Patents by Inventor Yuan Wang

Yuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105546
    Abstract: A module device on a first substrate includes a power module, a housing, a pair of locking structures. The housing covers the power module. The locking structures are installed on a pair of opposite sides of the housing, and the locking structure includes a main body, a locking ring, a pair of ribs and anchoring portions. The locking ring extends from a side toward an inner side of the main body, and is a double-ring structure, which includes an inner and an outer ring. A first side of the outer ring is connected to the main body, a second side of the outer ring is connected to the inner ring. The ribs extend along a normal direction of the top surface of the main body. The anchoring portions are disposed at the end of the ribs, and an extending direction is perpendicular to an extending direction of the rib.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 28, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ji-Yuan Syu, Yuan-Cheng Huang, Yu-Chih Wang
  • Publication number: 20240104787
    Abstract: Techniques are described with respect to a system, method, and computer product for enhancement of socialization between one or more individuals wearing personal protective equipment. An associated method includes identifying a plurality of social communications between one or more individuals wearing personal protective equipment (PPE) and assigning an identifier to a participant associated with at least one of the social communications. The method further includes analyzing content of the at least one social communication and generating an augmented reality (AR) based representation of the content for presentation on an augmented reality device associated with the user, the augmented reality device presenting the content for visualization replacing PPE based at least in-part on the identifier.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Yuan Yuan Ding, Zhong Fang Yuan, Tong Liu, Si Tong Zhao, Yi Chen Zhong, Ziqiumin Wang
  • Patent number: 11942530
    Abstract: The present disclosure relates to a semiconductor device having a backside source/drain contact, and method for forming the device. The semiconductor device includes a source/drain feature having a top surface and a bottom surface, a first silicide layer formed in contact with the top surface of the source/drain feature, a first conductive feature formed on the first silicide layer, and a second conductive feature having a body portion and a first sidewall portion extending from the body portion, wherein the body portion is below the bottom surface of the source/drain feature, and the first sidewall portion is in contact with the first conductive feature.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Yuan Chen, Pei-Yu Wang, Huan-Chieh Su, Chih-Hao Wang
  • Patent number: 11942906
    Abstract: The present invention provides a transmitter including a mixer, a harmonic impedance adjustment circuit and an amplifier. The mixer is configured to mix a first baseband signal with a first oscillation signal to generate a first mixed signal to a first node, and to mix a second baseband signal with a second oscillation signal to generate a second mixed signal to a second node. The harmonic impedance adjustment circuit is coupled between the first node and the second node, and is configured to reduce harmonic components of the first mixed signal and the second mixed signal to generate an adjusted first mixed signal and an adjusted second mixed signal. The amplifier is coupled to the harmonic impedance adjustment circuit, and is configured to generate an amplified signal according to the adjusted first mixed signal and the adjusted second mixed signal.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: March 26, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Ting-Yao Huang, Teng-Yuan Chang, Po-Chih Wang, Ka-Un Chan
  • Patent number: 11940528
    Abstract: Disclosed are a method and system for evaluating sonar self-noise at a ship design stage. The method includes: building a ship structure full-scale geometric simulation model; acquiring loss factors and sonar transducer space outfitting acoustic absorption coefficient material parameters; acquiring mechanical excitation, hydrodynamic excitation, and propeller excitation; inputting the loss factors and the sonar transducer space outfitting acoustic absorption coefficient material parameters into an established statistical energy evaluation model, and applying a mechanical excitation to a face plate of foundation of the built ship structure full-scale geometric simulation model, applying a hydrodynamic excitation to the surface of a ship hull, and applying a propeller excitation to a stern shaft to perform calculation of sonar self-noise of a ship to obtain total spectral density level of the sonar self-noise; and evaluating spectral density level calculation results by index requirements.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: March 26, 2024
    Assignee: HARBIN ENGINEERING UNIVERSITY
    Inventors: Haichao Li, Jiawei Xu, Fuzhen Pang, Cong Gao, Yuhang Tang, Jiajun Zheng, Xueren Wang, Zhe Zhao, Xuhong Miao, Yuan Du
  • Patent number: 11939280
    Abstract: A method for preparing isophorone diisocyanate by (1) reacting isophorone with hydrogen cyanide in the presence of a catalyst to obtain isophorone nitrile; (2) reacting the isophorone nitrile obtained in step (1) with ammonia gas and hydrogen in the presence of a catalyst to obtain isophorone diamine; and (3) subjecting the isophorone diamine to a phosgenation reaction to obtain the isophorone diisocyanate, wherein the content of impurities containing a secondary amine group in the isophorone diamine that undergoes the phosgenation reaction in step (3) is ?0.5 wt. The method reduces the content of hydrolyzed chlorine in the isophorone diisocyanate product, improves the yellowing resistance of the product, and the harm due to presence of hydrolyzed chlorine in the product is reduced.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: March 26, 2024
    Assignee: WANHUA CHEMICAL GROUP CO., LTD.
