltd.Inventors: Takao Fujikawa, Yoichi Inoue, Yutaka Narukawa, Takahiko Ishii, Tsuneharu Masuda, Makoto Kadoguchi, Yoshihiko Sakashita
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Patent number: 6703316Abstract: A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.Type: GrantFiled: April 26, 2002Date of Patent: March 9, 2004Assignees: Kabushiki Kaisha Kobe Seiko Sho, Dainippon Screen Mfg. Co., Ltd.Inventors: Yoichi Inoue, Yoshihiko Sakashita, Katsumi Watanabe, Nobuyuki Kawakami, Takahiko Ishii, Yusuke Muraoka, Kimitsugu Saito, Tomomi Iwata, Ikuo Mizobata, Takashi Miyake, Ryuji Kitakado
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Patent number: 6642234Abstract: The present invention relates to acrylonitrile compounds of formula (1): [wherein, R is a C1-C6 alkyl, a C3-C7 cycloalkyl optionally substituted by a C1-C4 alkyl, a naphthyl, etc., R1 is H, a halogen, a C1-C6 alkyl, etc., A is specific 5-membered aromatic heterocyclic ring containing two hetero atoms selected from N, O and S, etc., B is H, a C1-C4 alkyl, a C2-C4 alkoxyalkyl, etc.] Said compounds are useful as agricultural chemicals, in particular insecticides and acaricides.Type: GrantFiled: August 13, 2001Date of Patent: November 4, 2003Assignee: Nissan Chemical Industries, Ltd.Inventors: Tomoyuki Ogura, Akira Numata, Hideki Ueno, Yoshihide Masuzawa, Toshiro Miyake, Yoichi Inoue, Norihiko Mimori, Shinji Takii
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Patent number: 6576117Abstract: A predetermined voltage is applied to a biosensor twice to promote an electrochemical reaction, and the following parameters (P1 and P2) are calculated from the values of detected current. A statistical technique is used with these parameters to compensate for errors so that the concentration of an object can be determined. P1: the ratio (If/Ib) of the maximum current (If) or a current occurring the maximum in the first excitation to a current (Ib) read at any point in the second excitation. P2: a current (Ib) read at any point in the second excitation.Type: GrantFiled: January 29, 2001Date of Patent: June 10, 2003Assignee: ArkrayInventors: Kazuo Iketaki, Yoichi Inoue, Katsumi Hamamoto
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Publication number: 20030026677Abstract: A compact high-pressure process apparatus is provided, which ensures an easy loading of a material to be process to a process chamber, as well as a high reliable operation and a high productivity. For this purpose, an opening 9 is disposed in a pressure vessel 7 including a process chamber 4, and a lid member 10 for closing the opening 9 may be pressed thereagainst by means of a press apparatus 15. In this case, a moving mechanism for moving the lid member 10 relative to the opening 9 in the direction parallel to a contact surface of the lid menber 10 and the pressure vessel 7 is further provided.Type: ApplicationFiled: August 2, 2002Publication date: February 6, 2003Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd)Inventors: Yoshihiko Sakashita, Katsumi Watanabe, Yoichi Inoue, Hideshi Yamane
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Publication number: 20020170577Abstract: When the hatch of a substrate washing chamber 5 is opened to place a substrate therein, valves V1, V2, V3, V4 and V6 are closed, only a valve V5 being opened. Thus, gaseous CO2 is supplied into the substrate washing chamber 5 to perform a chamber purge for preventing surrounding air components from straying in. As the hatch of the substrate washing chamber 5 is closed, the valve V6 is further closed to form a vent line for the substrate washing chamber 5. Thus, the gas residing within the substrate washing chamber 5 and the conduits is expelled by CO2 gas, into the surrounding air, thereby performing a chamber purge to prevent any unwanted surrounding air components from being left. Thereafter, super critical CO2 is used to wash the substrate.Type: ApplicationFiled: May 16, 2002Publication date: November 21, 2002Applicant: Dainippon Screen Mfg. Co., Ltd.Inventors: Ikuo Mizobata, Yusuke Muraoka, Kimitsugu Saito, Ryuji Kitakado, Yoichi Inoue, Yoshihiko Sakashita, Katsumi Watanabe, Masahiro Yamagata, Hisanori Oshiba
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Publication number: 20020160625Abstract: A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.Type: ApplicationFiled: April 26, 2002Publication date: October 31, 2002Applicant: KABUSHIKI KAISHA KOBE SEIKO SHOInventors: Yoichi Inoue, Yoshihiko Sakashita, Katsumi Watanabe, Nobuyuki Kawakami, Takahiko Ishii, Yusuke Muraoka, Kimitsugu Saito, Tomomi Iwata, Ikuo Mizobata, Takashi Miyake, Ryuji Kitakado
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Publication number: 20020148492Abstract: A high-pressure processing apparatus for removing unnecessary matters on objects to be processed by bringing a high-pressure fluid and a chemical liquid other than the high-pressure fluid into contact with the objects to be processed in a pressurized state is provided with a plurality of high-pressure processing chambers, a common high-pressure fluid supply unit for supplying the high-pressure fluid to each one of the high-pressure processing chambers, a common chemical liquid supply unit for supplying the chemical liquid to the each high-pressure processing chambers, and a separating unit for separating gaseous components from a mixture of the high-pressure fluid and the chemical liquid discharged from the high-pressure processing chambers after the objects are processed.Type: ApplicationFiled: April 17, 2002Publication date: October 17, 2002Applicant: Kabushiki Kaisha Kobe Seiko ShoInventors: Masahiro Yamagata, Hisanori Oshiba, Yoshihiko Sakashita, Yoichi Inoue, Yusuke Muraoka, Kimitsugu Saito, Ikuo Mizobata, Ryuji Kitakado
