Patents by Inventor Yong-hoon Kim
Yong-hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240032202Abstract: A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.Type: ApplicationFiled: February 13, 2023Publication date: January 25, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Yun KIM, Kyung Sang LIM, Seung Eun LEE, Yong Hoon KIM
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Patent number: 11882652Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.Type: GrantFiled: August 27, 2021Date of Patent: January 23, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yun Je Ji, Seung Eun Lee, Yong Hoon Kim
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Patent number: 11770898Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.Type: GrantFiled: June 16, 2020Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Eun Lee, Yong Hoon Kim, Jin Won Lee
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Patent number: 11765833Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.Type: GrantFiled: February 25, 2022Date of Patent: September 19, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Hui Jung, Seung Eun Lee, Yong Hoon Kim
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Patent number: 11758655Abstract: A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.Type: GrantFiled: March 29, 2021Date of Patent: September 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Eun Lee, Jae Woong Choi, Joo Hwan Jung, Yong Hoon Kim, Jin Won Lee
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Patent number: 11751335Abstract: A printed circuit board includes: a first substrate including a first cavity and first circuit units; and a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units, wherein the second substrate includes a first region and a second region, the first region of the second substrate includes an outermost circuit layer among the second circuit units, and circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate.Type: GrantFiled: January 25, 2022Date of Patent: September 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Ree Yoo, Seung Eun Lee, Joo Hwan Jung, Yong Hoon Kim
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Publication number: 20230207197Abstract: A multilayer electronic component may include a first internal electrode layer including a first dielectric layer and first to fourth internal electrodes disposed to be spaced apart from each other on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a fifth internal electrode disposed on the second dielectric layer, a body including a capacitance forming portion in which the first internal electrode layer and the second internal electrode layer are alternately disposed, a connection electrode penetrating through the first and second internal electrode layers, spaced apart from the first to fourth internal electrodes, and connected to the fifth internal electrode, first to fourth external electrodes disposed to be connected to the first to fourth internal electrodes, respectively, on the body, and a fifth external electrode disposed to be connected to the connection electrode on the body.Type: ApplicationFiled: April 15, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hoon KIM, Ji Hoon KIM, Gyoung Heon KO, Yong Hoon KIM
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Publication number: 20230178902Abstract: An antenna substrate includes a skin layer containing an insulating material, a ground layer containing a conductive material, an insulating layer disposed between the skin layer and the ground layer and including an insulating material different from the insulating material of the skin layer, a plurality of patch antennas disposed between the ground layer and the skin layer, a shielding member disposed between the ground layer and the skin layer, spaced apart from the plurality of patch antennas, and connected to the ground layer, and a shielding post connected to the shielding member, and protruding further than an outer surface of the skin layer, from the shielding member in a direction facing the skin layer, at least a portion of the shielding post being disposed between the plurality of patch antennas.Type: ApplicationFiled: April 12, 2022Publication date: June 8, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Moon Hee YI, Hae Kyo SEO, Yong Hoon KIM, Seung Eun LEE
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Publication number: 20230171895Abstract: A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.Type: ApplicationFiled: April 7, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Yun KIM, Seung Eun LEE, Yong Hoon KIM
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Publication number: 20230170339Abstract: A semiconductor package includes a first substrate, a first electronic component disposed on the first substrate, a second substrate disposed on the first substrate and provided with a cavity disposed in one surface of the second substrate, a first connection member connecting the first and second substrates to each other, a heat dissipation structure disposed on the second substrate and spaced apart from the first connection member, a second connection member disposed on the second substrate, and a via disposed on the second substrate, spaced apart from the heat dissipation structure, and connected to the first connection member. The second substrate includes a first region in which the cavity is disposed and a second region connected to the first substrate, and the heat dissipation structure is disposed in each of the first and second regions of the second substrate.Type: ApplicationFiled: March 31, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Moon Hee Yi, Seung Eun Lee, Yong Hoon Kim
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Publication number: 20230171900Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.Type: ApplicationFiled: March 25, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Woong CHOI, Yun Je JI, Seung Eun LEE, Yong Hoon KIM
