Abstract: An augmented reality providing system and method, an information processing device, and a non-transitory computer readable recording medium recorded with a program are provided. An augmented reality providing system includes a unit for acquiring three-dimensional data, a unit for generating three-dimensional shaping data of a first model from the three-dimensional data, a unit for shaping and outputting a shaped object on the basis of the three-dimensional shaping data, imaging a unit for imaging the shaped object, a unit for calculating a camera parameter from the captured image, a unit for generating a second model including a region of interest that is a non-shaping target from the three-dimensional data, and a unit for determining a depth relationship between the shaped object and the second three-dimensional model on the basis of the camera parameter, and a virtual object of the region of interest in front of the shaped object is displayed.

Abstract: A virtual plane obtained by a locus when a tangent line, which passes through a tool distal end edge, of a virtual circle formed when a tool distal end edge of a cutting edge is rotated in a tool circumferential direction is moved parallel to a tool axial line is a reference plane, an angle (ARt) at which a cross line of the reference plane and the cutting edge virtual plane, is inclined with respect to the tool axial line projected onto the reference plane, is in a range of ?30 degrees to ?60 degrees, an angle (RR) at which a cutting edge tangent line which passes through the tool distal end edge and extends outward in a tool radial direction, is inclined with respect to a predetermined tool radial direction, which passes through the tool distal end edge, is in a range of ?30 degrees to ?75 degrees.

Abstract: To provide a gas circuit breaker having a space-saving reliable double motion mechanism having a high degree of freedom in design. A double motion mechanism section of the gas circuit breaker is formed of a drive-side connecting rod, a driven-side connecting rod, levers connecting them and a guide regulating operations of the drive-side connecting rod and the driven-side connecting rod. A movable pin is connected to a first grooved cam formed in the drive-side connecting rod, a second grooved cam formed in the guide and third grooved cams formed in the levers respectively, and posture holding members are provided in the movable pin. The movable pin moves in the respective grooved cams by an operation of the drive-side connecting rod, thereby rotating the levers, driving the driven-side connecting rod in an opposite direction of the drive-side connecting rod, and driving the driven-side arcing contact in an opposite direction of the driven-side arcing contact.

Abstract: An image analysis apparatus, which analyzes orientations of fiber bundles of X-yarns and Y-yarns from a three-dimensional image of a woven fabric made of fiber bundles of the X-yarns, the Y-yarns, and Z-yarns, includes: a binarization unit that binarizes the three-dimensional image; an overlapping area extraction unit that extracts an overlapping area from the binarized image; a reference direction determination unit that averages an overlapping direction of each voxel included in the overlapping area and determines the averaged direction as a reference direction; a Z-yarn removal unit that removes the Z-yarns from the binarized image by applying a directional distance method on a reference plane perpendicular to the reference direction; and a fiber bundle orientation estimation unit that applies the directional distance method on the reference plane and estimates the orientations of the fiber bundles of the X-yarns and the Y-yarns based on a calculated directional distance.

Abstract: Near field communication device has a configuration in which at least a part of coil of coil element is covered with cover at a portion opposite to substrate and a part of cover is fixed to substrate directly or indirectly. Therefore, even when near field communication device is mounted to one of various electronic apparatuses in a vicinity of display unit outer peripheral frame made of metal, a large change in impedance or a large reduction in magnetic field strength can be prevented. As a result, a reduction in receiving sensitivity can be suppressed.

Abstract: A virtual object display system includes a plurality of head-mounted displays 1 each having a virtual object acquisition unit 22 that acquires a virtual object, a display information acquisition unit 23 that acquires display information used to display the virtual object, and a display control unit 24 that causes a display unit to display the virtual object on the basis of the display information, and enables switching between of first display control for causing the virtual object to be displayed on the basis of display information acquired by each of the plurality of head-mounted displays 1 and second display control for causing the virtual object having an identical orientation to an orientation of the virtual object displayed on the basis of display information acquired by another head-mounted display 1 to be displayed.

