Abstract: A light-emitting diode including a semiconductor epitaxial layer, a first electrode, and a second electrode is provided. The semiconductor epitaxial layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a quantum well layer. A recessed portion is formed in the semiconductor epitaxial layer. The recessed portion separates the second-type doped semiconductor layer, the quantum well layer, and a portion of the first-type doped semiconductor layer and defines a first region and a second region on the semiconductor epitaxial layer. The first electrode is located in the first region and electrically connected to at least a portion of the first-type doped semiconductor layer and at least a portion of the second-type doped semiconductor layer. The second electrode is located in the second region and electrically connected to the second-type doped semiconductor layer.

Abstract: A power distribution unit comprising at least two conductors, a plurality of outlets, a plurality of indicator lights, an AC-DC conversion circuit, and a control circuit is provided. Each outlet is electrically coupled to two of the conductors. Each indicator light corresponds to one of the outlets. The input of the AC-DC conversion circuit is electrically coupled to two of the conductors. The control circuit is electrically coupled to the indicator lights and the output of the AC-DC conversion circuit. The control circuit is configured for sequentially driving the indicator lights, and is configured for controlling, according to the group information of each grouped outlet, a corresponding indicator light to display a corresponding color of a group to which the grouped outlet belongs.

Abstract: A light-emitting diode including a semiconductor epitaxial layer, a first electrode, and a second electrode is provided. The semiconductor epitaxial layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a quantum well layer. A recessed portion is formed in the semiconductor epitaxial layer. The recessed portion separates the second-type doped semiconductor layer, the quantum well layer, and a portion of the first-type doped semiconductor layer and defines a first region and a second region on the semiconductor epitaxial layer. The first electrode is located in the first region and electrically connected to at least a portion of the first-type doped semiconductor layer and at least a portion of the second-type doped semiconductor layer. The second electrode is located in the second region and electrically connected to the second-type doped semiconductor layer.

Abstract: A PDA (power distribution apparatus) having capability for color management has at least one PDU (power distribution unit). The PDU has a plurality of outlets and a display; wherein the screen color of the display can display different colors according to the management item, thereby enhancing visualization of the management of the PDA.

Abstract: A method for performing an assessment of mental and behavioral condition of a subject includes displaying, by a virtual reality (VR) device, a VR scene; generating, by the VR device, a notification indicating an assignment for the subject in the VR scene; recording, by a recording device, a response of the subject to the assignment; calculating, by a processing device, at least one score based on the response; and comparing, by the processing device, the score with a pre-established normative scale to generate an assessment result for the mental and behavioral condition of the subject.

Abstract: A power output control module for power distribution is installed inside a power distributor that is connected to an AC power source and multiple electronic devices to control the AC power outputted to the electronic devices. The power output control module continuously detects whether the AC power inputted is normal. When the AC power source is disconnected by accident, a latch relay is controlled to switch to be open, so that the AC power source and the electronic devices are disconnected. This prevents the instantaneous surge current from damaging the electronic devices when the AC power source resumes its normal output and also increases the safety and reliability of electronic devices.

Abstract: A robust touch display apparatus utilizing adhesive as a shock absorber includes a cover lens, a touch module disposed under the cover lens, a display module disposed on a surface of the touch module away from the cover lens, a casing, and a protection frame. The casing receives the cover lens and supports the touch module and the display module. The protection frame is fixed on an outside surface of the casing. The protection frame faces a sidewall of the cover lens and the touch module.

Abstract: Provided is a light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second electrode. The semiconductor device layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a light-emitting layer therebetween. The first electrode is electrically connected to the first-type doped semiconductor layer. The current-blocking layer is on the second-type doped semiconductor layer. The current-blocking layer is between the current-spreading layer and the second-type doped semiconductor layer. The second electrode is on the current-spreading layer and electrically connected to the second-type doped semiconductor layer. The current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface.

Abstract: A light emitting device includes a semiconductor light emitting unit and a light-transmitting substrate. The light-transmitting substrate includes an upper surface having two long sides and two short sides and a side surface, and the semiconductor light emitting unit is disposed on the upper surface. The side surface includes two first surfaces, two second surfaces, and rough micro-structures. Each of the first surfaces is connected to one of the long sides of the upper surface, and each of the second surfaces is connected to one of the short sides of the upper surface. The rough micro-structures are formed on the first surfaces and the second surfaces, a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces. A manufacturing method of the light emitting device is also provided.

