Abstract: A semiconductor memory device includes; a memory cell array comprising a first sub-memory cell array storing first data having a first characteristic and a second sub-memory cell array storing second data having a second characteristic different from the first characteristic, a first peripheral circuit operatively associated with only the first sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the first sub-memory cell array, and a second peripheral circuit operatively associated with only the second sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the second sub-memory cell array.

Abstract: A refresh address generator may include a lookup table including a first portion storing a first group of addresses associated with a first data retention time, and a second portion storing a second group of addresses associated with a second data retention time different from the first data retention time, wherein the addresses of the first portion are more frequently accessed than the addresses of the second portion to refresh the memory cells corresponding to the addresses. Systems and methods may also implement such refresh address generation.

Abstract: A memory chip includes a chip input-output pad unit, a plurality of semiconductor dies. The chip input-output pad unit includes a plurality of input-output pins connected to an external device and the plurality of semiconductor dies are connected commonly to the chip input-output pad unit and having a full memory capacity respectively. Each semiconductor die includes a die input-output pad unit, a memory region and a conversion block. The die input-output pad unit includes a plurality of input-output terminals respectively connected to the input-output pins of the chip input-output pad unit. The memory region includes an activated region corresponding to a portion of the full memory capacity and a deactivated region corresponding to a remainder portion of the full memory capacity. The conversion block connects the activated region except the deactivated region to the die input-output pad unit.

Abstract: A memory device performing an internal copy operation is provided. The memory device may receive a source address, a destination address, and page size information together with an internal copy command, compares the source address with the destination address, and performs an internal copy operation. The internal copy operation may be an internal block copy operation, an inter-bank copy operation, or an internal bank copy operation. The internal copy operation may be performed with respect to one-page data, half-page data, or quarter-page data, based on the page size information. The memory device may output as a flag signal a copy-done signal indicating that the internal copy operation has been completed.

Abstract: A memory device, system, and/or method are provided for performing a page state informing function. The memory device may compare one or more row addresses received along with a command, determine the page open/close state according to a page hit or miss generated as a result of comparison, count read or write commands with respect to pages corresponding to a same row address, and determine the page open/close state according to a read or write command number generated as a result of counting. The memory device may determine a page open/close state with respect to a corresponding page based on a page hit/miss and a read or write command number and output a flag signal. The memory device may provide the page open/close state for each channel. A memory controller may establish different page open/close policies for each channel.

Abstract: A display apparatus includes a display panel comprising a plurality of gate lines and a plurality of data lines, a gate driver circuit configured to generate a plurality of gate signals sequentially applied to the gate lines, and a timing controller configured to generate a reference control signal, the reference control signal adjusting at least one of a pulse-width and a phase of a predetermined gate signal among the gate signals.

Abstract: In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module.

Abstract: A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.

Abstract: Provided is a profiling unit and method for profiling a number of times that an input/output address of a semiconductor device is accessed. The profiling unit includes a hash unit configured to produce at least one hash value by perform a hash operation on the input/output address, and a profiling circuit configured to profile the number of times that the input/output address is accessed by using the at least one hash value.

Abstract: In one embodiment, the memory device includes a memory cell array having at least a first memory cell group, a second memory cell group and a redundancy memory cell group. The first memory cell group includes a plurality of first memory cells associated with a first data line, the second memory cell group includes a plurality of second memory cells associated with a second data line, and the redundancy memory cell group includes a plurality of redundancy memory cells associated with a redundancy data line. A data line selection circuit is configured to provide a data path between an input/output node and one of the first data line, the second data and the redundancy data line.

Abstract: A display apparatus including a classifier configured to classify image data into preset data of an n-bits (“n” is a natural number), a toggle counter configured to count a number of toggles based on preset data of a present horizontal line and a previous horizontal line and to calculate a final toggle number using a weighted values corresponding to a swing width between data voltages of the present and previous horizontal lines, a determiner configured to determine a representative toggle number of a present frame based on a plurality of final toggle numbers of the present frame, compare the representative toggle number with a plurality of threshold values and determine a level of a power control signal based on a compared result.

