Abstract: An antenna structure according to an embodiment of the present disclosure includes a passivation layer, an antenna unit at least partially embedded in an upper portion of the passivation layer, and an insulating layer disposed on a top surface of the passivation layer to cover the antenna unit. A spatial efficiency of the antenna structure is improved and a thickness of the image display device is reduced to improve a bending property.

Abstract: Disclosed is an electronic device. The electronic device according to an embodiment includes a plurality of antennas, and a communication circuit electrically connected with the plurality of antennas. The communication circuit includes a plurality of circuits receiving a signal in a first band and is configured to simultaneously receive the signal in the first band through two or more circuits of the plurality of circuits from two or more antennas, which are positioned adjacent to each other, from among the plurality of antennas. The number of the plurality of antennas is the same as the number of plurality of circuits.

Abstract: An antenna element according to an embodiment of the present invention includes a radiation body including a contact part which is concave toward the transmission line, a transmission line disposed on a different layer from the radiation body and connected to the radiation body through the contact part, and a signal pad connected to an end of the transmission line.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board has a bending area. The flexible circuit board includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer and electrically connected to the antenna unit, a ground line disposed on the first surface of the core layer to be spaced apart from the signal wiring, a ground layer disposed on the second surface of the core layer, and a via structure penetrating a portion of the core layer in a region excluding the bending area and connecting the ground line and the ground layer with each other.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

Abstract: An antenna element according to an embodiment includes: a first radiation body disposed in a first direction; a second radiation body disposed in a second direction; a signal pad configured to supply a signal to the first radiation body and the second radiation body; a first transmission line which extends from the signal pad in the first direction to be connected to the first radiation body; and a second transmission line which extends from the signal pad in the second direction to be connected to the second radiation body.

Abstract: An antenna package according to an exemplary embodiment of the present invention includes a first antenna device which includes a first antenna unit including a first radiator, a second antenna device which includes a second antenna unit including a second radiator whose polarization direction is perpendicular to the first radiator, a first circuit board electrically connected with the first antenna unit, a second circuit board electrically connected with the second antenna unit, and a third circuit board on which at least one antenna driving integrated circuit (IC) chip electrically and independently connected to the first circuit board and the second circuit board is mounted. By supplying power to two antenna devices having different polarization directions, respectively, signal interference and signal loss may be prevented, and dual polarization may be implemented.

Abstract: According to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first RF block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an RF reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and th

Abstract: A memory device may include a first data line driver circuit that generates a first reference voltage set based on a first code and a second code associated with a first data line, and determines bit values of the first input data received through the first data line, based on the first reference voltage set. A second data line driver circuit may similarly generate a second reference voltage set. The reference voltages may have levels based on a decision feedback equalization (DFE) technique to reduce bit errors otherwise caused by inter symbol interference.

Abstract: A vehicular air conditioning system and a control method thereof are provided. The vehicular air conditioning system includes: a plurality of mode doors configured to switch an air discharge mode in a passenger compartment, the mode doors including a defogging door, a vent door and a floor door; and a mode door air pressure reduction part configured to temporarily reduce an air pressure acting on at least one of the mode doors when the air discharge mode is switched.

Abstract: The present invention relates to an air conditioner for a vehicle, in which a means for fixing a cable connecting device is disposed integrally with an air-conditioning case, thereby having an optimized installation location, keeping rigidity, achieving weight lightening, and enhancing assemblability. The air conditioner is to condition air in the interior of the vehicle by heating or cooling indoor air, and includes: a cable connecting device for connecting an actuating means of a controller of the vehicle to actuate a door inside an air-conditioning case with an actuating means of the air-conditioning case by a cable; and a cable fixing part for fixing the cable connecting device to the air-conditioning case.

Abstract: A memory device may include a first data line driver circuit that generates a first reference voltage set based on a first code and a second code associated with a first data line, and determines bit values of the first input data received through the first data line, based on the first reference voltage set. A second data line driver circuit may similarly generate a second reference voltage set. The reference voltages may have levels based on a decision feedback equalization (DFE) technique to reduce bit errors otherwise caused by inter symbol interference.

