Patents by Inventor Yoshihiro Machida

Yoshihiro Machida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10876799
    Abstract: A loop heat pipe includes a liquid pipe and a vapor pipe that connect an evaporator and a condenser and form a loop-shaped passage. The liquid pipe includes two outermost metal layers, and inner metal layers stacked between the outer metal layers. The inner metal layers include one or more flow passages in which a working fluid flows, and a porous body communicating with the one or more flow passages. One inner metal layer includes a first bottomed groove opening to a side of another inner metal layer adjacent to the one inner metal layer, and the other inner metal layer includes a second bottomed groove opening to a side of the one inner metal layer. The one or more flow passages include a flow passage formed by the first and second bottomed grooves that are arranged to oppose and communicate with each other in a thickness direction.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: December 29, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10859321
    Abstract: A heat pipe includes an inlet through which a working fluid is injected. The inlet includes a non-sealed portion and a sealed portion connected to the non-sealed portion. The non-sealed portion and the sealed portion each include two outermost metal layers and a plurality of intermediate metal layers stacked between the outermost metal layers. The heat pipe further includes a porous body arranged in the inlet.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: December 8, 2020
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10859319
    Abstract: A loop heat pipe includes an evaporator to vaporize a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, a porous body provided inside a flow passage in which the working fluid or vapor thereof flows, and a vapor pipe to connect the evaporator and the condenser and form a loop-shaped passage together with the liquid pipe. The porous body includes a metal layer including a first bottomed hole that caves in from a first surface thereof, a second bottomed hole that caves in from a second surface thereof, opposite to the first surface, and a pore formed by and partially communicating the first and second bottomed holes. An inner wall surface of each of the first and second bottomed holes formed in the porous body has a concave shape formed by a curved surface.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 8, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Publication number: 20200378686
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 3, 2020
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 10845128
    Abstract: A heat pipe includes an inlet port. The inlet port includes an unsealed part and a sealed part that include metal layers that are a first outermost layer, intermediate layers stacked on the first outermost layer, and a second outermost layer stacked on the intermediate layers. In the unsealed part, the intermediate layers include respective openings and respective first and second walls on first and second opposite sides, respectively, of the openings. The openings form an injection channel defined by the first and second outermost layers and the first and second walls of the intermediate layers. The inner wall faces of the first walls and the inner wall faces of the second walls of at least two adjacent intermediate layers form a first step and a second step, respectively. In the sealed part, each metal layer contacts one or more of other metal layers to hermetically seal the inlet port.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: November 24, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10809012
    Abstract: A heat pipe includes an intermediate metal layer interposed between outermost metal layers, an inlet passage defined by opposing wall portions of the intermediate metal layer and the outermost metal layers, and a porous body provided at one or both of the wall portions. The porous body includes a first bottomed hole that caves in from one surface of the intermediate metal layer, a second bottomed hole that caves in from the other surface of the intermediate metal layer, and a pore formed by the first bottomed hole that partially communicates with the second bottomed hole. The outermost metal layers, the intermediate metal layer, the inlet passage, and the porous body form an inlet for filling a working fluid into the heat pipe.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: October 20, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10704838
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: July 7, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Publication number: 20200200485
    Abstract: A liquid pipe has a flow path provided in a stacked body of a plurality of metal layers. The plurality of metal layers includes a first metal layer configuring an upper wall surface of the flow path, a second metal layer configuring a lower wall surface of the flow path, and an intermediate metal layer stacked between the first metal layer and the second metal layer and configuring right and left wall surfaces of the flow path. The porous body includes a first porous body having first and second bottomed holes and fine pores provided in the first metal layer, and a second porous body having first and second bottomed holes and fine pores provided in the second metal layer. The porous body is not provided in the intermediate metal layer.
    Type: Application
    Filed: December 11, 2019
    Publication date: June 25, 2020
    Inventor: Yoshihiro Machida
  • Publication number: 20200124353
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser and to form a loop together with the liquid pipe, a first porous body provided in the evaporator, and a second porous body provided in the liquid pipe. A connection region between the evaporator and the liquid pipe includes a first porous extension part extending from one of the first porous body and the second porous body toward the other, and a space part in contact with the first porous extension part. A leading end of the first porous extension part is inserted in a first concave part formed in the other of the first porous body and the second porous body.
    Type: Application
    Filed: October 18, 2019
    Publication date: April 23, 2020
    Inventor: Yoshihiro Machida
  • Publication number: 20200096261
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 26, 2020
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
  • Publication number: 20200072881
    Abstract: To improve determination accuracy of determining whether a user is present in a house. A presence-in-house determination system 1 includes: a first presence-in-house determination unit 111 configured to determine whether the user is present in the house based on a change over time in electric power consumption of the house of the user; second presence-in-house determination units 112A and 112B configured to determine whether the user is present in the house based on an operation state of at least one of electric appliances 20A and 20B provided in the house; and a comprehensive determination unit 114 configured to determine whether the user is present in the house based on a determination result of the first presence-in-house determination unit and a determination result of the second presence-in-house determination unit.