Abstract: A semiconductor memory device includes a memory cell array, sub word-line drivers and power selection switches. The memory cell array includes memory cell rows coupled to word lines. The sub word line drivers are coupled to the word lines. The power selection switches are coupled to the sub word-line drivers. Each power selection switch controls a deactivation voltage level of a first word-line activated from the word-lines and an off-voltage level of a second word line adjacent to the first word line so that the deactivation voltage level and the off-voltage level have at least one of a ground voltage, a first negative voltage and a second negative voltage. The ground voltage, the first negative voltage and the second negative voltage have different voltage levels from each other.

Abstract: An on-die termination (ODT) circuit includes a calibration unit, an offset-code generating unit, an adder, and an ODT unit. The calibration unit generates a pull-up code and a pull-down code. The offset-code generates a pull-up offset code and a pull-down offset code based on a mode-register-set signal, the pull-up code, and the pull-down code. The adder adds the pull-up offset code and the pull-down offset code to the pull-up code and the pull-down code, respectively, and generates a pull-up calibration code and a pull-down calibration code. The ODT unit changes ODT resistance in response to the pull-up calibration code and the pull-down calibration code.

Abstract: An error correction apparatus includes an error correction circuit configured to selectively perform error correction on a portion of data that is at least one of written to and read from a plurality of memory cells of a memory device. The portion of data is at least one of written to and read from a subset of the plurality of memory cells, and the subset includes only fail cells among the plurality of memory cells. The error correction apparatus further includes a fail address storage circuit configured to store address information for the fail cells.

Abstract: A semiconductor memory device includes a control logic and a memory cell array in which a plurality of memory cells are arranged. The memory cell array includes a plurality of bank arrays, and each of the plurality of bank arrays includes a plurality of sub-arrays. The control logic controls an access to the memory cell array based on a command and an address signal. The control logic dynamically sets a keep-away zone that includes a plurality of memory cell rows which are deactivated based on a first word-line when the first word-line is enabled. The first word-line is coupled to a first memory cell row of a first sub-array of the plurality of sub-arrays. Therefore, increased timing parameters may be compensated, and parallelism may be increased.

Abstract: A display device prevents breakage due to overheating of a data driver and a signal controller. The display device includes a display panel including a plurality of gate lines, a plurality of data lines and pixels connected to the gate lines and the data lines. A gate driver supplies a gate signal to the gate lines. A data driver supplies a data signal to the data lines. A signal controller controls the gate signal and the data signal. The signal controller includes a data converter converting a gray value of image data when a difference in the gray value of the image data of two adjacent pixels connected to the same data line among the plurality of data lines is greater than or equal to a first threshold value.

Abstract: A memory device includes a memory cell array, an intensively accessed row detection circuit, and a refresh control circuit. The memory cell array includes a plurality of memory cell rows. The intensively accessed row detection circuit generates an intensively accessed row address indicating an intensively accessed memory cell row among the plurality of memory cell rows based on an accumulated access time for each of the plurality of memory cell rows. The refresh control unit preferentially refreshes neighboring memory cell rows adjacent to the intensively accessed memory cell row indicated by the intensively accessed row address when receiving the intensively accessed row address from the intensively accessed row detection unit. The memory device effectively reduces a rate of data loss.

Abstract: An injection-locked phase-locked loop (ILPLL) circuit includes a delay-locked loop (DLL) and an ILPLL. The DLL is configured to generate a DLL clock by performing a delay-locked operation on a reference clock. The ILPLL includes a voltage-controlled oscillator (VCO), and is configured to generate an output clock by performing an injection synchronous phase-locked operation on the reference clock. The DLL clock is injected into the VCO as an injection clock of the VCO.

Abstract: Provided is a refresh method of a volatile memory device. The method includes: detecting a number of disturbances that affect a second memory area as the number of accesses to a first memory area is increased; outputting an alert signal from the volatile memory device to an outside of the volatile memory device when the detected number of disturbances reach a reference value; and performing a refresh operation on the second memory area in response to the alert signal.

Abstract: In one example embodiment, a memory module includes a plurality of memory devices and a buffer chip configured to manage the plurality of memory device. The buffer chip includes a memory management unit having an error correction unit configured to perform error correction operation on each of the plurality of memory devices. Each of the plurality of memory devices includes at least one spare column that is accessible by the memory management unit, and the memory management unit is configured to correct errors of the plurality of memory devices by selectively using the at least one spare column based on an error correction capability of the error correction unit.