Abstract: In the present invention, a chemical-vapor-deposition silicon carbide (SIC) bulk having an improved etching characteristic includes silicon carbide (SIC) manufactured by a chemical vapor deposition method using MTS (methyltrichlorosilane), hydrogen (H2), and nitrogen (N2) gases. The SIC manufactured by the chemical vapor deposition method is ?-SiC (3C-SiC), and 6H-SiC is present in the SIC manufactured by the chemical vapor deposition method. Five peaks having a reference code of 03-065-0360 and a peak having a reference code of 00-049-1428 are confirmed to be present from XRD analysis of the silicon carbide bulk, and a nitrogen concentration value is 4.0×1018 atoms/cm3 or more at a depth of 1,500 nm or more from the surface of the bulk, which is a metastable layer.

Abstract: An electronic apparatus, according to various embodiments of the present invention, comprises: a first antenna of a first bandwidth; a second antenna of a second bandwidth which partially overlaps with the first bandwidth; a third antenna of the first bandwidth; a fourth antenna of the second bandwidth; a transmission/reception path corresponding to each of a plurality of bandwidths; a reception path corresponding to each of the plurality of bandwidths; and a path formation unit which forms a path such that any one of the first antenna and the third antenna is connected to the transmission/reception path, the other of the first antenna and the third antenna is connected to the reception path, and any one of the second antenna and the fourth antenna is connected to the transmission/reception path, and the other of the second antenna and the fourth antenna is connected to the reception path.

Abstract: Provided are a method of processing payment based on a blockchain, which is performed by a payment service providing server.

Abstract: The present invention relates to a composition for detecting hydrogen sulfide or measuring a concentration of hydrogen sulfide, and a composition comprising same as an effective ingredient for diagnosing or imaging in vivo inflammation, tissues having hypoxic damage, or cancer.

Abstract: An optical system for a three-dimensional stereoscopic image display, according to exemplary embodiments, can comprise a changing mirror, a rotating mirror, a tilted mirror, a concave mirror and a planar mirror. The changing mirror can be provided so as to change the path of light, having passed through a spatial light modulator, from a horizontal direction to a vertical direction. The rotating mirror can be provided to rotate while having an X-axis and a Y-axis with respectively different curvature radii. The tilted mirror can be provided such that a central region thereof has a hole for allowing light to pass therethrough, and a peripheral region thereof has one surface having a concave tilted structure while the other surface has a planar structure. The concave mirror can be provided such that a central region thereof has a hole having a size capable of encompassing the tilted mirror and a peripheral region thereof has a bent structure that is completely concave.

Abstract: The present invention relates to a three-dimensional molding type powder makeup cosmetic composition, wherein the powder makeup cosmetic composition has a soft feeling of use and excellent adhesion and sustain power and mitigates the generation of creases by containing a powder phase in an oil gel phase and the powder makeup cosmetic composition can be molded into various three-dimensional designs due to physical characteristics of the oil gel phase.

Abstract: Disclosed is an electronic device. The electronic device according to an embodiment includes a plurality of antennas, and a communication circuit electrically connected with the plurality of antennas. The communication circuit includes a plurality of circuits receiving a signal in a first band and is configured to simultaneously receive the signal in the first band through two or more circuits of the plurality of circuits from two or more antennas, which are positioned adjacent to each other, from among the plurality of antennas. The number of the plurality of antennas is the same as the number of plurality of circuits.

Abstract: The present invention relates to a high manganese steel for low temperature applications and a method for manufacturing the same. The high manganese steel contains 0.3 wt % to 0.8 wt % of C, 18 wt % to 26 wt % of Mn, 0.01 wt % to 1 wt % of Si, 0.01 wt % to 0.5 wt % of Al, 0.1 wt % or less of Ti (excluding 0%), 1 wt % to 4.5 wt % of Cr, 0.1 wt % to 0.9 wt % of Cu, 0.03 wt % or less of S (excluding 0%), 0.3 wt % or less of P (excluding 0%), 0.001 wt % to 0.03 wt % of N, 0.004 wt % or less of B (excluding 0%), and a remainder of Fe and other inevitable impurities, wherein a microstructure comprises an austenite single phase structure, and an average grain size of the austenite is 50 ?m or less.