Abstract: A wide-angle lens calibration system is provided, which may include a rotation unit, an image input unit, and a processing unit. A lens to be calibrated may be disposed on the rotation unit; the rotation direction of the rotation unit may be parallel to the horizontal direction; the optical axis center of the lens may be aligned with a reference object. The image input unit may receive images from the lens. The processing unit may control the rotation unit to rotate and analysis the images received from the lens. The processing unit may execute a distortion calibration process, wherein the processing unit may continuously rotate the rotation unit by a predetermined angle and then record the distance between the position of the reference object in the image and the optical axis center and a total rotation angle after each rotation so as to establish a distortion calibration model.

Abstract: The invention is directed to a method for patterning a material layer. The method comprises steps of providing a material layer having a first hard mask layer and a second hard mask layer successively formed thereon and then patterning the second hard mask layer. Thereafter, an etching process is performed to pattern the first hard mask layer by using the patterned second hard mask layer as a mask, and the etching process is performed with a power of about 1000 W. Next, the material layer is patterned by using the patterned first hard mask layer as a mask.

Abstract: Measurements of line roughness are separated into groups depending upon pre-layers. Image data collected from similar pre-layer types are considered together in order to separate effects of line roughness from distortion of measurements caused by the pre-layers. The resulting line roughness measurements are used to estimate an aspect of line quality.

Abstract: Provided is a non-volatile memory including a substrate having at least one protruding part, a charge trapping layer and a gate layer. The charge trapping layer covers a portion of the surface of the substrate beside the protruding part and covers at least a portion of the sidewall of the protruding part. The gate layer is disposed on the charge trapping layer. In such disposition of the invention, adjacent bits can be isolated by the protruding part of the substrate, so as to avoid mutual interference between the bits and thereby improve the performance and reliability of the device.

Abstract: An image review system presents an image to a reviewer and records reviewer feedback, including reviewer position indicators relating to portions of the image and reviewer commentary data, which can be audio, visual, textual, etc. The reviewer position indicators and reviewer commentary data each have a time component, corresponding to when the reviewer indicated a position on the image and when the reviewer provided the commentary, respectively. During playback, the viewer can select a subset of the image of interest and get a playback of the reviewer commentary data that corresponds to the times represented by the reviewer position indicators that fall within the selected subset of the image. The reviewer position indicators can be collectively indicated by a heat map that, when laid over the image, indicates which portions of the image are commented on and how much time is spent there.

Abstract: A method of object tracking is provided with creating areas of a tracking object and a non-tracking object respectively; determining a state of the tracking object and the non-tracking object is separation, proximity, or overlap; creating at least one separation template image of a separation area of the tracking object and/or the non-tracking object if the tracking object is proximate the non-tracking object; fetching all feature points of an overlapping area of the tracking object and the non-tracking object if the tracking object and the non-tracking object overlap; performing a match on each of the feature points and the separation template image so as to calculate a corresponding matching error score respectively; and comparing the matching error score of each feature point with that of the separation template image so as to determine whether the feature points belong to the tracking object or the non-tracking object.

Abstract: Measurements of line roughness are separated into groups depending upon pre-layers. Image data collected from similar pre-layer types are considered together in order to separate effects of line roughness from distortion of measurements caused by the pre-layers. The resulting line roughness measurements are used to estimate an aspect of line quality.

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.

Abstract: A method of object tracking is provided with creating areas of a tracking object and a non-tracking object respectively; determining a state of the tracking object and the non-tracking object is separation, proximity, or overlap; creating at least one separation template image of a separation area of the tracking object and/or the non-tracking object if the tracking object is proximate the non-tracking object; fetching all feature points of an overlapping area of the tracking object and the non-tracking object if the tracking object and the non-tracking object overlap; performing a match on each of the feature points and the separation template image so as to calculate a corresponding matching error score respectively; and comparing the matching error score of each feature point with that of the separation template image so as to determine whether the feature points belong to the tracking object or the non-tracking object.

Abstract: The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming on the growing substrate to have plural grooves; forming a semiconductor element layer on the growing substrate; and changing the temperature of the growing substrate and the semiconductor element layer so as to separate the semiconductor element layer from the growing substrate.

Abstract: A light emitting diode (LED) substrate including a sapphire substrate is provided. The sapphire substrate has a surface consisting of a plurality of upper trigonal and lower hexagonal tapers, wherein each of the upper trigonal and lower hexagonal tapers is consisted of a hexagonal taper and a trigonal taper on the hexagonal taper, and a pitch of the upper trigonal and lower hexagonal tapers is less than 10 ?m. This LED substrate has high light-emitting efficiency.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.

Abstract: A method to further adjust the final CD of a material to be etched during an etching process, and after a photolithographic patterning process can include patterning a semiconductor substrate using a mask layer. The mask layer can comprise a hardmask material having a protruding feature with an initial width. A first plasma comprising carbon and fluorine can be introduced into a chamber, where residual carbon and fluorine is deposited on at least the chamber wall. A portion of the mask layer can then be removed with a second plasma incorporating the residual carbon and fluorine, whereby remaining hardmask material forms a feature pattern where the protruding feature has a final width different from the initial width. The feature pattern can then be transferred to the semiconductor substrate using the final width of the at least one protruding feature provided by the remaining hardmask material.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.