Abstract: The present invention relates to a composition containing as an active ingredient at least one selected from the group consisting of Akkermansia muciniphila cells, a culture thereof, a lysate thereof, and an extract of the lysate or culture, and to an anti-aging method including administering the composition.

Abstract: A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.

Abstract: The present concept relates to a first principle-derived effective mass approximation simulation technology for accurate and efficient computational simulation of an optical property of a quantum nanostructure including creating an effective mass approximation (EMA) parameter through first principle density functional theory (DFT) calculation for a model nanostructure corresponding to a simulation target quantum nanostructure, performing EMA calculation using the EMA parameter created through the DFT calculation, and acquiring the optical property of the quantum nanostructure based on an electronic structure generated through the EMA calculation.

Abstract: A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components.

Abstract: Provided is an air conditioner capable of preventing a soldering defect when a circuit element is installed on a circuit board. The air conditioner includes a circuit board configured to form a circuit, a choke coil installed on the circuit board and having a wire wound around on a core, and a support device installed at a lower side of the choke coil to support the choke coil, and provided with a through-hole allowing the wire to pass therethrough, wherein the support device includes a support portion that protrudes from a lower surface of the support device to support the choke coil installed on the circuit board at an interval from the circuit board, the support portion disposed to be spaced apart from the through-hole in a direction away from an outer edge of the support device.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: An electronic component-embedded substrate includes a first wiring layer, a first electronic component disposed on the first wiring layer, a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component, a second wiring layer disposed on the first insulating material, a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection, a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component, and a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer.

Abstract: An electronic component-embedded substrate includes a wiring structure including a plurality of insulating layers and a plurality of wiring layers and having a cavity penetrating through at least one of the plurality of insulating layers, a first electronic component disposed in the cavity, a dam structure disposed on the wiring structure and having a through-portion, a first insulating material disposed in at least a portion of each of the cavity and the through-portion, and covering at least a portion of each of the wiring structure and the first electronic component, and a first circuit layer disposed on the first insulating material.

Abstract: A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

Abstract: An exhaust gas recirculation (EGR) cooler is provided and includes a plurality of tubes that are spaced apart from each other and a cavity that is disposed on an engine to receive the plurality of tubes. A coolant guide guides a coolant to the plurality of tubes and a cover then closes the cavity. The cavity has an inlet port that communicates with a water jacket of the engine and the cavity receives the coolant from the water jacket of the engine through the inlet port.

Abstract: A substrate structure may include a printed circuit board including a first recess and a first junction pad disposed on a lower surface of the first recess; a first electronic component package disposed in the first recess, and including a first substrate and a first electronic device module disposed on at least one surface of the first substrate; and a first external junction portion connecting the first electronic component package and the first junction pad.

Abstract: A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.

Abstract: A printed circuit board includes a first wiring structure including first insulating layers and first wiring layers; a second wiring structure disposed on the first wiring structure and including second insulating layers and second wiring layers; and a third wiring structure disposed on the second wiring structure and including a third insulating layer and a third wiring layer disposed on the third insulating layer. At least a portion of at least one of the second wiring layers has a fine pitch, relatively finer than those of the first wiring layers and the third wiring layer, wherein at least a portion of one of the first wiring layers is connected to at least a portion of the third wiring layer through a first wiring via, and wherein the first wiring via penetrates at least one of the first insulating layers, the second insulating layers, and the third insulating layer.

Abstract: An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.

Abstract: A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components.

Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.

Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.

Abstract: The present invention relates to an aluminum-resin composite and provides the aluminum-resin composite which is excellent in adhesive property between metal and resin and is applicable to a continuous production process such as a wire production process. Specifically, the present invention uses the aluminum-resin composite including a metal made of aluminum or an aluminum alloy and resin adhering to the metal via an alumina nanoporous layer formed on a surface of the metal. The alumina nanoporous layer contains alumina nanoparticles of 5 nm to 10 nm in average particle diameter and holes three-dimensionally communicating with one another.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided. The substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.