Abstract: Provided is a substrate processing apparatus including a substrate holding unit configured to hold a wafer W horizontally, a rotation driving unit configured to rotate the substrate holding unit, a first chemical liquid nozzle configured to discharge a first chemical liquid to a first chemical liquid supplying position on the peripheral portion of the wafer W, and a second chemical liquid nozzle configured to discharge a second chemical liquid to a second chemical liquid supplying position on the peripheral portion of the wafer W. The rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction when the second chemical liquid nozzle discharges the second chemical liquid.

Abstract: A substrate liquid processing apparatus includes a cup 50 configured to receive a processing liquid supplied onto a substrate. The cup includes a ring-shaped first exhaust space 530 in contact with a top opening 50A, and a ring-shaped second exhaust space 540 which is in contact with an exhaust port 52 and is disposed adjacent to the first exhaust space, and the first exhaust space and the second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof. Further, the cup has an inner wall that confines an inner periphery of the second exhaust space, and the inner wall includes a first wall portion 581 serving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction.

Abstract: Disclosed is a substrate processing apparatus including: a substrate processing unit that performs substrate processing by supplying a processing liquid to a substrate to be processed; a positioning mechanism that contacts the sides of the substrate to determine the position of the substrate; a positioning driver that drives the positioning mechanism; a detector that detects the position of the positioning mechanism; a storage unit that stores the position of the positioning mechanism with respect to a reference substrate serving as a reference of the substrate as a reference position information; and an operator that calculates a difference between the reference position information and the position information of the positioning mechanism detected in the detector and calculates measurement information on the processed substrate based on the difference.

Abstract: Disclosed is a substrate positioning apparatus capable of accurately performing positioning of a center of a circular-shape substrate with respect to a rotating shaft. The substrate positioning apparatus includes: a substrate disposing part; a first positioning mechanism including a first reference part contacting a side of the substrate; a second positioning mechanism including a second reference part contacting the side of the substrate; a first driver configured to drive the first positioning mechanism; a controller configured to control the drive of the first positioning mechanism. In particular, the second reference part contacts the substrate at a contact part and includes an elastic part that applies force in a moving direction of the first driver to the contact part and a detector that detects position information of the second positioning mechanism.

Abstract: Disclosed is a substrate processing system including a substrate processing apparatus that includes a nozzle configured to eject a processing liquid to a substrate. The system includes a jig sensor configured to detect whether a checking jig provided with a liquid receiving unit receiving the processing liquid ejected from the nozzle and configured to check an ejection state of the processing liquid from the nozzle is installed at a predetermined position of the substrate processing apparatus; and a controller configured to control the ejection of the processing liquid from the nozzle. When it is determined that the checking jig is installed at the predetermined position of the substrate processing apparatus based on detection of the jig sensor in a state where the ejection of the processing liquid from the nozzle is prohibited, the controller permits the ejection of the processing liquid from the nozzle.

Abstract: A substrate processing apparatus includes a substrate holding unit configured to hold a substrate; a first processing liquid nozzle configured to supply a first processing liquid to a peripheral portion of the substrate; a second processing liquid nozzle configured to supply a second processing liquid, the temperature of which is lower than that of the first processing liquid, to the peripheral portion of the substrate; a first gas supply port configured to supply a first gas at a first temperature to a first gas supplied place on the peripheral portion of the substrate; and a second gas supply port configured to supply a second gas at a second temperature lower than the first temperature to a place closer to the center in the radial direction as compared to the first gas supplied place with respect to the substrate.

Abstract: Disclosed is a liquid processing apparatus which performs a liquid processing by supplying a chemical liquid from a chemical liquid supplying unit to substrate rotating around a vertical axis, and includes a cover member arranged at an upper surface of substrate to oppose the substrate and have a space therebetween is provided with a gas supplying port, and gas is supplied from gas supplying port toward the space. The gas is discharged from the space through a gap between protrusion at the circumferential edge of cover member protruding downward and the substrate. In addition, lamp heater heating the circumferential edge of substrate is arranged in the space along the circumferential direction of substrate, the chemical liquid supplied from a chemical liquid supplying unit is supplied to a position closer to the circumferential edge side than a position at which lamp heater is provided.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate.

