Abstract: A multiplex fiber optic biosensor including an optical fiber, a plurality of noble metal nanoparticle layers, a plurality of light sources and a light source function generator is disclosed. The optical fiber includes a plurality of sensing regions which are unclad regions of the optical fiber so that the fiber core is exposed, wherein the noble metal nanoparticle layers are set in each sensing regions. The light sources emit light with different wavelengths, and the noble metal nanoparticle layers absorb the lights with different wavelengths, respectively. The light sources emit the lights in different timing sequences or different carrier frequencies, wherein when the lights propagate along the optical fiber in accordance with the different timing sequences or the different carrier frequencies, a detection unit detects particle plasmon resonance signals produced by interactions between the different noble metal nanoparticle layers and the corresponding analytes.

Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.

Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the device wafer in a first ambient environment having a first pressure. The bonding forms a plurality of chambers abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of chambers. The one or more openings in the one or more of the plurality of chambers are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of chambers to be held at the different pressure.

Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.

Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the device wafer in a first ambient environment having a first pressure. The bonding forms a plurality of chambers abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of chambers. The one or more openings in the one or more of the plurality of chambers are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of chambers to be held at the different pressure.

Abstract: A method for forming a MEMS device is provided. The method includes the following steps of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate; and fabricating a bulk silicon sensor on the second portion of the substrate.

Abstract: An underlaying device includes a main signal port, an expanding signal port, a signal process component, and a power connector. The main signal port is receiving and sending a communication signal from/to the computer device by means of a main signal wire. The expanding signal port is receiving and sending the communication signal from/to an external expanding device. The signal process component is coupled between the main signal port and the expanding signal port for transforming the communication signal into a signal which is able to be received and sent between the main signal port and the expanding signal port. The power connector is supplying power by means of a power wire. The underlaying device is suitable for various computer devices and is able to integrate the functionality of connection ports.

Abstract: A method for forming a MEMS device is provided. The method includes the following operations of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate using a double-side process; and fabricating a bulk silicon sensor on the second portion of the substrate.

Abstract: The invention provides a micro-electro-mechanical device which is manufactured by a CMOS manufacturing process. The micro-electro-mechanical device includes a stationary unit, a movable unit, and a connecting member. The stationary unit includes a first capacitive sensing region and a fixed structure region. The movable unit includes a second capacitive sensing region and a proof mass, wherein the first capacitive sensing region and the second capacitive sensing region form a capacitor, and the proof mass region consists of a single material. The connecting member is for connecting the movable unit in a way to allow a relative movement of the movable unit with respect to the stationary unit.

Abstract: An underlaying device includes a main signal port, an expanding signal port, a signal process component, and a power connector. The main signal port is receiving and sending a communication signal from/to the computer device by means of a main signal wire. The expanding signal port is receiving and sending the communication signal from/to an external expanding device. The signal process component is coupled between the main signal port and the expanding signal port for transforming the communication signal into a signal which is able to be received and sent between the main signal port and the expanding signal port. The power connector is supplying power by means of a power wire. The underlaying device is suitable for various computer devices and is able to integrate the functionality of connection ports.

Abstract: A driving circuit of an input/output (I/O) interface is provided. The driving circuit includes a main output stage and an enhancing unit. The main output stage receives at least one driving signal and outputs an output signal corresponding to an input signal accordingly. The enhancing unit is coupled to the main output stage. The enhancing unit receives and detects the level of the output signal so as to drive the output force of the main output stage in a first output level or a second output level, wherein the first output level is higher than the second output level.

Abstract: A random number generator and a random number generating method thereof are provided. The random number generator includes a signal generating unit and a sampling unit. The signal generating unit is adapted for memorizing a status of a noise generated during a transient of an output signal of an output buffer, and accordingly generating a frequency conversion signal which changes according to time and ambient factors. The sampling unit is coupled to the signal generating unit for receiving the frequency conversion signal, and sampling the frequency conversion signal according to a sampling clock pulse, so as to obtain a plurality of sets of unpredictable random number codes.

Abstract: A driving circuit of an input/output (I/O) interface is provided. The driving circuit includes a main output stage and an enhancing unit. The main output stage receives at least one driving signal and outputs an output signal corresponding to an input signal accordingly. The enhancing unit is coupled to the main output stage. The enhancing unit receives and detects the level of the output signal so as to drive the output force of the main output stage in a first output level or a second output level, wherein the first output level is higher than the second output level.

Abstract: An oscillator, a driving circuit and an oscillation method are provided. The driving circuit and a crystal are coupled in parallel to generate a clock signal. The driving circuit includes a buffer unit and a control unit. The buffer unit is coupled in parallel to the crystal, and used to amplify an oscillation signal outputted from the crystal to generate the clock signal. The control unit is coupled to the buffer unit, and used to generate a control signal to the buffer unit. The control unit determines a voltage level of the control signal by detecting whether the clock signal or the oscillation signal satisfies an oscillation condition of the crystal, so as to control a gain value of the buffer unit. Therefore, noise of different frequency bands loaded into the clock signal can be avoided.

Abstract: An oscillator, a driving circuit and an oscillation method are provided. The driving circuit and a crystal are coupled in parallel to generate a clock signal. The driving circuit includes a buffer unit and a control unit. The buffer unit is coupled in parallel to the crystal, and used to amplify an oscillation signal outputted from the crystal to generate the clock signal. The control unit is coupled to the buffer unit, and used to generate a control signal to the buffer unit. The control unit determines a voltage level of the control signal by detecting whether the clock signal or the oscillation signal satisfies an oscillation condition of the crystal, so as to control a gain value of the buffer unit. Therefore, noise of different frequency bands loaded into the clock signal can be avoided.

Abstract: A random number generator and a random number generating method thereof are provided. The random number generator includes a signal generating unit and a sampling unit. The signal generating unit is adapted for memorizing a status of a noise generated during a transient of an output signal of an output buffer, and accordingly generating a frequency conversion signal which changes according to time and ambient factors. The sampling unit is coupled to the signal generating unit for receiving the frequency conversion signal, and sampling the frequency conversion signal according to a sampling clock pulse, so as to obtain a plurality of sets of unpredictable random number codes.