Abstract: In this application are disclosed a method for producing nutraceutical chips, comprising the steps of: preparing a viscous liquid by use of at least one selected from the group consisting of vegetables, fruits, seeds, nuts and seaweeds which may have been heat-treated in advance as desired or as required, and a calcium-coagulable edible polymer material, spreading the viscous liquid into thin layers, applying an aqueous calcium salt solution onto the thin layers, whereby the calcium-coagulable edible polymer material is caused to gel, and heat-drying or/and vacuum-drying the resulting thin-film gel products, and a method for producing nutraceutical chips, comprising the steps of: preparing a gel by use of at least one selected from the group consisting of vegetables, fruits, seeds, nuts and seaweeds which may have been heat-treated in advance as desired or as required, a calcium-coagulable edible polymer material, and a calcium salt, molding the gel into thin films, and heat-drying or/and vacuum-drying the re

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive layer on one or both sides of the base film. The composite film has a thickness of T (&mgr;m), the base film has an edge tearing strength of R (kg/20 mm), the adhesive layer has a total thickness of A, and the base film has a thickness of B, T being related to R by a numerical formula R>0.6T-8 when T≦60, or by a numerical formula R≧28 when T>60, and A/B being 0.5 to 1.4.

Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Abstract: There is provided a mobile radio communication apparatus being able to transmit data and voice, connected with one of base stations over a radio communication channel, the apparatus comprising a plurality of mobile identification numbers (MINs), an interface being able to connected with an external device inputting data from the external device and outputting data to the external device, data communication request detecting means for detecting a data communication request from the external device through the interface, and connection control means for controlling the connection with the base station by using a first MIN of the plurality of MINs responsive to output of the detecting means. In the mobile radio communication apparatus having the above constitutions, the data communication request detecting means detects a data communication request from the external device.

Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Abstract: The present invention is to provide a resin composition excellent in moisture absorption property, heat resistance, adhesive property and electric characteristics, and excellent in molding property, and suitable for an insulating material such as a multilayer wiring substrate, electronic parts, etc., and an adhesive film.

Abstract: A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

Abstract: This invention provides a dual-mode radio communication apparatus which can make normal communications even when an external apparatus is connected to a radio communication apparatus, the communication scheme of which is set in a digital mode. When the radio communication apparatus is not connected to a vehicle-mount kit via a connector in an analog mode, a switch control means of a controller switches a switching circuit to communicate a signal with a base station using a built-in antenna. When the apparatus is connected to the vehicle-mount kit, the switch control means switches the switching circuit to communicate a signal with the base station using an external antenna via the vehicle-mount kit and a booster unit. In the digital mode, the switch control means switches the switching circuit to communicate a signal with the base station using the built-in antenna independently of the connection with the vehicle-mount kit.

Abstract: An insulating adhesive for electronic parts, which is to be used for bonding a semiconductor chip to a lead frame and comprises a resin and a solvent, the resin having (A) a weight average molecular weight (Mw) of 30,000 to 300,000 based on conversion into polystyrene and (B) a ratio of weight average molecular weight (Mw)/number average molecular weight (Mn) of 5 or less, and (C) the insulating adhesive for electronic parts having a viscosity of 5,000 to 100,000 mPa.s at a rotation number of 10 rpm and a viscosity ratio (&eegr;1 rpm/&eegr;10 rpm) of 1.0 to 6.0 as measured at 25° C. with an E-type viscometer.

Abstract: According to the present invention, an analog-mode discharge characteristic storage area (21a) and a digital-mode discharge characteristic storage area (21b) store threshold data of remaining battery display in an incoming-call standby status in an analog mode and that in a digital mode, respectively. A remaining battery determination means (20a) determines a remaining battery level corresponding to a selected communication mode based on both a voltage of detected by a voltage detection circuit (32) and data stored in the analog-mode discharge characteristic storage area (21a) or the digital-mode discharge characteristic storage area (21b). A remaining battery display control means (20b) causes the remaining battery to be displayed on an LCD display of a control unit (22) in accordance with a determination result of the remaining battery determination means (20a).

Abstract: Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive layer on one or both sides of the base film. The composite film has a thickness of T (&mgr;m), the base film has an edge tearing strength of R (kg/20 mm), the adhesive layer has a total thickness of A, and the base film has a thickness of B, T being related to R by a numerical formula R>0.6T-8 when T≦60, or by a numerical formula R≧28 when T>60, and A/B being 0.5 to 1.4.

Abstract: A direct fuel injection-type spark-ignition internal combustion engine is disclosed. The engine comprises a spark plug, a cavity formed on the top surface of the piston, and a fuel injection valve for injecting fuel into the cavity in nearly the flat fan shape having a relatively small thickness. An opposing side wall of the cavity opposite to the fuel injection valve, for leading the fuel to the vicinity of the spark plug, has an arcuate portion having a plurality of arcuate shapes in a plan view. The radius of arcuate shape at the both side parts of the arcuate portion in a plan view is smaller than the radius of arcuate shape at the center part of the arcuate portion in a plan view. The opposing side wall has a deflecting portion to deflect the fuel toward the inside of the cavity.

Abstract: There is provided a mobile radio communication apparatus being able to transmit data and voice, connected with one of base stations over a radio communication channel, the apparatus comprising a plurality of mobile identification numbers (MINs), an interface being able to connected with an external device inputting data from the external device and outputting data to the external device, data communication request detecting means for detecting a data communication request from the external device through the interface, and connection control means for controlling the connection with the base station by using a first MIN of the plurality of MINs responsive to output of the detecting means.

Abstract: Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive layer on one or both sides of the base film. The composite film has a thickness of T (&mgr;m), the base film has an edge tearing strength of R (kg/20 mm), the adhesive layer has a total thickness of A, and the base film has a thickness of B, T being related to R by a numerical formula R>0.6T−8 when T≦60, or by a numerical formula R≧28 when T>60, and A/B being 0.5 to 1.4.

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: A direct fuel injection-type spark-ignition internal combustion engine is disclosed. The engine comprises a spark plug, a fuel injector and a cavity formed on the top surface of the piston. The cavity has a bottom wall, a spark plug side wall and a fuel injector side wall. The fuel injector injects fuel toward the bottom wall of the cavity in stratified charge combustion. The fuel mainly proceeds toward the spark plug side wall of the cavity along the bottom wall, is deflected by the spark plug side wall and is led to the vicinity of the spark plug. In the engine, the fuel injector side wall of the cavity is provided with a deflecting portion. If a part of the injected fuel proceeds toward the fuel injector side wall along the bottom wall of the cavity, that part of the fuel is led to the vicinity of the spark plug by the deflecting portion.

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: A direct fuel injection-type spark ignition internal combustion engine is disclosed. The engine comprises a spark plug arranged in the upper wall of the cylinder, a fuel injector for directly injecting fuel into the cylinder, and a cavity formed in the top surface of the piston. The cavity has a bottom wall and a spark plug side wall. Fuel injected into the cavity from the fuel injector in the latter half of the compression stroke proceeds on the bottom wall of the cavity so as to be deflected by the spark plug side wall and led to the vicinity of the spark plug. In the engine, the fuel injector injects fuel in the shape of a fan having a relatively small thickness. The cavity has guide walls for preventing fuel from excessively spreading in the direction of width of the fan shape as it proceeds on the bottom wall.