Abstract: A circuit board according to an embodiment includes a core layer including a first region and a second region, and antenna power supply wirings disposed on the core layer over the first region and the second region. The antenna power supply wirings may include a first portion extending in a first direction in the first region, a second portion extending in a second direction in the first region, and a third portion extending in the first direction in the second region, and an interval between the neighboring second portions of the antenna power supply wirings is 3 times or less of an interval between the neighboring third portions of the antenna power supply wirings.

Abstract: According to the present embodiments, it is possible to achieve cost savings and a simplified assembly process by reducing components and enhanced quality by mitigating the tolerance during assembly, as well as better stability and accuracy during angle adjustment.

Abstract: An antenna package includes an antenna device and a circuit board bonded to the antenna device. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.

Abstract: An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.

Abstract: The present invention relates to a high manganese steel for low temperature applications and a method for manufacturing the same. The high manganese steel contains 0.3 wt % to 0.8 wt % of C, 18 wt % to 26 wt % of Mn, 0.01 wt % to 1 wt % of Si, 0.01 wt % to 0.5 wt % of Al, 0.1 wt % or less of Ti (excluding 0%), 1 wt % to 4.5 wt % of Cr, 0.1 wt % to 0.9 wt % of Cu, 0.03 wt % or less of S (excluding 0%), 0.3 wt % or less of P (excluding 0%), 0.001 wt % to 0.03 wt % of N, 0.004 wt % or less of B (excluding 0%), and a remainder of Fe and other inevitable impurities, wherein a microstructure comprises an austenite single phase structure, and an average grain size of the austenite is 50 ?m or less.

Abstract: An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

Abstract: A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

Abstract: An antenna structure according to an embodiment of the present disclosure includes a transmission line, and a radiator connected to the transmission line, the radiator having a linear perimeter region and a plurality of curved perimeter regions separated by the linear perimeter region, wherein an outermost portion of the radiator from the transmission line in a planar view has any one of the curved peripheral regions. A broadband antenna structure covering low frequency and high frequency bands is provided.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, a first circuit board including a first core layer having a first surface and a second surface opposite to each other, a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit, and a first via structure penetrating through the first core layer, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the antenna unit and the first via structure.

Abstract: A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.

Abstract: An antenna structure according to an embodiment of the present invention includes a first antenna unit including a first radiator, a first transmission line connected to the first radiator, and a guide pattern disposed around the first transmission line and separated from the first transmission line, a second antenna unit at least partially covered by the guide pattern of the first antenna unit in a plan view, and a dielectric layer interposed between the first antenna unit and the second antenna unit. An antenna structure implementing low-frequency and high-frequency properties with high reliability is provided.

Abstract: Disclosed is an electronic device. The electronic device according to an embodiment includes a plurality of antennas, and a communication circuit electrically connected with the plurality of antennas. The communication circuit includes a plurality of circuits receiving a signal in a first band and is configured to simultaneously receive the signal in the first band through two or more circuits of the plurality of circuits from two or more antennas, which are positioned adjacent to each other, from among the plurality of antennas. The number of the plurality of antennas is the same as the number of plurality of circuits.

Abstract: An antenna element according to an exemplary embodiment includes a dielectric layer; and an antenna pattern formed in a mesh structure on the dielectric layer and including an irregularly-shaped edge. The antenna element according to the example is excellent in terms of the pattern visibility, while maintaining the antenna performance.

Abstract: Disclosed is an operating method of a memory device communicating with a memory controller, which includes receiving a first command from the memory controller, the first command indicating initiation of synchronization of a data clock signal and defining a clock section corresponding to the synchronization, preparing a toggling of the data clock signal during a preparation time period, processing a first data stream based on the data clock signal toggling at a reference frequency, and processing a second data stream based on the data clock toggling at the reference frequency and extended for a period of the defined first clock section.

Abstract: An example optical system for a 3D stereoscopic image display comprises a changing mirror, a rotating mirror, a tilted mirror, a concave mirror and a planar mirror. The changing mirror can change the path of light from a horizontal direction to a vertical direction. The rotating mirror can rotate while having an X-axis and a Y-axis with different curvature radii. The tilted mirror can include a central region with a hole for allowing light to pass therethrough, and a peripheral region having one surface having a concave tilted structure while the other surface has a planar structure. The concave mirror can include a central region with a hole having a size capable of encompassing the tilted mirror and a peripheral region having a bent structure that is completely concave. The planar mirror can include a central region with a hole and a peripheral region with a flat doughnut structure.

Abstract: The present disclosure relates to an antenna element including: a dielectric layer; a radiation electrode arranged on an upper surface of the dielectric layer and including a first mesh structure; and a dummy electrode arranged on the upper surface of the dielectric layer and including a second mesh structure, in which at least one of the radiation electrode and the dummy electrode satisfies Equation 1, and an image display device including the same.

Abstract: A connector structure according to an embodiment of the present disclosure includes a second connector and a first connector coupled to the second connector. The first connector includes a first insulator, a first conductive connection terminal disposed on the first insulator, a second conductive connection terminal spaced apart from the first conductive connection terminal to form a single row structure on the first insulator together with the first conductive connection terminal, and a first barrier structure disposed between the first conductive connection terminal and the second conductive connection terminal on the first insulator.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit that includes a first radiator, and an intermediate circuit board coupled to the antenna device to be electrically connected to the antenna unit. The intermediate circuit board includes a core layer, a first feeding wiring formed on one surface of the core layer and electrically connected to the antenna unit, and a second radiator formed on the one surface of the core layer. A radiation coverage is expanded using an antenna included in the intermediate circuit board.

Abstract: Disclosed are an end plate that maintains the flatness of a fuel cell stack formed by stacking a plurality of fuel cells so that a uniform surface pressure is maintained, a fastening bar, and the fuel cell stack including the same. The fuel cell stack includes a plurality of fuel cells, an end plate for the fuel cell stack is disposed on both side surfaces of the fuel cell stack to maintain the flatness of the fuel cell stack so that the uniform surface pressure is maintained, and a fastening bar is disposed outside the fuel cell stack has both ends coupled to the end plate for the fuel cell stack.

Abstract: According to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first RF block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an RF reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and th