Abstract: A current measuring apparatus for measuring a power supply current received by an electronic device includes: a first current supplying unit for outputting a first current which is a part of the power supply current; a smoothing capacitor for smoothing the first current output by the first current supplying unit connected with one end thereof; a capacitor of device side for smoothing the power supply current, electrostatic capacity of the capacitor of device side being smaller than that of the smoothing capacitor and one end of the capacitor of device side being connected with the electronic device; a switch for making the first current flow from the smoothing capacitor to the capacitor of device side in case of being ON; a second current supplying unit for outputting a second current smaller than the first current to the capacitor of device side via a path parallel to the switch; and a power supply current acquiring unit for acquiring the power supply current on the basis of the second current output by the

Abstract: The present invention intends to control DC drift phenomenon in a light control element having ridge structure, and to provide a light control element with high drive stability in a large area. The present invention has character that, in a light control element being equipped with a base plate that has an electrooptic effect, an optical guide and an electrode for modulation that are formed on said base plate, which has ridge structure, an anti-DC drift layer is installed on the surface of the above mentioned base plate where the optical guide is formed, and annealing treatment is performed after ridge processing.

Abstract: A power supply circuit is provided that supplies a voltage to a load. The power supply circuit includes a power supply for generating a predetermined voltage; an electrical path for electrically connecting the power supply and the load to each other; a current draw unit for drawing a current from the electrical path; and a current control unit for controlling the current drawn by the current draw unit from the electrical path.

Abstract: There is provided a semiconductor testing apparatus comprising a current measuring portion which converts a load current quantity at the time of application of a relatively high test voltage to a DUT to fall within a low-voltage range, and then subjects the low-voltage range to quantization conversion with a predetermined measurement resolution even when the relatively high test voltage is applied to the DUT.

Abstract: A test pattern sequence is generated (101), then a logic simulation of the operation of an IC under test in the case of applying each test pattern of the test pattern sequence, and a logic signal value sequence occurring in each signal line of the IC under test (102). The logic signal value sequence in each signal line is used to register in a fault list parts (a logic gate, signal line or signal propagation path) in which a fault (a delay fault or an open fault) detectable by a transient power supply current testing using the test pattern sequence is likely to occur (103).

Abstract: A particle monitoring device includes a light source for emitting a measurement light; and a light projecting/receiving unit, connected to a depressurized vessel of a processing apparatus, for projecting the emitted measurement light into the depressurized vessel and receiving a scattered light from a particle floating in the depressurized vessel. The light projecting/receiving unit is disposed such that the scattered light is received substantially parallel to the measurement light. The particle monitoring device further includes a received light intensity detection unit. The received light intensity detection unit has a received light intensity detection unit for determining whether or not the detected intensity is greater than a predetermined value and an instruction unit for instructing the processing apparatus to start, continue or stop a processing operation of the processing apparatus depending on the determined result.

Abstract: A liquid crystal display device of the present invention is one in which unevenness of display, spots generated due to lowering of voltage retention because of impurity ions are sufficiently eliminated and reliability of long-time/long-term use is improved. A liquid crystal display device of the present invention is one comprising a first substrate and a second substrate configured via a liquid crystal layer and a seal, wherein at least one of the first substrate and the second substrate comprises, towards the liquid crystal layer, a color filter layer, a transparent electrode and an alignment layer in this order and at least one of the transparent electrode and the alignment layer covers the color filter layer in a non-display region.

Abstract: A testing device that tests an electronic device includes a detection-voltage outputting unit operable to output a current detection voltage based on a power source current that the electronic device receives from a power source, a transmission line operable to transmit the current detection voltage, a detection amplifier operable to output an amplifier output voltage based on the current detection voltage received through the transmission line, a switching unit operable to select whether the current detection voltage is supplied to the detection amplifier, an integrator operable to output an integral value that is obtained by integrating values based on the amplifier output voltage, and a decision unit operable to decide whether the electronic device is good or bad based on the integral value.

Abstract: A first branched optical waveguide and a second branched optical waveguide, to constitute a Mach-Zehnder type optical waveguide, are formed at the surface of a substrate. A first ground electrode, a signal electrode and a second ground electrode are provided on a buffer layer formed on the substrate. The second ground electrode is partially cut away and divided, to form a ditch therein, so that the modulating electrode composed of the signal electrode, the first and the second ground electrodes are substantially symmetrized on the center line between the first and the second optical waveguides. Then, the ratio (d2/d1) of the distance d2 between the signal electrode and the second branched optical waveguide to the distance d1 between the signal electrode and the first electrode is set within 3.5-7.5.

Abstract: An optical component comprises an optical transmission element (e.g., an optical lens) whose circumferential wall partially joins a metal holder via a joining material (e.g., a low melting point glass), wherein stress is normally applied to the optical transmission element in a compression direction when joining the metal holder. The optical transmission element is inserted into a through hole of the metal holder, and the joining material is kept in a bank actualized by a tapered portion formed in proximity to one end of the through hole of the metal holder. This prevents tensile stress from being applied to the optical transmission element; thus, it is possible to avoid the occurrence of cracks and separations in the optical transmission element; and it is possible to avoid the occurrence of errors in optical characteristics, regardless of variations of the environmental temperature, so that, the optical component is improved in reliability.