Abstract: To provide a gas circuit breaker having a space-saving reliable double motion mechanism having a high degree of freedom in design. A double motion mechanism section of the gas circuit breaker is formed of a drive-side connecting rod, a driven-side connecting rod, levers connecting them and a guide regulating operations of the drive-side connecting rod and the driven-side connecting rod. A movable pin is connected to a first grooved cam formed in the drive-side connecting rod, a second grooved cam formed in the guide and third grooved cams formed in the levers respectively, and posture holding members are provided in the movable pin. The movable pin moves in the respective grooved cams by an operation of the drive-side connecting rod, thereby rotating the levers, driving the driven-side connecting rod in an opposite direction of the drive-side connecting rod, and driving the driven-side arcing contact in an opposite direction of the driven-side arcing contact.

Abstract: An image analysis apparatus, which analyzes orientations of fiber bundles of X-yarns and Y-yarns from a three-dimensional image of a woven fabric made of fiber bundles of the X-yarns, the Y-yarns, and Z-yarns, includes: a binarization unit that binarizes the three-dimensional image; an overlapping area extraction unit that extracts an overlapping area from the binarized image; a reference direction determination unit that averages an overlapping direction of each voxel included in the overlapping area and determines the averaged direction as a reference direction; a Z-yarn removal unit that removes the Z-yarns from the binarized image by applying a directional distance method on a reference plane perpendicular to the reference direction; and a fiber bundle orientation estimation unit that applies the directional distance method on the reference plane and estimates the orientations of the fiber bundles of the X-yarns and the Y-yarns based on a calculated directional distance.

Abstract: A virtual plane obtained by a locus when a tangent line, which passes through a tool distal end edge, of a virtual circle formed when a tool distal end edge of a cutting edge is rotated in a tool circumferential direction is moved parallel to a tool axial line is a reference plane, an angle (ARt) at which a cross line of the reference plane and the cutting edge virtual plane, is inclined with respect to the tool axial line projected onto the reference plane, is in a range of ?30 degrees to ?60 degrees, an angle (RR) at which a cutting edge tangent line which passes through the tool distal end edge and extends outward in a tool radial direction, is inclined with respect to a predetermined tool radial direction, which passes through the tool distal end edge, is in a range of ?30 degrees to ?75 degrees.

Abstract: An augmented reality providing system and method, an information processing device, and a non-transitory computer readable recording medium recorded with a program are provided. An augmented reality providing system includes a unit for acquiring three-dimensional data, a unit for generating three-dimensional shaping data of a first model from the three-dimensional data, a unit for shaping and outputting a shaped object on the basis of the three-dimensional shaping data, imaging a unit for imaging the shaped object, a unit for calculating a camera parameter from the captured image, a unit for generating a second model including a region of interest that is a non-shaping target from the three-dimensional data, and a unit for determining a depth relationship between the shaped object and the second three-dimensional model on the basis of the camera parameter, and a virtual object of the region of interest in front of the shaped object is displayed.

Abstract: A three-dimensional shaping system (10) includes a device (20) which acquires three-dimensional data, a device (22) which generates shaping target object data from the three-dimensional data, a device (26) which generates three-dimensional shaping data by adding, to the shaping target object data, attachment part data representing a three-dimensional shape of a marker attachment part (42) for attaching a marker (50) to a shaped object (40) shaped based on the shaping target object data, a device (14) which shapes and outputs the shaped object on the basis of the three-dimensional shaping data, an imaging device (60) which images the shaped object (40) in a state of the marker (50) being attached, and a device (76) which recognizes the marker from a captured image to calculate a camera parameter.

Abstract: In one semiconductor device, a semiconductor chip has first and second pad electrodes disposed on the main surface thereof, insulating films that cover the main surface of the semiconductor chip, a rewiring layer that is disposed between the insulating films, and a plurality of external terminals disposed on the top of the insulating film. The plane size of the first pad electrode and the second pad electrode differ from one another, and the first pad electrode and the second pad electrode are connected to any of the plurality of external terminals via the rewiring layer.