    Inventors: Yong Yu, Yonghua Shang, Lei Zhao, Wenbin Li, Ye Sun, Wei He, Xuelei Cui, Jingxu Wang, Degang Liu, Yuan Li
  • Patent number: 11941329
    Abstract: A method for analyzing fuselage profile based on measurement data of an aircraft, including: acquiring point-cloud data of an aircraft via a laser scanner; selecting point-cloud data of a fuselage component from the point-cloud data of the aircraft; based on a weighted locally optimal projection (WLOP) operator and Ll median curve-skeleton concept of point cloud, extracting a medial axis from the point-cloud data of the fuselage component; uniformly sampling the medial axis into a plurality of skeleton points; extracting a discrete point set of a cross-section contour of the fuselage component; performing circle fitting on the discrete point set to obtain a fitted circle and parameters thereof; calculating a deformation displacement measurement indicator ? of the cross-section of the fuselage component to evaluate cross-section contour of the fuselage.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: March 26, 2024
    Assignee: Nanjing University of Aeronautics and Astronautics
    Inventors: Jun Wang, Tianchi Zhong, Zhongde Shan, Yuan Zhang, Kun Xiao
  • Patent number: 11940367
    Abstract: A device for simulating carbon dioxide storage in a deep saline aquifer, including a CO2 gas source, first and second valves, first and second pressure pumps, first, second and third pressure gauges, a water storage tank, a simulation box, a first flow meter, a gas-liquid separator, a recycling tank, a microcomputer-display assembly, a structure plate, core holders, an injection pipeline, a connection pipeline, a baffle, a piezometer, a second flow meter, a heater, a lifter and an acoustic logging tool. The CO2 gas source, the first valve, the first pressure pump and the first pressure gauge for gas injection. The water storage tank, a second pressure pump and a second pressure gauge for water injection. The second valve, the third pressure gauge, the first flow meter, the gas-liquid separator and the recycling tank form an output pipeline.
    Type: Grant
    Filed: November 3, 2023
    Date of Patent: March 26, 2024
    Assignee: Southwest Petroleum University
    Inventors: Ping Yue, Hongnan Yang, Yuan Lei, Xu Zheng, Peng Song, Pengyu Chen, Zhouhua Wang, Simin Qu
  • Publication number: 20240096833
    Abstract: A semiconductor structure and a method for manufacturing the same are disclosed. The semiconductor structure includes a substrate, a chip stack disposed on the substrate through a plurality of first conductive structures. Each of the plurality of the first conductive structures includes a first conductive bump, and the first conductive bump includes at least one concave surface. Concave surfaces of adjacent first conductive bumps are disposed facing each other.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 21, 2024
    Inventors: Yuan FANG, Yanwu WANG
  • Publication number: 20240093142
    Abstract: The present invention relates to the fields of microorgan-isms, feed, food and ecological restoration, in particular to a strain for degrading deoxynivalenol (DON) and the use thereof. The strain has the deposit number CCTCC No. M 2020565. The strain can grow by means of taking the toxic compound DON as a sole carbon source, and convert the DON into chemical components for itself. The reaction process is irreversible, the reaction conditions are moderate, and secondary pollu-tion cannot be caused. The strain provided in the present invention can be used for preparing a biological detoxification preparation for DON. The strain provided in the present invention can be used for degrading DON in feed and food raw materials, primary processing products, deep processing products and related processing byproducts. The strain provided in the present invention can be applied to various ecosystems such as soil or bodies of water polluted by DON to achieve the purposes of DON degradation and ecological restoration.
    Type: Application
    Filed: November 11, 2021
    Publication date: March 21, 2024
    Inventors: Huiying LUO, Honghai ZHANG, Bin YAO, Huoqing HUANG, Yaru WANG, Yingguo BAI, Xiaoyun SU, Yuan WANG, Tao TU, Jie ZHANG, Huimin YU, Xing QIN, Xiaolu WANG
  • Publication number: 20240096853
    Abstract: A semiconductor structure includes a plurality of dies. The plurality of dies are stacked sequentially along a first direction. The first direction is a direction perpendicular to a plane of the dies. Each of the dies includes a base and n first conductive structures penetrating the base along the first direction, where n is greater than or equal to 2. In at least one group of the corresponding first conductive structures in the dies, projections of the group of the first conductive structures in two adjacent layers of the dies along the first direction are not overlapped with each other.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Yuan FANG, Yanwu WANG
  • Publication number: 20240096701
    Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.
