Abstract: An extreme ultra violet (EUV) resist film is formed on a wafer W, and then a EUV light is radiated onto the EUV resist film formed on the wafer W so that a predetermined pattern is selectively exposed on the EUV resist film. Thereafter, a developing solution with a concentration of less than 2.38% by weight, whose temperature is adjusted to be 5° C. or higher and less than 23° C. in a supplying equipment group 138, is dispensed from a developing solution supply nozzle 133 to the EUV resist film formed on the wafer W so that the EUV resist film is subject to development. In such a case, a time period during which the developing treatment is performed using the developing solution may be set to fall within the range of 10 seconds or higher to less than 30 seconds. And then, pure water is supplied from a pure water supply nozzle 140 onto the wafer W to clean the wafer. The time period during which the pure water is supplied is set to fall within the range of 30 seconds or below.

Abstract: A PEB unit has a first heat plate and a second heat plate. After an exposure process for a resist film for EUV on a wafer and before a development process, the PEB unit heats the wafer through the first heat plate at a first heating temperature. A heating time through the first heat plate is not less than 10 seconds and not more than 30 seconds. Thereafter, the PEB unit heats the wafer through the second heat plate at a second heating temperature lower than the first heating temperature. A temperature difference between the first heating temperature and the second heating temperature is not less than 20° C. and not more than 60° C.

Abstract: A photoresist coating and developing apparatus 1 includes a photoresist film forming unit that forms a photoresist film on a substrate; a heat treatment unit that heats the substrate on which the photoresist film is formed by the photoresist film forming unit; a cooling unit that cools the substrate, on which the photoresist film is formed and which is heated by the heat treatment unit, to normal temperature; a heating unit 61 that heats the substrate, which is cooled to normal temperature by the cooling unit, to a predetermined temperature; a load-lock chamber L1 that unloads the substrate under depressurized atmosphere to expose the photoresist film; and a transfer device 62 that transfers the substrate from the heating unit 61 to the load-lock chamber L1.

Abstract: A substrate on which a resist film has been formed is transferred to an aligner and subjected to exposure processing. The substrate is then subjected to post-exposure baking in a second processing system. The substrate is then transferred again to the aligner and subjected to exposure processing. The substrate for which exposure processing for the second time has been finished is transferred to a first processing system and again subjected to post-exposure baking. The time periods from the ends of the exposure processing to the starts of the post-exposure baking for the first time and the second time are controlled to be equal. In pattern forming processing in which exposure processing is performed a plurality of times between the resist film forming processing and the developing treatment, a pattern with a desired dimension can be finally formed.

Abstract: A circulation system for a high refractive index liquid includes a first collecting section configured to collect a high refractive index liquid used in an immersion light exposure section; a first supply section configured to supply the high refractive index liquid collected in the first collecting section to a cleaning section as a cleaning liquid; a second collecting section configured to collect the high refractive index liquid used in the cleaning section; and a second supply section configured to supply the high refractive index liquid collected in the second collecting section to the immersion light exposure section, wherein the high refractive index liquid is circulated between the immersion light exposure section and the cleaning section.

Abstract: A color filter includes a base, a bank formed on the base, the bank defining at least one target discharge area, and a color filter film formed in the target discharge area. The color filter film is formed by separately discharging a droplet of a color ink and a droplet of a dispersion medium in the target discharge area. One of surface tension and viscosity of the dispersion medium is lower than the one of the surface tension and the viscosity of the color ink.

Abstract: An apparatus for manufacturing a color filter includes a stage on which a base having a target discharge area is adapted to be placed, a plurality of discharge heads having a first discharge head filled with a functional material, and a second discharge head filled with a liquid, and a control unit operatively coupled to the stage and the plurality of discharge heads. The control unit controls the stage and the plurality of discharge heads such that the stage and the plurality of discharge heads move relative to each other and a droplet of the functional material from the first discharge head and a droplet of the liquid from the second discharge head are discharged in the same target discharge area. The surface tension or viscosity is lower than that of the functional material.

Abstract: The color element-equipped substrate of the present invention has a support base, a bank formed on the base that demarcates a pixel region, and a color element formed in the pixel region by depositing droplets of a liquid material in the pixel region. The bank demarcates the pixel region such that the pixel region has a undulated portion. In the color element-equipped substrate, the liquid material can be applied to the entire pixel region.

Abstract: An edge exposure apparatus performing an exposure process on an edge portion of a wafer having a coating film (resist film) formed thereon includes position detection means for detecting positional data of an outer edge of a wafer held by a spin chuck, an exposure portion for performing an exposure process on the edge portion of the wafer, a development nozzle supplying a developer to the exposed region, and alignment means for horizontally moving the spin chuck. An exposure process is performed by the exposure portion on the edge portion of the wafer held by the spin chuck while the alignment means is controlled, based on the positional data of the outer edge of the wafer which is detected by the position detection means, such that the positional relation between the outer edge of the wafer and the exposure portion is kept constant.

Abstract: The present invention provide with a rinse solution for lithography and a resist pattern forming method using the same, which can prevent an inclination and peeling-off of a resist pattern and form a resist pattern having a high aspect ratio with high reproducibility. The rinse solution for lithography of the present invention comprises water and a nonionic surfactant having an ethyleneoxy group but not having a fluorine atom. The resist forming method of the present invention comprises the step of rinsing the pattern after development treatment with the rinse solution for lithography.