Abstract: A substrate processing apparatus includes a substrate holding unit configured to hold a substrate; a first processing liquid nozzle configured to supply a first processing liquid to a peripheral portion of the substrate; a second processing liquid nozzle configured to supply a second processing liquid, the temperature of which is lower than that of the first processing liquid, to the peripheral portion of the substrate; a first gas supply port configured to supply a first gas at a first temperature to a first gas supplied place on the peripheral portion of the substrate; and a second gas supply port configured to supply a second gas at a second temperature lower than the first temperature to a place closer to the center in the radial direction as compared to the first gas supplied place with respect to the substrate.

Abstract: When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.

Abstract: When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method, which can process an entire wafer at a sufficiently high temperature and can sufficiently suppress adhesion of particles on a surface of the wafer, when the peripheral portion of the wafer is processed. The liquid processing apparatus includes a holding part to hold the substrate, a rotation driving part to rotate the holding part, and a shield unit. The shield unit includes an opposed plate opposed to the substrate held by the holding part, a heating part to heat the substrate through the opposed plate, and a heated gas supplying part to supply heated gas to a surface of the substrate held by the holding part.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: Provided is a positioning apparatus including: a reference member that is serving as a reference for positioning; a support part that supports the reference member; and a first fixing member provided on the support part that fixes the reference member and the support part or releases the fixing. The reference member is connected to the support part in a movable state and fixed to the support part by the first fixing member after a position is determined. The reference member of the positioning apparatus is precisely installed to a reference position.

Abstract: A processing system adapted for processing an object to be processed, including a processing vessel configured for containing the object to be processed and for receiving a processing fluid, a processing fluid generating unit configured for generating a processing fluid, a processing-side fluid passage configured for supplying the processing fluid into the processing vessel, and a discharge fluid passage configured for discharging the processing fluid from the processing vessel.

Abstract: A processing system 1 comprises: a processing vessel 30 configured to accommodate an object to be processed W in a processing space 83; a process-fluid generating part 41 configured to generate a process fluid of a predetermined temperature; and a main duct 56 arranged between the process-fluid generating part 41 and the processing vessel 30, the main duct 56 being configured to guide the process fluid supplied from the process-fluid generating part 41. A process-fluid supply duct 171 is arranged on a downstream side of the main duct 56 via a switching valve 70, the process-fluid supply duct 171 being configured to introduce the process fluid into the processing space 83 of the processing vessel 30. A process-fluid bypass duct 172 is arranged on the downstream side of the main duct 56 via the switching valve 70, the process-fluid bypass duct 172 being configured to guide a process fluid, which is not introduced to the process-fluid supply duct 171, so as to bypass the processing space 83.

Abstract: Disclosed is a liquid processing apparatus which performs a liquid processing by supplying a chemical liquid from a chemical liquid supplying unit to substrate rotating around a vertical axis, and includes a cover member arranged at an upper surface of substrate to oppose the substrate and have a space therebetween is provided with a gas supplying port, and gas is supplied from gas supplying port toward the space. The gas is discharged from the space through a gap between protrusion at the circumferential edge of cover member protruding downward and the substrate. In addition, lamp heater heating the circumferential edge of substrate is arranged in the space along the circumferential direction of substrate, the chemical liquid supplied from a chemical liquid supplying unit is supplied to a position closer to the circumferential edge side than a position at which lamp heater is provided.

Abstract: Provided is a positioning apparatus including: a reference member that is serving as a reference for positioning; a support part that supports the reference member; and a first fixing member provided on the support part that fixes the reference member and the support part or releases the fixing. The reference member is connected to the support part in a movable state and fixed to the support part by the first fixing member after a position is determined. The reference member of the positioning apparatus is precisely installed to a reference position.

Abstract: Disclosed is a substrate positioning apparatus capable of accurately performing positioning of a center of a circular-shape substrate with respect to a rotating shaft. The substrate positioning apparatus includes: a substrate disposing part; a first positioning mechanism including a first reference part contacting a side of the substrate; a second positioning mechanism including a second reference part contacting the side of the substrate; a first driver configured to drive the first positioning mechanism; a controller configured to control the drive of the first positioning mechanism. In particular, the second reference part contacts the substrate at a contact part and includes an elastic part that applies force in a moving direction of the first driver to the contact part and a detector that detects position information of the second positioning mechanism.