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Publication number: 20020139692Abstract: A glucose sensor system comprising the steps of using as a sample discriminating parameter a ratio (I/&Dgr;I) of a measured current value I to the time-differential value of the current value &Dgr;I, defining a discrimination function that discriminates whether a sample is blood or control fluid and uses the discriminating parameter as an independent variable, quantitating as a discriminating index a numeric value obtained by substituting a discriminating parameter value into this discrimination function, and automatically discriminating, based on this index, whether the sample is blood or a control fluid, whereby a kind of the sample can be automatically quantitated by measuring electric current when a sensor system is used for quantitating the concentration of an analysis object in the sample.Type: ApplicationFiled: October 29, 2001Publication date: October 3, 2002Inventors: Hiroyuki Tokunaga, Shoji Miyazaki, Hideyuki Baba, Yoichi Inoue, Kazuo Iketaki, Katsumi Hamamoto
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Publication number: 20020129901Abstract: The present invention has an object to obtain a small-size, high-temperature and high-pressure treatment device adapted to treat semiconductor wafers. The high-temperature and high-pressure device of the invention is intended to treat semiconductor wafers in an atmosphere of high-temperature and high-pressure gas, and comprises a pressure vessel having at a lower portion thereof an opening for putting the semiconductor wafers in and out, a lower lid disposed so as to be vertically movable for opening and closing the lower opening, wafer transfer means for stacking and unstacking the semiconductor wafers onto and from the lower lid, and a heater attached to the lower lid for heating the semiconductor wafers.Type: ApplicationFiled: May 13, 2002Publication date: September 19, 2002Applicant: Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.)Inventors: Takao Fujikawa, Yoichi Inoue, Yutaka Narukawa, Takahiko Ishii, Tsuneharu Masuda, Makoto Kadoguchi, Yoshihiko Sakashita
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Patent number: 6203306Abstract: An apparatus for heating a rubber-metal plate composite formed of a plurality of unvulcanized rubber layers and metal plates, each being overlaid alternately, by induction heating, includes an induction coil for applying a magnetic field to the composite and heating the metal plates due to eddy currents generated by the magnetic field, a power unit for applying an alternating current to the induction coil to generate the magnetic field, and a mold to confine the periphery of the composite. The mold is made of a nonmagnetic or weakly magnetic material with electrical conductivity, such as austenitic stainless steel. The mold generates enough heat to function as the heating unit by generating eddy currents in the conductive mold while magnetic flux permeates the mold substantially without loss and reaches the composite therein.Type: GrantFiled: February 7, 2000Date of Patent: March 20, 2001Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Yoichi Inoue, Shigeru Yuki, Hirohiko Fukumoto, Shigeto Adachi, Kashiro Ureshino, Takayuki Sato, Yoshinori Kurokawa, Kazuhiko Sakiyama
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Patent number: 6109903Abstract: A vulcanized rubber-metal plate composite is obtained by overlaying a plurality of unvulcanized rubber layers and metal plates alternately and heating thereof by magnetic induction heating. The vulcanized rubber-metal plate composite is obtained by placing a composite of a plurality of unvulcanized rubber layers and metal plates, each being overlaid alternately, into a place affected by an induction coil; heating the metal plates due to eddy currents formed in the metal plates by applying an alternating current to the induction coil; and vulcanizing the unvulcanized rubber layers due to heat conduction from the heated metal plates.Type: GrantFiled: September 30, 1997Date of Patent: August 29, 2000Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Yoichi Inoue, Shigeru Yuki, Hirohiko Fukumoto, Shigeto Adachi, Kashiro Ureshino, Takayuki Sato, Yoshinori Kurokawa, Kazuhiko Sakiyama
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Patent number: 5730847Abstract: The present invention relates to an arc ion plating device utilizing a vacuum arc discharge to be utilized for the surface process of works and to an arc ion plating system provided with the above-mentioned device, and the present invention offers the device and the system which are able to realize extremely high productivity by an efficient handling of works. The device according to the present invention comprises a rod-shaped evaporation source and works to be coated with a film being disposed so as to surround the rod-shaped evaporation source, The device is so constituted that the works can be moved relative to the rod-shaped evaporation source in the axial direction of the rod-shaped evaporation source.Type: GrantFiled: December 23, 1994Date of Patent: March 24, 1998Assignee: Kabushiki Kaisha KobeseikoshoInventors: Koji Hanaguri, Kunihiko Tsuji, Homare Nomura, Hiroshi Tamagaki, Hiroshi Kawaguchi, Katsuhiko Shimojima, Hirofumi Fujii, Toshiya Kido, Takeshi Suzuki, Yoichi Inoue
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Patent number: 5116404Abstract: The present invention provides novel uracil derivatives and pesticides which contain the novel uracil derivatives as an active ingredient, and exhibit preventing and controlling effects against harmful living things, especially agricultural insect pests, sanitary insect pests, stored product insect pests, house insect pests and veterinary insect pests at a very low drug-concentration.Type: GrantFiled: January 8, 1991Date of Patent: May 26, 1992Assignee: Nissan Chemical Industries Ltd.Inventors: Shigeru Ishii, Kazunari Nakayama, Kazuo Yagi, Jun Satow, Kenzou Fukuda, Kaoru Itoh, Toshiyuki Umehara, Masaki Kudo, Yoichi Inoue, Tsutomu Nawamaki, Shigeomi Watanabe