Abstract: The present invention relates to a plasma reaction apparatus and a plasma reaction method using the same. More particularly, the present invention relates to a plasma reaction apparatus which is applied to the reforming of fuel by generating rotating arc plasma and using the rotating arc being generated, the chemical treatment of a persistent gas, and the apparatus for decreasing NOx by an occlusion catalyst, and a plasma reaction method using the same. For this purpose, a raw material for a reaction is allowed to flow through an inflow hole in a swirl structure so that the raw material forms a rotating flow to progress. Accordingly, the raw material is sufficiently reacted in a plasma reaction space of a restrictive volume, and a high temperature plasma reaction is more promptly performed.

Abstract: For integrated circuit fabrication, at least one spacer support structure is formed in a first area over a semiconductor substrate, and a mask material is deposited on exposed surfaces of the spacer support structure and on a second area over the semiconductor substrate. A masking structure is formed on a portion of the mask material in the second area, and the mask material is patterned to form spacers on sidewalls of the spacer support structure and to form a mask pattern under the masking structure. The spacer support structure and the masking structure are comprised of respective high carbon content materials that have been spin-coated and have substantially a same etch selectivity.

Abstract: A plasma scrubber that forms a high temperature atmosphere in a reactor to effectively decompose and remove a non-biodegradable gas and reduce power consumption is disclosed. The plasma scrubber includes: a first reactor to which a non-biodegradable gas is supplied; an electrode installed in the first reactor and protruding in the flow direction of the non-biodegradable gas to generate plasma in the non-biodegradable gas supplied between the electrode and the first reactor by a discharge reaction in the first reactor; a second reactor connected to the first reactor to form continuous arc jets by anchoring the plasma to the electrode; and a third reactor connected to the second reactor to decompose the non-biodegradable gas by forming a reaction section of high temperature that contains electrons and chemical species of high reactivity in the second reactor and thereby increasing the stay time and reactivity of the non-biodegradable gas.

Abstract: A plasma burner and a diesel particulate filter (DPF) trap that can effectively oxidize and remove a particulate material (PM) within an exhaust gas by preheating fuel and mixing the fuel with the exhaust gas are provided. The DPF includes: a filter that is connected to an exhaust conduit at a side opposite to that of an engine; a plasma burner that is provided within the exhaust conduit between the engine and the filter, and that includes a fuel inlet that supplies fuel and a flame vent that projects a flame by a plasma discharge, and that heats exhaust gas; and a fuel inflow conduit that connects the fuel inlet and a fuel tank.

Abstract: A reduction system for particulate materials in exhaust gas, which is connected to a tailpipe of an engine that burns a hydrocarbon-based fuel supplied from a fuel storage tank, and collects and removes particulate materials within the exhaust gas, may include a plasma reactor having a gas inlet and an outlet, and a DPF (diesel particulate filter) trap having a filter. The tailpipe of the engine may communicate with the gas inlet of the plasma reactor, and the outlet of the plasma reactor may communicate with the DPF trap. The exhaust gas exhausted from the engine may be transferred to the DPF trap after being heated while passing through the plasma reactor.

Abstract: Provided are an overlay mark of a semiconductor device and a semiconductor device including the overlay mark. The overlay mark includes: reference marks formed in rectangular shapes comprising sides in which fine patterns are formed; and comparison marks formed as rectangular shapes which are smaller than the rectangular shapes of the reference marks and formed of fine patterns, wherein the number of comparison marks is equal to the number of reference marks, wherein the reference marks and the comparison marks are formed on different thin films formed on a semiconductor substrate to be used to inspect alignment states of the different thin films, and the overlay mark reflects an effect of aberration of patterns of memory cells through the fine patterns during a calculation of MR (mis-registration).

Abstract: Disclosed are a reactor and a method for processing hazardous gas, capable of improving a removing rate of the hazardous gas and the selectivity of a reacting process using a dielectric heat produced by a non-thermal plasma and a catalyst at a process of decomposing the hazardous gas. The reactor comprises a body having an inlet and an outlet; a plurality of planar electrodes arranged parallel in the body and spaced apart from each other at a certain interval, in which the plurality of planar electrodes are alternately connected to an alternating current power, and a ground such that every other planar electrode is connected to the alternating current power and the remaining planar electrodes are connected to the ground; and a power supply unit for applying a voltage of an alternating current frequency to the planar electrodes.

Abstract: Disclosed is a non-thermal plasma method for treating a toxic compounds-containing gas; the method comprising the steps of: filling alkali earth metal catalysts and dielectrics within a plasma reactor; the alkali earth metal catalysts being made by substituting alkali earth metal cations for cations of aluminum/silicon molecular sieves used as carriers; introducing a toxic compounds-containing gas into the plasma reactor; and supplying AC power or pulse power to the plasma reactor generating a non-thermal plasma and thus decomposing or oxidizing the toxic compounds. Also to stabilize the plasma more during the non-thermal plasma process and to enhance treatment efficiency of the toxic compounds, the catalysts substituted by the alkali earth metal are filled together with the well-known dielectrics within the plasma reactor; the alkali earth metal catalysts being electrically less conductive and inexpensive.