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Patent number: 11638346Abstract: A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.Type: GrantFiled: March 18, 2021Date of Patent: April 25, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ha Kang, Yong Hoon Kim
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Publication number: 20230108748Abstract: An electronic component embedded substrate includes: an insulating material including a cavity formed in one surface thereof; a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity; solders disposed on side surfaces of the cavity; and an electronic component disposed in the cavity and at least partially in contact with the solders, wherein the protective layer has a material different from that of the insulating material.Type: ApplicationFiled: September 13, 2022Publication date: April 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yun Je JI, Yong Hoon KIM, Seung Eun LEE
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Publication number: 20230104939Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.Type: ApplicationFiled: February 25, 2022Publication date: April 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Hui Jung, Seung Eun Lee, Yong Hoon Kim
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Patent number: 11607433Abstract: The present invention relates to an Agathobaculum sp. strain having prophylactic or therapeutic effects on autism spectrum disorders, and use thereof. When the intestinal microorganism Agathobaculum sp. strain of the present invention was orally administered to valproic acid (VPA)-induced autism model mice and BTBR autism model mice, the effects of remarkably improving autism spectrum disorders including repetitive behaviors, hyperactivity, social deficiency and cognitive/memory dysfunction of the mice were observed, as compared with a non-treated control. Accordingly, it may be usefully applied to foods, drugs, or feeds for preventing or treating autism spectrum disorders, and thus is very useful in the relevant industries.Type: GrantFiled: December 12, 2018Date of Patent: March 21, 2023Assignee: HEALTHBIOMEInventors: Byoung Chan Kim, Kyoung Shim Kim, Chul Ho Lee, Dong Ho Chang, Yong-Hoon Kim, Jung-Ran Noh, Dong Hui Choi, Jung Hwan Hwang, Jun Go, Jaehun Kim, Hye-Yeon Park, Yun-Jung Seo, Young-Kyoung Ryu, In-Bok Lee, Young Keun Choi, Jung-Hyeon Choi
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Patent number: 11576261Abstract: A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.Type: GrantFiled: March 9, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joo Hwan Jung, Jae Woong Choi, Seung Eun Lee, Yong Hoon Kim, Jin Won Lee
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sp. strain having prophylactic or therapeutic effects on degenerative brain diseases and use thereof
Patent number: 11542468Abstract: Provided are an Agathobaculum sp. strain having prophylactic or therapeutic effects on degenerative brain diseases, and use thereof. Since the intestinal microorganism Agathobaculum butyriciproducens SR79 strain of the present invention may have effects of inhibiting neuroinflammation and effects of improving movement regulation and cognitive and memory functions in animal models with degenerative brain diseases such as Parkinson's disease and Alzheimer's disease, the strain may be effectively used in foods, medicines, or feeds for preventing or treating brain diseases including Alzheimer's disease, Parkinson's disease, mild cognitive impairment, etc., and therefore, it is very useful in the relevant industries.Type: GrantFiled: June 14, 2017Date of Patent: January 3, 2023Assignee: HEALTHBIOMEInventors: Byoung-Chan Kim, Chul-Ho Lee, Kyoung-Shim Kim, Myung-Hee Kim, Sang Jun Lee, Dong-Ho Chang, Doo-Sang Park, Jung Hwan Hwang, Yong-Hoon Kim, Dong-Hee Choi, Jung-Ran Noh, In-Bok Lee, Young-Keun Choi, Yun-Jung Seo, Jung-Hyeon Choi, Jun Go, Hye-Yeon Park, Young-Kyoung Ryu, Moon-Soo Rhee -
Patent number: 11521922Abstract: A printed circuit board includes a first wiring structure including first insulating layers and first wiring layers; a second wiring structure disposed on the first wiring structure and including second insulating layers and second wiring layers; and a third wiring structure disposed on the second wiring structure and including a third insulating layer and a third wiring layer disposed on the third insulating layer. At least a portion of at least one of the second wiring layers has a fine pitch, relatively finer than those of the first wiring layers and the third wiring layer, wherein at least a portion of one of the first wiring layers is connected to at least a portion of the third wiring layer through a first wiring via, and wherein the first wiring via penetrates at least one of the first insulating layers, the second insulating layers, and the third insulating layer.Type: GrantFiled: March 26, 2021Date of Patent: December 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joo Hwan Jung, Seung Eun Lee, Yong Hoon Kim
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Publication number: 20220384884Abstract: A pouch type lithium secondary battery may include an electrode assembly to which an electrode tab is attached; a pouch which includes an aluminum layer and a sealant layer and which encases the electrode assembly so that a portion of the electrode tab is exposed therefrom; a protrusion formed by sealant on a side of the pouch where the electrode tab is not exposed, in melting and flowing toward the electrode assembly then congealing to form a swelling on the pouch; and folds formed by bending a side of the pouch where the electrode tab is not exposed, wherein at least one of the folds includes the protrusion.Type: ApplicationFiled: November 15, 2021Publication date: December 1, 2022Applicants: Hyundai Motor Company, Kia CorporationInventors: Sang Mok PARK, Yoon Sung LEE, Yong Hoon KIM, Jeong Wan YOO, Jun Ki RHEE, Ji Eun LEE
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Publication number: 20220361324Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.Type: ApplicationFiled: August 27, 2021Publication date: November 10, 2022Inventors: Yun Je JI, Seung Eun LEE, Yong Hoon KIM