    Type: Application
    Filed: April 2, 2018
    Publication date: March 5, 2020
    Inventors: Akihito AKAI, Tomoya FUJIWARA, Yoshihiro MACHIDA, Yoshiki MATSUURA
  • Publication number: 20200064077
    Abstract: A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 27, 2020
    Inventor: Yoshihiro MACHIDA
  • Publication number: 20200049419
    Abstract: A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser; a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe; and a porous body which is provided in the liquid pipe and configured to reserve liquid-phase working fluid. The liquid pipe includes an injection inlet through which the working fluid is injected. A first end of the porous body is located between the injection inlet and the evaporator. A second end of the porous body which is opposite to the first end is located between the injection inlet and the condenser. At least a portion of the porous body which is provided between the injection inlet and the evaporator fills the inside of the liquid pipe.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventor: Yoshihiro Machida
  • Publication number: 20200049417
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to liquefy the operating fluid, a liquid pipe configured to interconnect the evaporator and the condenser, a steam pipe configured to interconnect the evaporator and the condenser and to form a loop together with the liquid pipe, a porous body provided in the liquid pipe and configured to retain therein the liquid operating fluid, and a solid columnar support provided in the liquid pipe and configured to guide the operating fluid liquefied by the condenser to the porous body. At least one first groove is formed at a side surface of the columnar support.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 13, 2020
    Inventor: Yoshihiro Machida
  • Publication number: 20200018556
    Abstract: A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser and has a first pipe wall and a second pipe wall which is opposed to the first pipe wall; a porous body which is provided in the liquid pipe and is configured to guide the working fluid condensed by the condenser to the evaporator; a flow channel which is a space that is formed in the liquid pipe and guides the working fluid condensed by the condenser to the evaporator; and a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe. The porous body is disposed to be in contact with the first pipe wall.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 16, 2020
    Inventor: Yoshihiro Machida
  • Patent number: 10524388
    Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 31, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Publication number: 20190368820
    Abstract: A loop-type heat pipe includes: an evaporator; a condenser; a liquid pipe; and a vapor pipe. The evaporator is formed by layered metal layers that include: a first outermost metal layer; a second outermost metal layer; and an inner layer. The inner layer includes: a first metal layer adjacent to the first outermost metal layer; and a second metal layer adjacent to the second outermost metal layer. At least one space and a porous member are provided in the inner layer. The first metal layer is formed with a first bottomed groove. The second metal layer is formed with a second bottomed groove. One end of the space corresponds to a portion of the first metal layer where the first bottomed groove is formed. The other end of the space corresponds to a portion of the second metal layer where the second bottomed groove is formed.
    Type: Application
    Filed: May 28, 2019
    Publication date: December 5, 2019
    Inventor: Yoshihiro Machida
  • Publication number: 20190334736
    Abstract: A management device for controlling communication on an equipment network on which a first equipped device having a communication capacity and a second equipped device having a higher-speed communication capacity than that of the first equipped device are connected to each other in a mixed manner includes a cycle number calculation device configured to assign a free space of the equipment network not used by lower-performance first communication performed by the first equipped device to second communication performed by the second equipped device, and a communication controller configured to transmit a trigger signal for switching a communication mode of the equipment network from the first communication to the second communication.
    Type: Application
    Filed: November 9, 2017
    Publication date: October 31, 2019
    Inventor: Yoshihiro MACHIDA
  • Publication number: 20190293362
    Abstract: A loop heat pipe includes a liquid pipe and a vapor pipe that connect an evaporator and a condenser and form a loop-shaped passage. The liquid pipe includes two outermost metal layers, and inner metal layers stacked between the outer metal layers. The inner metal layers include one or more flow passages in which a working fluid flows, and a porous body communicating with the one or more flow passages. One inner metal layer includes a first bottomed groove opening to a side of another inner metal layer adjacent to the one inner metal layer, and the other inner metal layer includes a second bottomed groove opening to a side of the one inner metal layer. The one or more flow passages include a flow passage formed by the first and second bottomed grooves that are arranged to oppose and communicate with each other in a thickness direction.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 26, 2019
    Inventor: Yoshihiro MACHIDA
  • Publication number: 20190285354
    Abstract: A loop heat pipe includes a metal layer stack of outermost metal layers and intermediate metal layers. The metal layer stack includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe connecting the evaporator to the condenser, and a liquid pipe connecting the condenser to the evaporator. The vapor pipe includes two pipe walls defining a flow passage of the vapor pipe and joint beams arranged at different positions along the flow passage. Each of the joint beams joins the two pipe walls to each other. Each of the intermediate metal layers includes one of the joint beams. Each of the joint beams includes a side surface that is inclined.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Inventor: Yoshihiro MACHIDA