Abstract: A semiconductor apparatus includes an input buffer configured to buffer data inputted through a data input/output pad; a data input control unit configured to transfer an output of the input buffer to a data input/output line in response to a write clock; a test loop control unit configured to output one of a signal of the data input/output line and test latch data in response to a test mode signal; a data output control unit configured to output an output of the test loop control unit in response to a read clock; an output inversion select unit configured to output an output signal of the data output control unit by inverting or non-inverting it; and an output buffer configured to buffer an output signal of the output inversion select unit and output a resultant signal to a node which is coupled with the data input/output pad and input buffer.

Abstract: A semiconductor apparatus includes: a receiver configured to receive a plurality of input signals through a plurality of pads; a signal processing unit configured to process the input signals received by the receiver and output the processed signals as a plurality of internal signals; a MUX unit configured to select the plurality of internal signals as a plurality of MUX output or select test input data and a plurality of latch signals as the plurality of MUX output signals in response to an input/output select signal; a latch unit configured to output the plurality of MUX output signals as the plurality of latch signals and a final output signal in response to a latch clock signal; and a clock selection unit configured to output any one of a test clock signal and an internal clock signal as the latch clock signal in response to a test mode signal.

Abstract: A semiconductor memory device includes a plurality of first pads and a plurality of memory unit blocks. The plurality of first pads are configured to input/output data in a test mode. The plurality of memory unit blocks each include a plurality of second pads configured to input/output data in a normal mode, and a plurality of data path selection units configured to connect internal circuits of the corresponding memory unit block to the plurality of first pads or the plurality of second pads in response to a unit block selection flag signal, a write enable signal, a read enable signal, and a mode control signal.

Abstract: A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.

Abstract: A data output circuit for a semiconductor memory device includes a first driver configured to output a first drive control signal in response to a data signal, a drive controller configured to compare a voltage level of the first drive control signal with a reference voltage and output a second drive control signal, and a second driver configured to drive an output terminal in response to the first drive control signal and additionally drive the output terminal in response to the second drive control signal.

Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.

Abstract: A semiconductor memory device includes a plurality of first pads and a plurality of memory unit blocks. The plurality of first pads are configured to input/output data in a test mode. The plurality of memory unit blocks each include a plurality of second pads configured to input/output data in a normal mode, and a plurality of data path selection units configured to connect internal circuits of the corresponding memory unit block to the plurality of first pads or the plurality of second pads in response to a unit block selection flag signal, a write enable signal, a read enable signal, and a mode control signal.

Abstract: A data output circuit for a semiconductor memory device includes a first driver configured to output a first drive control signal in response to a data signal, a drive controller configured to compare a voltage level of the first drive control signal with a reference voltage and output a second drive control signal, and a second driver configured to drive an output terminal in response to the first drive control signal and additionally drive the output terminal in response to the second drive control signal.

Abstract: Provided are an input apparatus and an input method using a human body contact in which an electric current at a contacted part of a human body varies at different parts of the human body, and an input corresponding to the measured electric current is sensed.

Abstract: The present disclosure relates to a non-sintering metal-insulator-metal (MIM) capacitor and a method of manufacturing the same. The method of manufacturing a non-sintered MIM capacitor includes manufacturing a lower metal-insulator-upper metal structure, wherein the insulator is formed by a non-sintering process comprising: preparing a ceramic-polymer composition comprising a highly dielectric ceramic powder, a polymer resin, and a solvent, the highly dielectric ceramic powder comprising small powder and large powder having a larger average particle size than the small powder; forming a ceramic-polymer film by depositing the ceramic-polymer composition on the lower metal; and curing the polymer resin in the ceramic-polymer film.

Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.

Abstract: A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.

Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.

Abstract: A semiconductor integrated circuit includes a first bump pad and a second bump pad configured to perform at least one of a data input operation and a data output operation in a normal mode; a probe pad configured to perform at least one of a data input operation and a data output operation in a test mode; a data output unit configured to communicate a data to one of the first bump pad and the probe pad; a data input unit configured to communicate a data from one of the second bump pad and the probe pad; a first switching unit configured to connect the probe pad and the data output unit in response to a test mode signal; and a second switching unit configured to connect the probe pad and the data input unit in response to the test mode signal.

Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.

Abstract: A system and method for allowing an organization access to supplier data, allows an organization which has outsourced one or more supply functions to one or more suppliers, permits feeding in real-time data from suppliers and processing and analyzing the data to determine performance metrics. Monitoring of these performance metrics against thresholds, which are established periodically based on customer data and forecast data, allows for the generation of alerts when the thresholds have been exceeded. This may occur, for example, when a supplier contract may have been violated or when new controls may need to be enforced within the contracts. Corrective actions may be taken in response to alerts, and these actions may modify previously established performance metrics and provide for recalculating the performance metrics with the new data.

Abstract: Providing APIs for dynamically generating fast client-side proxies given any type of service interface specification/definition document, such as IDL, WSDL or JMX MBean descriptors, so as to provide fast communication with distributed clients as well as dynamically allowing server interfaces to be updated without burdening clients for generation/assembly of distributed communication client stubs. A dynamic static-proxy invocation gateway is utilized along with a plurality of novel dynamic static-proxy invocation generators, one being associated with each specific service available for use on the servers. The invocation gateway receives requests for service from a client side stub, ascertains the service to be accessed by the client requests, and causes the appropriate generator to create dynamically a static client-side proxy for the requested service, if one does not yet exist.

Abstract: A method for providing a meta-data programming language level interface is disclosed. The method includes receiving an object name from a client program via a meta-data retrieval API, where the object name corresponds to an object located in a runtime environment that includes one or more methods. Meta-data associated with the object is requested from the runtime environment. Meta-data is received for each method included in the object. The meta-data for each method is transmitted to the client program via the meta-data retrieval API.

Abstract: Externally referenced interfaces of a program are statically detected. The static detection of the externally referenced interfaces is performed prior to runtime and without the source code of the program. Input to the static detection is the compiled output of the program, and the output is a list of the externally referenced interfaces of the program.

Abstract: A method for providing a meta-data programming language level interface is disclosed. The method includes receiving an object name from a client program via a meta-data retrieval API, where the object name corresponds to an object located in a runtime environment that includes one or more methods. Meta-data associated with the object is requested from the runtime environment. Meta-data is received for each method included in the object. The meta-data for each method is transmitted to the client program via the meta-data retrieval API.