Abstract: A method of manufacturing a color filter includes a step of providing a base having a target discharge area, a step of discharging a liquid such as dispersion medium to at least a portion of the target discharge area, and a step of discharging a droplet of functional material such as a coloring ink to the target discharge area. One of the surface tension and the viscosity of the dispersion medium is lower than the one of the surface tension and the viscosity of the coloring ink. With this method of manufacturing a color filter, it is possible to suppress inadequate wetting of the edges of a pixel area with the coloring ink.

Abstract: In the present invention, patterning for the first time is performed on a film to be worked above the front surface of a substrate, and the actual dimension of the pattern formed by the patterning for the first time is measured. Based on the dimension measurement result of the patterning or the first time, the condition of patterning for the second time is then set. In this event, the condition of the patterning for the second time is set so that a difference between the dimension of the patterning for the first time and its target dimension is equal to a difference between the dimension of the patterning for the second time and its target dimension. Thereafter, the patterning for the second time is performed under the set patterning condition.

Abstract: In the present invention, a substrate on which a resist film has been formed is transferred to an aligner and subjected to exposure processing. The substrate is then subjected to post-exposure baking in a second processing system. The substrate is then transferred again to the aligner and subjected to exposure processing. The substrate for which exposure processing for the second time has been finished is transferred to a first processing system and again subjected to post-exposure baking. The time periods from the ends of the exposure processing to the starts of the post-exposure baking for the first time and the second time are controlled to be equal. According to the present invention, in pattern forming processing in which exposure processing is performed a plurality of times between the resist film forming processing and the developing treatment, a pattern with a desired dimension can be finally formed.

Abstract: A substrate processing system (100) includes a first automated substrate transfer line or main transfer line (20) configured to transfer wafers (W) over the entire system and to transfer wafers to and from respective process sections, and a second automated substrate transfer line or auxiliary transfer line (30) configured to transfer wafers (W) inside a photolithography process section (1a). The auxiliary transfer line (30) is disposed as a transfer mechanism independent of the main transfer line (20). An OHT (31) is configured to travel around on the auxiliary transfer line (30) having a loop shape, so as to transfer wafers (W) to and from and among the respective process apparatuses in the photolithography process section (1a).

Abstract: A liquid droplet ejection head has a liquid introduction part, a pump part which is in communication with the liquid introduction part, and a nozzle forming plate in which a nozzle port is formed in an overlapped manner with the pump part. The nozzle forming plate is formed substantially into a rectangle as seen from a liquid ejection side. A resin is molded in at least one of side surface portions along at least long sides of the nozzle forming plate.

Abstract: In an ink jet apparatus for manufacturing a color filter 1, ink jet heads 22 having a plurality of nozzle 27 are disposed in a linear manner. Filter element member is ejected to a motherboard 12 from a plurality of nozzles 27 four times so as to form the filter element 3 in a predetermined thickness. By doing this, it is possible to prevent difference in the thickness in a plurality of the filter elements 3 and to equalize light transparency in planar manner. Thus, in an ejecting apparatus, a color filter can be formed in more common way at low cost and more efficiently. Also, it is possible to provide an ejecting apparatus which can equalize factors such as electrooptic characteristics of the electrooptic members, color displaying characteristics by the liquid crystal apparatuses, and illuminating characteristics by an EL surface.

Abstract: In an ink jet apparatus for manufacturing a color filter 1, ink jet heads 22 having a plurality of nozzle 27 are disposed in a linear manner. Filter element member is ejected to a motherboard 12 from a plurality of nozzles 27 four times so as to form the filter element 3 in a predetermined thickness. By doing this, it is possible to prevent difference in the thickness in a plurality of the filter elements 3 and to equalize light transparency in planar manner. Thus, in an ejecting apparatus, a color filter can be formed in more common way at low cost and more efficiently. Also, it is possible to provide an ejecting apparatus which can equalize factors such as electrooptical characteristics of the electrooptical members, color displaying characteristics by the liquid crystal apparatuses, and illuminating characteristics by an EL surface.

Abstract: An ink jet head 22 of linear form which consists of a plurality of nozzles 27 arranged as a nozzle row 28 is provided in an ink jet device for manufacture of a color filter. Filter element material 13 from the nozzles 27 which differ from the motherboard 12 is discharged four superimposed times by the plurality of nozzles 27, and is formed to a predetermined film thickness upon a single filter element 3. It is possible to prevent the occurrence of undesirable deviations in film thickness between different ones of the filter elements 3, so that it is possible to flatten and make even the optical transparency characteristic of the resulting color filter 1.

Abstract: The invention provides a color display substrate having plural color display elements arranged in a matrix pattern, and a manufacturing method to efficiently obtain a color filter substrate and color luminescent substrate, for example. A manufacturing method of a color display substrate includes the step of forming plural color dots by selectively ejecting liquid droplets from nozzles in accordance with input data. The plural color dots constitute plural pixels, which constitute plural color filter elements arranged in a matrix pattern. The plural color dots have a first dot pitch in a direction perpendicular to a first base line. Each of the plural color dots is formed to lie at a distance of at least substantially an integral multiple of the first dot pitch from the first base line.

Abstract: The invention provides a color display substrate having plural color display elements arranged in a matrix pattern, and a manufacturing method to efficiently obtain a color filter substrate and color luminescent substrate, for example. A manufacturing method of a color display substrate includes the step of forming plural color dots by selectively ejecting liquid droplets from nozzles in accordance with input data. The plural color dots constitute plural pixels, which constitute plural color filter elements arranged in a matrix pattern. The plural color dots have a first dot pitch in a direction perpendicular to a first base line. Each of the plural color dots is formed to lie at a distance of at least substantially an integral multiple of the first dot pitch from the first base line.