Abstract: An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a through hole accommodating the electronic component, an adhesive layer bonding the wiring part and the frame to each other, and an encapsulant filling at least a portion of the through hole.

Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.

Abstract: A fan-out semiconductor package includes a semiconductor chip including a body and an electrode pad disposed on the body, a metal layer disposed on the electrode pad of the semiconductor chip, and a interconnection member including an insulating layer disposed on one side of the semiconductor chip, a via hole penetrating through the insulating layer and exposing at least a portion of a surface of the metal layer, a seed layer disposed on the surface of the metal layer exposed by the via hole and a wall of the via hole, and a conductor layer disposed on the seed layer.

Abstract: A fan-out semiconductor package and an electronic device including the same are provided. The fan-out semiconductor package includes a semiconductor chip; an interconnection member electrically connected to the semiconductor chip and having a connection terminal pad; and a passivation layer disposed at one side of the interconnection member and having an opening part opening a portion of the connection terminal pad. Distances from a center of the connection terminal pad to at least two points of an edge thereof are different from each other.

Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.

Abstract: A printed circuit board and a method for manufacturing the same are provided. A printed circuit board according to an example includes a core formed by laminating dielectric substance layers; a capacitor including an internal electrode layer formed between the dielectric substance layers which are adjacent with each other and a connection via alternately connecting the internal electrode layers which are adjacent with each other to provide an electric charge having a different polarity to the internal electrode layers which are adjacent with each other and formed on the core; and a through via passing through the core.

Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.

Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.

Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

Abstract: A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer.

Abstract: A printed circuit board includes: a first insulating layer; a first circuit layer disposed above the first insulating layer; a second insulating layer disposed above the first insulating layer; a second circuit layer disposed above the second insulating layer and constructed of a photosensitive material; and a protective layer disposed above the second insulating layer and surrounding the second circuit layer, wherein the protective layer includes a tunnel type cavity and exposes a portion of the second circuit layer to an outside environment, and wherein the second insulating layer exposes a portion of the first circuit layer located below the cavity to an outside environment.

Abstract: A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Abstract: An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.

Abstract: An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.

Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.

Abstract: Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer structure disposed in the insulating part, the heat-transfer structure including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer structure between a top surface and a bottom surface of the heat-transfer structure.

Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.

Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.