Patents by Inventor Young-Il Lee

Young-Il Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11676753
    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion, a nonmagnetic layer disposed below the through-portion, and an insulating layer disposed between the nonmagnetic layer and the through-portion.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hoon Hwang, Myoung Ki Shin, Jeong Gu Yeo, Young Il Lee, Byeong Cheol Moon
  • Patent number: 11646146
    Abstract: A coil component includes a body comprising a support member and a coil portion embedded in one surface of the support member; and external electrodes connected to the coil portion, wherein the body comprises a plurality of metal particles, at least some of the plurality of metal particles comprises a plastically deformable first particle, and at least some of the first particles have a deformed surface and thus have a shape corresponding to a surface of a neighboring magnetic metal particle.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: May 9, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Jeong Gu Yeo, Ji Hoon Hwang, Myoung Ki Shin, Byeong Cheol Moon
  • Patent number: 11581125
    Abstract: A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: February 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Gu Yeo, Young Il Lee, Byeong Cheol Moon
  • Publication number: 20230033534
    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath for liquid treating a plurality of substrates and having an accommodation space for accommodating a treating liquid; and a posture changing member for changing a posture of a substrate which is immersed in the treating liquid from a vertical posture to a horizontal posture.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 2, 2023
    Applicant: SEMES CO., LTD.
    Inventors: JUN YOUNG CHOI, KYU HWAN CHANG, CHUL GOO KIM, JUNG BONG CHOI, YOUNG IL LEE
  • Publication number: 20230015432
    Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
    Type: Application
    Filed: September 20, 2022
    Publication date: January 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il LEE, Han Wool RYU, Sang Kyun KWON
  • Patent number: 11538616
    Abstract: A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: December 27, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Lock Kim, Byeong Cheol Moon, Chang Hak Choi, Jeong Gu Yeo, Young Il Lee
  • Patent number: 11495398
    Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Han Wool Ryu, Sang Kyun Kwon
  • Publication number: 20220208560
    Abstract: Provided is an apparatus for treating a substrate. In the exemplary embodiment, the apparatus for treating the substrate includes a support member configured to support a substrate and provided rotatably; a treating liquid nozzle configured to supply selectively a high-temperature first treating liquid and a high-temperature second treating liquid onto the substrate; and a controller configured to control the treating liquid nozzle so that the treating liquid nozzle first supplies the first treating liquid onto the substrate and then supplies the second treating liquid onto the substrate.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 30, 2022
    Inventors: Min Ok KANG, Young Il Lee, Kyu Hwan CHANG
  • Publication number: 20220157513
    Abstract: A coil component includes a resin; and a magnetic particle dispersed in the resin and comprising magnetic powder particle, an insulating layer disposed on a surface of the magnetic powder particle, and a surface-treatment layer disposed on a surface of the insulating layer.
    Type: Application
    Filed: February 16, 2021
    Publication date: May 19, 2022
    Inventors: Young Il LEE, Myoung Ki SHIN, Ji Hoon HWANG, Jeong Gu YEO
  • Publication number: 20220139613
    Abstract: A coil component includes a body, a support substrate disposed in the body, a coil unit disposed on the support substrate to be perpendicular to a first surface of the body and including first and second lead-out portions exposed to first surface of the body and spaced apart from each other, first and second external electrodes disposed to be spaced apart from each other on the first surface of the body and connected to the first and second lead-out portions, respectively, a slit portion formed in a region of one surface of the body between the first and second external electrodes, and a slit insulating layer disposed in the slit portion.
