Abstract: There is provided a printed circuit board (PCB) comprising a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer; a second bonding sheet disposed above the first dielectric layer, a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer.

Abstract: The present disclosure provides a printed circuit board (PCB) comprising a first ground layer extended in one direction a first dielectric layer laminated on the first ground layer and extended in the same direction as that of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer; and a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line, wherein the plurality of first ground patterns expose the first dielectric layer.

Abstract: A connector capable of being connected to a printed circuit board (PCB) is provided. A female connector according to an embodiment of the present invention includes a core conductor, a body, and a housing. The core conductor is formed of a single body including a contact terminal formed of two or more insertion panels forming an insertion space where a signal pin of a male connector is inserted and a signal transmission panel connected to a bottom of the contact terminal and electrically connected a signal line of the PCB. The body includes an insertion part electrically insulated from the core conductor and gaping when coupling with the male connector and is formed in a single body including a trunk surrounding the contact terminal and a plurality of supporters connected to a bottom of the trunk. The housing stores the core conductor and the bottom of the trunk of the body or more.

Abstract: The method of designing a flash translation layer includes receiving a logical address according to an external request and mapping a physical address that corresponds to the logical address. The mapping manages continuous logical addresses and physical addresses corresponding to the logical addresses as one mapping unit.

Abstract: A coaxial connecting device is provided for making an electrical connection between a coaxial cable and a device under test. A coaxial connecting device electrically connects a coaxial cable to a signal pad and a ground pad. The coaxial contractor of the present invention includes a signal pin for electrically connecting a signal conductor of the coaxial cable to the signal pad; a ground connector for electrically connecting a ground conductor of the coaxial cable to the ground pad; a cylindrical guide tube surrounding the ground conductor for elastically contacting the ground connector while maintaining a predetermined distance with the signal pin; and a dielectric member surrounding a part of the signal pin for electrically isolating the cylindrical guide tube and the signal pin from each other and coaxially maintaining the guide tube and the signal pin.

Abstract: Disclosed is a semiconductor package pickup apparatus. The apparatus includes a picker base formed with first and second main feeding holes, which are connected to each pneumatic line providing a pneumatic pressure and aligned in a dual-layer structure, and an adsorption pad coupled to a lower portion of the picker base and formed with adsorption holes connected to the first and second main feeding holes. The pneumatic pressure supplied into the first and second main feeding holes is independently controlled, so that the apparatus easily loads or picks up semiconductor packages, even if the size of the semiconductor packages becomes reduced.

Abstract: The present invention is a magnetic chuck that is chiefly used for machining tools. The magnetic chuck has a structure in which an accommodation hole (110a) is formed to pass through a chuck main body (110), a first magnetic element (141) is exposed in the direction of the top surface of the chuck main body (110), and an AlNiCo magnet (120) is exposed in the direction of the bottom surface of the chuck main body (110), so that respective objects (200 and 300) to be attached can be attached to two opposite surfaces of the magnetic chuck (100), with the result that the magnetic chuck (100) can be used in various ways. Furthermore, the lateral part (112) of the chuck main body (110) is not unnecessary, so that the weight of the magnetic chuck (100) itself is greatly reduced and thus the product cost is reduced, the thickness of the magnetic chuck (100) is reduced, and convenience of use can be greatly improved.

Abstract: A board mount type right angle coaxial connector has a cylindrical body and a main body containing a dielectric and an air dielectric, respectively. The bodies are connected to each other at a right angle. The coaxial connector further has a conductor surrounded with the dielectric and the air dielectric. The conductor has also a right-angle structure and is protruded from a front side of the main body. An inner wall of the main body has a decreasing width and the conductor has a decreasing diameter. The coaxial connector may further has a fixing member for preventing pin rotation, a impedance matching ring, and ground supporters for mounting on the board.

