Patents by Inventor Yoshihiro Machida

Yoshihiro Machida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210396476
    Abstract: A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 23, 2021
    Inventor: Yoshihiro Machida
  • Publication number: 20210372708
    Abstract: A loop-type heat pipe includes an evaporator, a first condenser, a second condenser, a first liquid pipe having a first flow path and configured to connect the evaporator and the first condenser, a second liquid pipe having a second flow path and configured to connect the evaporator and the second condenser, a first vapor pipe configured to connect the evaporator and the first condenser, a second vapor pipe configured to connect the evaporator and the second condenser, and a connecting portion having a first porous body and configured to connect the first liquid pipe and second liquid pipe to the evaporator. The evaporator has a third flow path connected to the first liquid pipe and the first vapor pipe, a fourth flow path connected to the second liquid pipe and the second vapor pipe, and a partitioning wall configured to partition the third flow path and the fourth flow path.
    Type: Application
    Filed: May 20, 2021
    Publication date: December 2, 2021
    Inventor: Yoshihiro Machida
  • Publication number: 20210356210
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a first condenser and a second condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the first condenser and second condenser, a first vapor pipe configured to connect the evaporator and the first condenser; and a second vapor pipe configured to connect the evaporator and the second condenser. The liquid pipe includes a first liquid pipe having a first flow path and connected to the first condenser, a second liquid pipe having a second flow path and connected to the second condenser, and a third liquid pipe having a third flow path connecting to the first flow path and the second flow path and connected to the evaporator.
    Type: Application
    Filed: April 29, 2021
    Publication date: November 18, 2021
    Inventor: Yoshihiro Machida
  • Patent number: 11175707
    Abstract: A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: November 16, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Publication number: 20210325121
    Abstract: A loop heat pipe includes a pair of outermost metal layers, an intermediate metal layer provided between the pair of outermost metal layers, an evaporator, a condenser, a liquid pipe and a vapor pipe connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, and a porous body provided between the pair of walls. The intermediate metal layer includes a first surface opposing one of the pair of outermost metal layers, and a plurality of first cavities, and a first projection between mutually adjacent first cavities, respectively famed at the first surface between the pair of walls. A first gap is famed between the first projection and the one of the pair of outermost metal layers.
    Type: Application
    Filed: April 1, 2021
    Publication date: October 21, 2021
    Inventor: Yoshihiro MACHIDA
  • Patent number: 11131509
    Abstract: A loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, a vapor pipe that connects the evaporator and the condenser, to form a loop-shaped passage together with the liquid pipe, and a porous body provided inside the liquid pipe or inside the evaporator. The porous body includes a first metal layer including a first bottomed hole that caves in from a first surface of the first metal layer, and a second bottomed hole that caves in from a second surface of the first metal layer, opposite to the first surface. The first bottomed hole and the second bottomed hole partially communicate with each other to form a pore.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: September 28, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Publication number: 20210293487
    Abstract: A loop heat pipe includes two outermost metal layers, an intermediate metal layer provided between the outermost metal layers, an evaporator, a condenser, and liquid and vapor pipes connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, a porous body provided between the pair of walls, and a strut penetrating the porous body and bonding the outermost metal layers, and one or more metal layers. Each of the one or more metal layers includes a first part forming a part of the pair of walls, a second part connected to the first part and forming a part of the porous body, and a third part connected to the second part and forming a part of the strut.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 23, 2021
    Inventor: Yoshihiro MACHIDA
  • Patent number: 11118843
    Abstract: A heat pipe includes an intermediate metal layer interposed between outermost metal layers, an inlet passage defined by opposing wall portions of the intermediate metal layer and the outermost metal layers, and a porous body provided at one or both of the wall portions. The porous body includes a first bottomed hole that caves in from one surface of the intermediate metal layer, a second bottomed hole that caves in from the other surface of the intermediate metal layer, and a pore formed by the first bottomed hole that partially communicates with the second bottomed hole. The outermost metal layers, the intermediate metal layer, the inlet passage, and the porous body form an inlet for filling a working fluid into the heat pipe.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: September 14, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11105562
    Abstract: A liquid pipe has a flow path provided in a stacked body of a plurality of metal layers. The plurality of metal layers includes a first metal layer configuring an upper wall surface of the flow path, a second metal layer configuring a lower wall surface of the flow path, and an intermediate metal layer stacked between the first metal layer and the second metal layer and configuring right and left wall surfaces of the flow path. The porous body includes a first porous body having first and second bottomed holes and fine pores provided in the first metal layer, and a second porous body having first and second bottomed holes and fine pores provided in the second metal layer. The porous body is not provided in the intermediate metal layer.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 31, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11098957
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to liquefy the operating fluid, a liquid pipe configured to interconnect the evaporator and the condenser, a steam pipe configured to interconnect the evaporator and the condenser and to form a loop together with the liquid pipe, a porous body provided in the liquid pipe and configured to retain therein the liquid operating fluid, and a solid columnar support provided in the liquid pipe and configured to guide the operating fluid liquefied by the condenser to the porous body. At least one first groove is formed at a side surface of the columnar support.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 24, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11098958