Abstract: An LED includes a first-type semiconductor layer, a light emitting layer, a second-type semiconductor layer, a first metal layer, a first current conducting layer, a first bonding layer, and a second current conducting layer. The light emitting layer is located between the first-type semiconductor layer and the second-type semiconductor layer. The first metal layer is located on the first-type semiconductor layer and electrically connected to the first-type semiconductor layer. The first metal layer is located between the first current conducting layer and the first-type semiconductor layer. The first current conducting layer is located between the first bonding layer and the first metal layer. The first bonding layer is electrically connected to the first-type semiconductor layer via the first current conducting layer and the first metal layer. The first bonding layer has through holes overlapping with the first metal layer.

Abstract: The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.

Abstract: A PDA (power distribution apparatus) having capability for color management, the PDA has at least one PDU (power distribution unit), the PDU has a plurality of outlets and a displayer; wherein the screen color of the displayer can display different color according to the management item, thereby executing the visualize management of the PDA.

Abstract: A light-emitting diode including a semiconductor epitaxial layer, a first electrode, and a second electrode is provided. The semiconductor epitaxial layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a quantum well layer. A recessed portion is formed in the semiconductor epitaxial layer. The recessed portion separates the second-type doped semiconductor layer, the quantum well layer, and a portion of the first-type doped semiconductor layer and defines a first region and a second region on the semiconductor epitaxial layer. The first electrode is located in the first region and electrically connected to at least a portion of the first-type doped semiconductor layer and at least a portion of the second-type doped semiconductor layer. The second electrode is located in the second region and electrically connected to the second-type doped semiconductor layer.

Abstract: The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.

Abstract: Provided is a light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second electrode. The semiconductor device layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a light-emitting layer therebetween. The first electrode is electrically connected to the first-type doped semiconductor layer. The current-blocking layer is on the second-type doped semiconductor layer. The current-blocking layer is between the current-spreading layer and the second-type doped semiconductor layer. The second electrode is on the current-spreading layer and electrically connected to the second-type doped semiconductor layer. The current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface.

Abstract: A robust touch display apparatus utilizing adhesive as a shock absorber includes a cover lens, a touch module disposed under the cover lens, a display module disposed on a surface of the touch module away from the cover lens, a casing, and a protection frame. The casing receives the cover lens and supports the touch module and the display module. The protection frame is fixed on an outside surface of the casing. The protection frame faces a sidewall of the cover lens and the touch module.

Abstract: A light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second electrode is provided. The semiconductor device layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a light-emitting layer located between the first-type and second-type doped semiconductor layers. The first electrode is electrically connected to the first-type doped semiconductor layer. The current-blocking layer is disposed on the second-type doped semiconductor layer, and the current-blocking layer includes a main body and an extension portion extended from the main body. The current-spreading layer covers the current-blocking layer.

Abstract: A light emitting device includes a semiconductor light emitting unit and a light-transmitting substrate. The light-transmitting substrate includes an upper surface having two long sides and two short sides and a side surface, and the semiconductor light emitting unit is disposed on the upper surface. The side surface includes two first surfaces, two second surfaces, and rough micro-structures. Each of the first surfaces is connected to one of the long sides of the upper surface, and each of the second surfaces is connected to one of the short sides of the upper surface. The rough micro-structures are formed on the first surfaces and the second surfaces, a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces. A manufacturing method of the light emitting device is also provided.

Abstract: A light emitting component includes an epitaxial structure, a first electrode, a conducting layer and a second electrode. The epitaxial structure includes a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer. The first electrode is disposed on the first semiconductor layer. The conducting layer is disposed on the second semiconductor layer and includes a first conducting area and a second conducting area, wherein a resistance of the first conducting area is smaller than a resistance of the second conducting area. The second electrode is disposed on the conducting layer and has an extension portion, wherein the extension portion extends toward the first electrode and the first conducting area overlaps at least a part of the extension portion.

Abstract: A diffuser film and a method of manufacturing the same are proposes. A colloid layer is formed on a transparent substrate. A mold plate with a raised texture is then used to roll over the colloid layer to let the surface of the colloid layer have an indented texture. Finally, a solidification process is carried out to harden the colloid layer to form a coarse layer whose surface has an indented texture. The diffuser film can thus achieve the effects of light concentration and light uniformity promotion, and can also reduce astray light rays. Moreover, using a mold plate for embossing can accomplish high reproducibility of film thickness and indented texture of the coarse layer, hence being advantageous to mass production.