Abstract: The present invention intends to control DC drift phenomenon in a light control element having ridge structure, and to provide a light control element with high drive stability in a large area. The present invention has character that, in a light control element being equipped with a base plate that has an electrooptic effect, an optical guide and an electrode for modulation that are formed on said base plate, which has ridge structure, an anti-DC drift layer is installed on the surface of the above mentioned base plate where the optical guide is formed, and annealing treatment is performed after ridge processing.

Abstract: A fault analysis method and apparatus which is able to improve the reliability of fault analysis of semiconductor integrated circuit. In case of supplying a test pattern sequence having a plurality of test patterns to the semiconductor IC, an analysis point whose electric potential changes according to the change of supplied test pattern is placed corresponding to the test pattern sequence. Then, a transient power supply current generated on the semiconductor IC according to the change of the test pattern is measured and determined whether the measured transient power supply current is abnormal or not. A defection point is presumed based on the test pattern sequence where the transient power supply current is abnormal, and the analysis point placed corresponding to the test pattern sequence.

Abstract: A fault analysis method and apparatus which is able to improve the reliability of fault analysis of semiconductor integrated circuit. In case of supplying a test pattern sequence having a plurality of test patterns to the semiconductor IC, an analysis point whose electric potential changes according to the change of supplied test pattern is placed corresponding to the test pattern sequence. Then, a transient power supply current generated on the semiconductor IC according to the change of the test pattern is measured and determined whether the measured transient power supply current is abnormal or not. A defection point is presumed based on the test pattern sequence where the transient power supply current is abnormal, and the analysis point placed corresponding to the test pattern sequence.

Abstract: A testing apparatus for testing an electron device, has a first supply unit that supplies a first current to the electron device; a first feedback circuit which feeds back voltage applied to the electron device to the, first supply unit; a first switch which switches to whether or not connect electrically the electron device to the first feedback circuit; a second supply unit that supplies a second current to the electron device, the second supply unit being separated from the electron device by the first switch.

Abstract: A fault analysis method and apparatus which is able to improve the reliability of fault analysis of semiconductor integrated circuit. In case of supplying a test pattern sequence having a plurality of test patterns to the semiconductor IC, an analysis point whose electric potential changes according to the change of supplied test pattern is placed corresponding to the test pattern sequence. Then, a transient power supply current generated on the semiconductor IC according to the change of the test pattern is measured and determined whether the measured transient power supply current is abnormal or not. A defection point is presumed based on the test pattern sequence where the transient power supply current is abnormal, and the analysis point placed corresponding to the test pattern sequence.

Abstract: A fault analysis method and apparatus which is able to improve the reliability of fault analysis of semiconductor integrated circuit. In case of supplying a test pattern sequence having a plurality of test patterns to the semiconductor IC, an analysis point whose electric potential changes according to the change of supplied test pattern is placed corresponding to the test pattern sequence. Then, a transient power supply current generated on the semiconductor IC according to the change of the test pattern is measured and determined whether the measured transient power supply current is abnormal or not. A defection point is presumed based on the test pattern sequence where the transient power supply current is abnormal, and the analysis point placed corresponding to the test pattern sequence.

Abstract: A constant voltage source includes a constant voltage supplying circuit including an operational amplifier for supplying an output voltage to a load and a feedback circuit for feeding back the output voltage to the operational amplifier; a first inductance unit disposed between the constant voltage supplying circuit and the load; and a first bypass capacitor of which one terminal is coupled between the first inductance unit and the load and the other terminal is coupled to a constant voltage unit.

Abstract: A power supply circuit is provided that supplies a voltage to a load. The power supply circuit includes a power supply for generating a predetermined voltage; an electrical path for electrically connecting the power supply and the load to each other; a current draw unit for drawing a current from the electrical path; and a current control unit for controlling the current drawn by the current draw unit from the electrical path.

Abstract: A testing apparatus is able to test a semiconductor integrated circuit with high observability. The testing apparatus includes a test pattern inputting means 14 for inputting a test pattern for activating a path under test of a semiconductor integrated circuit 20 to the semiconductor integrated circuit, a transient power supply current measuring means 16 for measuring transient power supply current supplied to the semiconductor integrated circuit while the path under test is being activated, and a fault detecting means 34 for judging absence and presence of a fault of the path under test, based on transient power supply current measured by the transient power supply current measuring means.

Abstract: A testing apparatus for testing an electron device, has a first supply unit that supplies a first current to the electron device; a first feedback circuit which feeds back voltage applied to the electron device to the, first supply unit; a first switch which switches to whether or not connect electrically the electron device to the first feedback circuit; a second supply unit that supplies a second current to the electron device, the second supply unit being separated from the electron device by the first switch.