Abstract: Disclosed is a connector for preventing unlocking which includes a signal pin transferring a signal; a body into which the signal pin is inserted and which is electrically isolated from the signal pin; a first housing having a hollow portion into which one end of the body is inserted, a thread groove and at least one protruding portion or a plurality of fixing grooves formed at an inner circumferential surface of the other end thereof; and a second housing having a hollow portion into which the other body end is inserted and through which the second housing is moved along an outer circumferential surface of the body in an axial direction.

Abstract: The present invention relates to a magnetic chuck.

Abstract: There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip.

Abstract: The method of designing a flash translation layer includes receiving a logical address according to an external request and mapping a physical address that corresponds to the logical address. The mapping manages continuous logical addresses and physical addresses corresponding to the logical addresses as one mapping unit.

Abstract: A grounding unit for a high-frequency connector is provided, wherein the grounding unit may include a grounding unit body configured to be selectively fixed to the high-frequency connector; and a grounding fixation unit configured to be connected to the grounding unit body, to be in pressure contact with a grounding region of a printed circuit board (PCB) under elastic force applied in proportion to a thickness of the PCB, and to electrically connect the high-frequency connector to the grounding region.

Abstract: There is provided a micro connector mounted on a printed circuit board (PCB) comprising a core conductor including a contact terminal formed of two or more insertion panels and a signal transmission panel; a body including a trunk formed in the shape of a barrel surrounding the contact terminal, and one or more projection arms extended from a bottom of the trunk; a dielectric; and a tail including a bottom panel disposed opposite to the signal transmission panel, interposing the body therebetween, and supporting the dielectric.

Abstract: There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.

Abstract: A grounding unit for a high-frequency connector is provided, wherein the grounding unit may include a grounding unit body configured to be selectively fixed to the high-frequency connector; and a grounding fixation unit configured to be connected to the grounding unit body, to be in pressure contact with a grounding region of a printed circuit board (PCB) under elastic force applied in proportion to a thickness of the PCB, and to electrically connect the high-frequency connector to the grounding region.

Abstract: A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested; a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes; a frame having a plurality of guide holes for fixedly positioning the respective probe units; an interposer array arranged below the space transformers for supporting the space transformers, interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; and a printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals.

Abstract: A probe block mounted on a probe card is provided for achieving fine pitch probes. A probe block for a probe card of a semiconductor test device according to the present invention includes a guide member and a probe. A guide member includes pairs of upper and lower holes and middle holes each interconnecting the upper and lower holes of each pair. A probe includes a first pin tip protruded through a corresponding upper hole for contacting a pad of a device to be tested and a second pin tip protruded through a corresponding lower hole for transferring an electrical signal to the device and a bridge part situated within the middle hole for interconnecting the first and second pin tips. The upper, lower, and middle holes allow the probe to elastically moves in vertical direction. The probe block of the present invention is advantageous in that the probes are supported by guide members so as not to be bent while maintaining a fine pitch.

Abstract: There is provided a printed circuit board (PCB) comprising a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer; a second bonding sheet disposed above the first dielectric layer; a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer.

Abstract: There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip.

Abstract: Provided is a flexible board for transmitting signals which includes: a dielectric on which different signal lines are respectively disposed on independent separation regions on opposite surfaces of opposite sides thereof; a metallic shielding portion that is spaced apart from each other at intervals at a boundary between the separation regions and shields interference between the different signal lines; and a ground conductive layer that is formed on a portion of the dielectric and is electrically connected to the metallic shielding portion.

Abstract: There is provided a micro connector mounted on a printed circuit board (PCB) comprising a core conductor including a contact terminal formed of two or more insertion panels and a signal transmission panel; body including a trunk formed in the shape of a barrel surrounding the contact terminal, and one or more projection arms extended from a bottom of the trunk; a dielectric; and a tail including a bottom panel disposed opposite to the signal transmission panel, interposing the body therebetween, and supporting the dielectric.

Abstract: Disclosed is a semiconductor package pickup apparatus. The apparatus includes a picker base formed with first and second main feeding holes, which are connected to each pneumatic line providing a pneumatic pressure and aligned in a dual-layer structure, and an adsorption pad coupled to a lower portion of the picker base and formed with adsorption holes connected to the first and second main feeding holes. The pneumatic pressure supplied into the first and second main feeding holes is independently controlled, so that the apparatus easily loads or picks up semiconductor packages, even if the size of the semiconductor packages becomes reduced.

Abstract: The present disclosure provides a printed circuit board (PCB) comprising a first ground layer extended in one direction a first dielectric layer laminated on the first ground layer and extended in the same direction as that of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer; and a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line, wherein the plurality of first ground patterns expose the first dielectric layer.

Abstract: A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested; a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes; a frame having a plurality of guide holes for fixedly positioning the respective probe units; an interposer array arranged below the space transformers for supporting the space transformers, interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; and a printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals.

Abstract: The present invention is a magnetic chuck that is chiefly used for machining tools. The magnetic chuck has a structure in which an accommodation hole (110a) is formed to pass through a chuck main body (110), a first magnetic element (141) is exposed in the direction of the top surface of the chuck main body (110), and an AlNiCo magnet (120) is exposed in the direction of the bottom surface of the chuck main body (110), so that respective objects (200 and 300) to be attached can be attached to two opposite surfaces of the magnetic chuck (100), with the result that the magnetic chuck (100) can be used in various ways. Furthermore, the lateral part (112) of the chuck main body (110) is not unnecessary, so that the weight of the magnetic chuck (100) itself is greatly reduced and thus the product cost is reduced, the thickness of the magnetic chuck (100) is reduced, and convenience of use can be greatly improved.

Abstract: A coaxial connecting device is provided for making an electrical connection between a coaxial cable and a device under test. A coaxial connecting device electrically connects a coaxial cable to a signal pad and a ground pad. The coaxial contractor of the present invention includes a signal pin for electrically connecting a signal conductor of the coaxial cable to the signal pad; a ground connector for electrically connecting a ground conductor of the coaxial cable to the ground pad; a cylindrical guide tube surrounding the ground conductor for elastically contacting the ground connector while maintaining a predetermined distance with the signal pin; and a dielectric member surrounding a part of the signal pin for electrically isolating the cylindrical guide tube and the signal pin from each other and coaxially maintaining the guide tube and the signal pin.

Abstract: A probe block mounted on a probe card is provided for achieving fine pitch probes. A probe block for a probe card of a semiconductor test device according to the present invention includes a guide member and a probe. A guide member includes pairs of upper and lower holes and middle holes each interconnecting the upper and lower holes of each pair. A probe includes a first pin tip protruded through a corresponding upper hole for contacting a pad of a device to be tested and a second pin tip protruded through a corresponding lower hole for transferring an electrical signal to the device and a bridge part situated within the middle hole for interconnecting the first and second pin tips. The upper, lower, and middle holes allow the probe to elastically moves in vertical direction. The probe block of the present invention is advantageous in that the probes are supported by guide members so as not to be bent while maintaining a fine pitch.