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser and to form a loop together with the liquid pipe, a first porous body provided in the evaporator, and a second porous body provided in the liquid pipe. A connection region between the evaporator and the liquid pipe includes a first porous extension part extending from one of the first porous body and the second porous body toward the other, and a space part in contact with the first porous extension part. A leading end of the first porous extension part is inserted in a first concave part formed in the other of the first porous body and the second porous body.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: August 24, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11060797
    Abstract: A loop heat pipe includes a metal layer stack of outermost metal layers and intermediate metal layers. The metal layer stack includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe connecting the evaporator to the condenser, and a liquid pipe connecting the condenser to the evaporator. The vapor pipe includes two pipe walls defining a flow passage of the vapor pipe and joint beams arranged at different positions along the flow passage. Each of the joint beams joins the two pipe walls to each other. Each of the intermediate metal layers includes one of the joint beams. Each of the joint beams includes a side surface that is inclined.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: July 13, 2021
    Inventor: Yoshihiro Machida
  • Patent number: 11060798
    Abstract: A loop heat pipe includes an evaporator, a condenser, a liquid pipe, and a vapor pipe. The liquid pipe is formed a metal layer stack of metal layers. The metal layers include a first metal layer through which a first through hole extends in a thickness-wise direction. The liquid pipe includes a flow passage formed by at least the first through hole and having four walls that define the flow passage. The liquid pipe further includes a plurality of porous bodies that form at least two of the four walls of the flow passage.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 13, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11016559
    Abstract: A terminal display device which a user wears on a user's head displays on a display unit an information object to be overlapped with a field of view of the user, detects a motion of the terminal display device, and stores a pattern of a motion of the terminal display device and an operation content of the information object that is displayed in association with each other. An information type management memory unit stores information related to a display mode of each of the information objects. A display control unit determines an operation content of the terminal display device based on the motion that is detected and an association between the motion pattern and the operation content, specifies the information object disposed at a predetermined position of the display unit, and performs an operation specified with the determined operation content on the specified information object.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: May 25, 2021
    Assignee: HITACHI-LG DATA STORAGE, INC.
    Inventors: Takayuki Fujiwara, Yoshihiro Machida, Yoshiho Seo, Tatsuya Ishitobi
  • Publication number: 20210131742
    Abstract: A loop heat pipe includes an evaporator to vaporizes a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, and a vapor pipe to connect the evaporator and the condenser, and form a loop-shaped passage together with the liquid pipe. A recess is formed in at least a portion of an outer wall surface of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe.
    Type: Application
    Filed: September 24, 2020
    Publication date: May 6, 2021
    Inventor: Yoshihiro MACHIDA
  • Publication number: 20210116184
    Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 22, 2021
    Inventor: Yoshihiro Machida
  • Patent number: 10976111
    Abstract: A loop type heat pipe includes: an evaporator configured to vaporize a liquid working fluid; a condenser configured to condense the vaporized working fluid into the liquid working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. Each of the vapor pipe and the liquid pipe includes: a lower-side metal layer; an intermediate metal layer that is disposed on the lower-side metal layer; an upper-side metal layer that is disposed on the intermediate metal layer; and a conduit that is formed by the lower-side metal layer, the intermediate metal layer, and the upper-side metal layer, and at least one of the upper-side metal layer and the lower-side metal layer warps outward in a first portion of the vapor pipe.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: April 13, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10907908
    Abstract: A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 2, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10883770
    Abstract: A loop type heat pipe includes: an evaporator configured to evaporate a working fluid; a condenser configured to condense the evaporated working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. The vapor pipe includes: a lower-side metal layer; an intermediate metal layer disposed on the lower-side metal layer; an upper-side metal layer disposed on the intermediate metal layer; a pipe conduit formed by the lower-side metal layer, the intermediate metal layer and the upper-side metal layer; and a support column that is provided inside the pipe conduit, wherein the support column divides the pipe conduit into a first flow path and a second flow path. The pipe conduit has a first opening portion that communicates with the first flow path and the second flow path.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 5, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Publication number: 20200408468
    Abstract: A heat pipe includes an intermediate metal layer interposed between outermost metal layers, an inlet passage defined by opposing wall portions of the intermediate metal layer and the outermost metal layers, and a porous body provided at one or both of the wall portions. The porous body includes a first bottomed hole that caves in from one surface of the intermediate metal layer, a second bottomed hole that caves in from the other surface of the intermediate metal layer, and a pore formed by the first bottomed hole that partially communicates with the second bottomed hole. The outermost metal layers, the intermediate metal layer, the inlet passage, and the porous body form an inlet for filling a working fluid into the heat pipe.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Inventor: Yoshihiro MACHIDA