Abstract: A charging apparatus is provided that avoids a reduction in the strength of radio waves or a magnetic field used by a charging target device having a wireless communication function and reduces an influence on the radio waves or magnetic field. In this apparatus, position detection section (201) detects a position of power reception coil (251) of charging target device (150) placed on charging table (101). Power transmission coil (208) is made close to power reception coil (251) and transmits electric power. Coil moving mechanism (207) brings power transmission coil (208) close to the position of power reception coil (251) that is detected by position detection section (201).

Abstract: A charging apparatus is provided that avoids a reduction in the strength of radio waves or a magnetic field used by a charging target device having a wireless communication function and reduces an influence on the radio waves or magnetic field. In this apparatus, position detection section (201) detects a position of power reception coil (251) of charging target device (150) placed on charging table (101). Power transmission coil (208) is made close to power reception coil (251) and transmits electric power. Coil moving mechanism (207) brings power transmission coil (208) close to the position of power reception coil (251) that is detected by position detection section (201).

Abstract: Near field communication device has a configuration in which at least a part of coil of coil element is covered with cover at a portion opposite to substrate and a part of cover is fixed to substrate directly or indirectly. Therefore, even when near field communication device is mounted to one of various electronic apparatuses in a vicinity of display unit outer peripheral frame made of metal, a large change in impedance or a large reduction in magnetic field strength can be prevented. As a result, a reduction in receiving sensitivity can be suppressed.

Abstract: To provide a semiconductor device with a wafer level package structure that allows for probing while reducing the area occupied by the pad electrodes. [Solution] In the present invention, the following are provided: a semiconductor chip (100) that has first and second pad electrodes (120a, 120b) disposed on the main surface thereof; insulating films (310, 330) that cover the main surface of the semiconductor chip (100); a rewiring layer (320) that is disposed between the insulating films (310, 330); and a plurality of external terminals (340) disposed on the top of the insulating film (330). The plane size of the first pad electrode (120a) and the second pad electrode (120b) differ from one another, and the first pad electrode (120a) and the second pad electrode (120b) are connected to any of the plurality of external terminals (340) via the rewiring layer (320).

Abstract: [Problem] To provide a semiconductor device with a wafer level package structure that allows for probing while reducing the area occupied by the pad electrodes. [Solution] In the present invention, the following are provided: a semiconductor chip (100) that has first and second pad electrodes (120a, 120b) disposed on the main surface thereof; insulating films (310, 330) that cover the main surface of the semiconductor chip (100); a rewiring layer (320) that is disposed between the insulating films (310, 330); and a plurality of external terminals (340) disposed on the top of the insulating film (330). The plane size of the first pad electrode (120a) and the second pad electrode (120b) differ from one another, and the first pad electrode (120a) and the second pad electrode (120b) are connected to any of the plurality of external terminals (340) via the rewiring layer (320).

Abstract: A device has a first substrate having a first surface; a first electrode pad arranged on the first surface of the first substrate; a first insulator film provided on the first surface of the first substrate so that the first electrode pad is exposed; a first bump electrode provided on the first electrode pad and having a first diameter; and a second bump electrode provided on the first insulator film and having a second diameter smaller than the first diameter.

Abstract: A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

Abstract: In a semiconductor device of the present invention, a second semiconductor chip is stacked on a first semiconductor chip having a plurality of bonding pads in its central region, with a bonding layer interposed therebetween. A plurality of wires respectively connected to the plurality of bonding pads of the first semiconductor chip are led out to the outside over a peripheral edge of the first semiconductor chip by passing through a space between the first and second semiconductor chips. A retaining member for retaining at least a subset of the plurality of wires is provided in a region on the first semiconductor chip including a middle point between the bonding pads and the peripheral edge of the first semiconductor chip by using a material different from the bonding layer so that the subset of the wires is positioned generally at a center of the spacing between the first semiconductor chip and the second semiconductor chip.