    Type: Application
    Filed: September 17, 2021
    Publication date: May 5, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Gu Yeo, Myoung Ki Shin, Ji Hoon Hwang, Young Il Lee
  • Patent number: 11254214
    Abstract: A vehicle supplies stable and efficient power to a load of a vehicle during a failure or performance degradation of the vehicle by forming an isolated electrical network. The vehicle includes a power supply unit, an electrical network including at least one load configured to receive power from the power supply unit, and a sensor unit that acquires at least one of current flowing in a plurality of the electrical networks and a voltage supplied to the at least one load. A power distribution module determines an insolation required portion based on the current flowing in the electrical network and the voltage supplied to the at least one load, and connects or disconnects at least one point of the electrical network based on the isolation required portion to form an isolated electrical network.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: February 22, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: JungHyeon Bae, Jin Kim, Young Il Lee
  • Patent number: 11211194
    Abstract: A coil electronic component includes a body having a coil portion embedded therein, and external electrodes connected to the coil portion, wherein the body includes a plurality of magnetic portions having a form in which magnetic particles are dispersed in an insulator and one or more insulating portions disposed between the plurality of magnetic portions.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: December 28, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Kyun Kwon, Han Wool Ryu, Young Il Lee
  • Publication number: 20210350964
    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion, a nonmagnetic layer disposed below the through-portion, and an insulating layer disposed between the nonmagnetic layer and the through-portion.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 11, 2021
    Inventors: Ji Hoon HWANG, Myoung Ki SHIN, Jeong Gu YEO, Young Il LEE, Byeong Cheol MOON
  • Patent number: 11133129
    Abstract: A coil electronic component includes a body including an internal coil including first and second end portions, and an encapsulant surrounding the internal coil and formed of a magnetic material, and first and second external electrodes disposed on external surfaces of the body. The body includes a first surface and a second surface to which the first and second end portions are led, respectively, and which oppose each other, a third surface connecting the first and second surfaces to each other and perpendicular to a center of a core of the internal coil, and a fourth surface opposing the third surface, and a first corner connecting the first surface and the third surface to each other and a second corner connecting the second surface and the third surface to each other include first and second recess portions, respectively.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 28, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Byeong Cheol Moon
  • Publication number: 20210267043
    Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.
    Type: Application
    Filed: June 14, 2019
    Publication date: August 26, 2021
    Inventors: Do Hyuk YOO, Hee Jung LEE, Young Ju HAN, Young Il LEE
  • Publication number: 20210175001
    Abstract: A coil component includes a body comprising a support member and a coil portion embedded in one surface of the support member; and external electrodes connected to the coil portion, wherein the body comprises a plurality of metal particles, at least some of the plurality of metal particles comprises a plastically deformable first particle, and at least some of the first particles have a deformed surface and thus have a shape corresponding to a surface of a neighboring magnetic metal particle.
    Type: Application
    Filed: May 20, 2020
    Publication date: June 10, 2021
    Inventors: Young Il LEE, Jeong Gu YEO, Ji Hoon HWANG, Myoung Ki SHIN, Byeong Cheol MOON
  • Patent number: 10923276
    Abstract: A coil electronic component includes a body having a coil portion embedded therein and having a form in which magnetic particles are dispersed in a first insulating material, a first atomic layer deposition (ALD) layer formed along a surface of the coil portion using a second insulating material, a second ALD layer formed along a surface of the first ALD layer using a third insulating material, and external electrodes connected to the coil portion.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Han Wool Ryu, Sang Kyun Kwon
  • Publication number: 20210005379
    Abstract: A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.
    Type: Application
    Filed: November 4, 2019
    Publication date: January 7, 2021
    Inventors: Jeong Gu YEO, Young Il LEE, Byeong Cheol MOON
  • Publication number: 20200335253
    Abstract: A coil component includes a body having one surface and the other surface opposing each other, and one side surface and the other side surface, respectively connecting the one surface and the other surface to each other and opposing each other in one direction, a wound coil embedded in the body, a lead portion extending from an end of the wound coil to one surface of the body and disposed on the one surface of the body, an insulating layer covering one surface of the body and having an opening exposing a portion of the lead portion and extending in the one direction, and an external electrode disposed in the opening and connected to the lead portion. The insulating layer includes finishing portions respectively disposed on opposing sides of the opening in the one direction.
    Type: Application
    Filed: August 26, 2019
    Publication date: October 22, 2020
    Inventors: Jeong Gu YEO, Young Il LEE, Yong Hui LI
  • Publication number: 20200203062
    Abstract: A coil electronic component includes a body including a coil portion disposed therein, and including a plurality of magnetic particles, and external electrodes connected to the coil portion. The body includes an internal region and a protective layer disposed on a surface of the internal region. A first particle of the plurality of magnetic particles included in the protective layer includes an oxide film disposed on a surface of the first particle, and a second particle, having a size greater than a size of the first particle, of the plurality of magnetic particles includes a coating layer disposed on a surface of the second particle and having a composition different from a composition of the oxide film.
    Type: Application
    Filed: October 4, 2019
    Publication date: June 25, 2020
    Inventors: Young Il LEE, Jeong Gu YEO, Ji Hoon HWANG, Myoung Ki SHIN, Byeong Cheol MOON