Abstract: A method for hard mask layer removal includes dispensing a chemical on a hard mask layer, in which the chemical includes an acidic chemical. The chemical is drained from a chamber after hard mask removal.

Abstract: An electronic paper apparatus including a communication module and a control module is provided. The communication module receives an electrical signal and generates a power voltage according to the electric signal. The communication module wakes up a controller during a first period of a work period by using the power voltage. The control module is electrically connected to the communication module, and includes the controller and an electronic paper display. The control module establishes a communication connection with the communication module during a second period of the work period. The power circuit module generates a driving voltage according to the power voltage to drive the electronic paper display to display image information according to the driving voltage during a display period. The first period and the second period are two continuous time intervals forming the work period. Furthermore, a driving method of the electronic paper apparatus is also provided.

Abstract: A method for hard mask layer removal includes dispensing a chemical on a hard mask layer, in which the chemical includes an acidic chemical. The chemical is drained from a chamber after hard mask removal.

Abstract: A method of selectively removing silicon nitride is provided. The method includes: providing a wafer having silicon nitride on a surface of the wafer; supplying a mixture of phosphoric acid and a silicon-containing material into a process tank, in which the mixture has a predetermined silicon concentration; and submerging the wafer into the mixture within the process tank to remove the silicon nitride. An etching apparatus of selectively removing silicon nitride is also provided.

Abstract: A method of selectively removing silicon nitride is provided. The method includes: providing a wafer having silicon nitride on a surface of the wafer; providing a mixture of phosphoric acid and a silicon-containing material; and delivering the mixture to the surface of the wafer to remove the silicon nitride. Single wafer etching apparatuses of selectively removing silicon nitride are also provided.

Abstract: A semiconductor device includes providing a workpiece including an insulating material layer disposed thereon. The insulating material layer includes a trench formed therein. A barrier layer on the sidewalls of the trench is formed using a surface modification process and a surface treatment process.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece including an insulating material layer disposed thereon. The insulating material layer includes a trench formed therein. The method includes forming a barrier layer on the sidewalls of the trench using a surface modification process and a surface treatment process.

Abstract: The present disclosure provides a method for fabricating a semiconductor device. The method includes providing a semiconductor substrate having a first region and a second region, forming a high-k dielectric layer over the semiconductor substrate, forming a first metal layer and a first silicon layer by an in-situ deposition process, patterning the first silicon layer to remove a portion overlying the second region, patterning the first metal layer using the patterned first silicon layer as a mask, and removing the patterned first silicon layer including applying a solution. The solution includes a first component having an [F-] concentration greater than 0.01M, a second component configured to adjust a pH of the solution from about 4.3 to about 6.7, and a third component configured to adjust a potential of the solution to be greater than ?1.4 volts.

Abstract: The present disclosure provides a method for fabricating a semiconductor device. The method includes providing a semiconductor substrate having a first region and a second region, forming a high-k dielectric layer over the semiconductor substrate, forming a first metal layer and a first silicon layer by an in-situ deposition process, patterning the first silicon layer to remove a portion overlying the second region, patterning the first metal layer using the patterned first silicon layer as a mask, and removing the patterned first silicon layer including applying a solution. The solution includes a first component having an [F—] concentration greater than 0.01 M, a second component configured to adjust a pH of the solution from about 4.3 to about 6.7, and a third component configured to adjust a potential of the solution to be greater than ?1.4 volts.

Abstract: A diagnostic system for monitoring internal conditions inside a fuel cell includes a pair of bipolar plates, a gas diffusion layer, a central controller, and three or more sensors. Each bipolar plate contains a fuel gas channel. The central controller includes a computing unit and a display. Each sensor has a resistor portion, a capacitor portion, a common lead, a resistor line, and a capacitor line for detecting a voltage value, a resistance value, and a capacity value. The display shows out physical information detected by these sensors for diagnosing the fuel cell. The physical information includes voltage, resistance, capacity, temperature, humidity, flow velocity, and flow rate. In which, it can detect various physical information inside the fuel cell. It can monitor the internal conditions continuously and directly. Plus, it can prolong the product life of the fuel cell.

Abstract: This invention is to introduce a manufacturing method of fuel cell with integration of catalytic layer and micro sensors, which comprises following steps: manufacturing multi-hole silicon layer step, generating catalytic layer step, forming insulation layer step, integrating micro sensors step, and finalizing step. With the function of gas-diffusion layer in the multi-hole silicon wafer and multiple catalytic grains evenly spread over the inner walls of flow-way holes of the silicon wafer, a great catalytic layer can be formed effectively. Further, micro sensors properly are integrated. This invention's merits include simple structure and capabilities of simultaneously detecting temperature and humidity. Plus, it can heat up internally for a fuel cell.

Abstract: A fuel cell having micro sensors is disclosed. It has a pair of bipolar plates and a catalytic portion. About each bipolar plate, it has an inner surface and an outer surface. There are a fluid inlet, a fluid outlet, a channel, one or more micro sensors and several signal lines disposed on this inner surface. This catalytic portion is disposed between two bipolar plates. So, it can detect the actual internal conditions in the fuel cell. There is no need to install extra micro sensors. And, the fuel cell stability and safety can be enhanced significantly.

Abstract: A combined electrochemical machining and electropolishing micro-machining method includes the steps of (1) preparing step, (2) first-stage processing step, (3) second-stage processing step, and (4) finishing step. The apparatus includes an electrochemical machining solution container, an electropolishing solution container, a metal workpiece connecting with an anode, a mold-plate portion connecting with a cathode. Based on this arrangement, the metal workpiece is immersed in a first working fluid to conduct the electrochemical machining process and then to be immersed in a second working fluid to conduct the electropolishing process. So, the overall micro-machining speed is fast. It can improve the surface roughness significantly. It is suitable for extremely hard metal workpiece.