Abstract: Disclosed coaxial connector comprises (A) a pin having a soldering section to be soldered to a central conductor of the coaxial cable and a contact section extending from the soldering section and electrically interconnected to a male connector, (B) a dielectric block having a cylindrical portion including a through hole to which the pin is inserted, a body of chamfered structure and being connected to the cylindrical portion, and a cover leg extending from the body in an opposite direction from the cylindrical portion, and (C) a main body having a cylindrical portion including a hole for receiving the dielectric block to which the pin is inserted, a fastening flap for holding the coaxial cable, and a body electrically interconnected to the ground conductor of the coaxial cable.

Abstract: This invention relates to a method for manufacturing a composite structure to be used in architectural, civil and mechanical fields, by adopting a hardening process for filler (A) and fluid hardener (B) in a mould, where mechanical and physical properties are improved when the particle state of filler (A), the primary material, and the 1fluid state of hardener (B), the subsidiary material, are combined densely, without pores, in the mould (10) in a vacuum state maintained for the required time, and due to excellent workability secured in the process, various kinds of composite structures can be manufactured with ease in a large scale of production and at a lower costs.

Abstract: A board mount type right angle coaxial connector has a cylindrical body and a main body containing a dielectric and an air dielectric, respectively. The bodies are connected to each other at a right angle. The coaxial connector further has a conductor surrounded with the dielectric and the air dielectric. The conductor has also a right-angle structure and is protruded from a front side of the main body. An inner wall of the main body has a decreasing width and the conductor has a decreasing diameter. The coaxial connector may further has a fixing member for preventing pin rotation, a impedance matching ring, and ground supporters for mounting on the board.

Abstract: Disclosed is a sawing apparatus for manufacturing a semiconductor package, capable of simultaneously performing strip loading work and package unloading work during the sawing process to improve productivity of the semiconductor packages.

Abstract: Disclosed coaxial connector comprises (A) a pin having a soldering section to be soldered to a central conductor of the coaxial cable and a contact section extending from the soldering section and electrically interconnected to a male connector, (B) a dielectric block having a cylindrical portion including a through hole to which the pin is inserted, a body of chamfered structure and being connected to the cylindrical portion, and a cover leg extending from the body in an opposite direction from the cylindrical portion, and (C) a main body having a cylindrical portion including a hole for receiving the dielectric block to which the pin is inserted, a fastening flap for holding the coaxial cable, and a body electrically interconnected to the ground conductor of the coaxial cable.

Abstract: The present invention relates to a connection structure in which an inner conductor is combined with a detachable impedance compensator as well as a coaxial connector, an extendible pin and an impedance compensator used for the connection structure. Further, this invention relates to a microwave device connected both electrically and mechanically with the connection structure. An impedance compensation thereof means compensates electric discontinuities between the inner conductor and the extendible pin by mechanical arraying with a microwave device to be combined with the connection structure, whereby the protrusion formed at the impedance compensation means satisfies the conditions, b?a/5 and c?2b, when diameter of the impedance compensation means is a, thickness thereof is b, and size of the protrusion is c.

Abstract: The present invention relates to a connection structure in which an inner conductor is combined with a detachable impedance compensator as well as a coaxial connector, an extendible pin and an impedance compensator used for the connection structure. Further, this invention relates to a microwave device connected both electrically and mechanically with the connection structure. An impedance compensation thereof means compensates electric discontinuities between the inner conductor and the extendible pin by mechanical arraying with a microwave device to be combined with the connection structure, whereby the protrusion formed at the impedance compensation means satisfies the conditions, b?a/5 and c?2b, when diameter of the impedance compensation means is a, thickness thereof is b, and size of the protrusion is c.

Abstract: A vertical bonding wire inductor having a high quality (Q) factor and tunability, which can be manufactured using an existing wire bonding technology which is widely used for packaging integrated circuits, without an additional mask manufacturing process. The vertical bonding wire inductor includes at least one pair of bonding pads (3) occupying a predetermined area on a substrate (9) and one or more bonding wires (1) for connecting one or more pairs of bonding pads (3). The bonding wire (1) has a loop shape having a predetermined height. Due to the improved electrical characteristics, stability in process, tunability without an additional mask manufacturing process, and relatively low manufacturing cost, the vertical bonding wire inductor can be useful in production of economical microwaves devices.