    Type: Application
    Filed: May 17, 2023
    Publication date: March 21, 2024
    Inventors: Chun-Yuan CHEN, Huan-Chieh SU, Ching-Wei TSAI, Shang-Wen CHANG, Yi-Hsun CHIU, Chih-Hao WANG
  • Publication number: 20240099111
    Abstract: There is provided a display substrate, including: a base; light-emitting units on a side of the base; a flat light-shielding functional layer, including a black matrix and a first planarization layer, on a side of the light-emitting units away from the base, light outgoing openings being provided in the black matrix and being in one-to-one correspondence with the light-emitting units, and the first planarization layer at least filling the light outgoing openings; and a color filter layer, including color filter patterns in one-to-one correspondence with the light outgoing openings, on a side of the flat light-shielding functional layer away from the base, an orthographic projection of each color filter pattern on the base covering an orthographic projection of the light outgoing opening corresponding to the color filter pattern on the base. A method for manufacturing a display substrate, a display panel and a display apparatus are further provided.
    Type: Application
    Filed: July 1, 2022
    Publication date: March 21, 2024
    Inventors: Peng HOU, Yuan HE, Huaisen REN, Zhiliang SHAO, Pei LIU, Xiaoyi WANG, Chao YE, Yi PENG
  • Publication number: 20240096754
    Abstract: A semiconductor structure includes a base, a chip stack located on the base, and first conductive structures. The chip stack includes chips stacked in sequence in a direction perpendicular to a plane of the base, a chip includes first and second sub-portions, a first surface of the first sub-portion is flush with that of the second sub-portion, a second surface of the first sub-portion protrudes from that of the second sub-portion, and the first and second surfaces are oppositely arranged. A first conductive structure includes a first conductive bump and a first through-silicon via, the first conductive bump is located between first sub-portions of two adjacent chips, the first through-silicon via penetrates through the first sub-portion in the direction perpendicular to the plane of the base and is connected to the first conductive bump, and the materials of the first conductive bump and the first through-silicon via are same.
    Type: Application
    Filed: August 8, 2023
    Publication date: March 21, 2024
    Inventors: Yuan FANG, Yanwu WANG
  • Publication number: 20240096996
    Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Huan-Chieh Su, Chun-Yuan Chen, Li-Zhen Yu, Lo-Heng Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240095563
    Abstract: The present disclosure provides a quantum convolution operator, comprising: a quantum state encoding module, a quantum entanglement module, a quantum convolution kernel module, a measuring module, and a computing module; the quantum state encoding module is configured to encode a current group of input data onto qubits; the quantum entanglement module is configured to associate quantum state information of different qubits; the quantum convolution kernel module is configured to extract feature information corresponding to the quantum state information; the measuring module is configured to measure a quantum state of a preset qubit and obtain a corresponding amplitude; the computing module is configured to compute a convolution result corresponding to the current group of input data according to the measured quantum state and its amplitude.
    Type: Application
    Filed: February 23, 2022
    Publication date: March 21, 2024
    Applicant: ORIGIN QUANTUM COMPUTING TECHNOLOGY (HEFEI) CO., LTD.
    Inventors: Menghan Dou, Yuan Fang, Zhaohui Zhou, Hanchao Wang, Lei Li
  • Patent number: 11931363
    Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 19, 2024
    Assignee: NOVARTIS AG
    Inventors: Ho Man Chan, Xiang-Ju Justin Gu, Ying Huang, Ling Li, Yuan Mi, Wei Qi, Martin Sendzik, Yongfeng Sun, Long Wang, Zhengtian Yu, Hailong Zhang, Ji Yue (Jeff) Zhang, Man Zhang, Qiong Zhang, Kehao Zhao
  • Patent number: 11935102
    Abstract: The described implementations enable a seller to sell items through multiple e-commerce channels without having to maintain independent merchant accounts at each channel. For example, a seller may sell items directly and through a management service. When a user request to purchase an item from the seller through the management service is received, the management service sends the purchase information to the seller so that the seller can complete the purchase as if the purchase were being made directly with the seller. Upon completion of the purchase, the seller provides a confirmation back to the management service and provides the item directly to the user.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 19, 2024
    Assignee: Pinterest, Inc.
    Inventors: Chao Wang, Michael Yamartino, Sridatta Kaustubh Thatipamala, Yuan Wei
  • Patent number: 11932027
    Abstract: A media processing device includes: a housing; a cover rotatable between open and closed positions; a main logic board (MLB) supporting a controller, and having a slot extending into the MLB from an open end at a perimeter of the MLB, the slot traversing the MLB from an upper surface to a lower surface; a receiver affixed to the MLB on a first side of the slot, and an emitter affixed to the MLB on a second side of the slot, to emit radiation detectable by the receiver; and a tab movably coupled to the housing, to obstruct the slot and prevent detection of the radiation by the receiver when the cover is in a first one of the open and closed positions, and to clear the slot and permit detection of the radiation by the receiver when the cover is in the other of the open and closed positions.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: March 19, 2024
    Assignee: Zebra Technologies Corporation
    Inventors: Huanhua Liao, Yunbo Yuan, Zhong Gui Wang
  • Publication number: 20240087579
    Abstract: This application discloses a three-dimensional audio signal coding method and apparatus, and an encoder, and relates to the multimedia field. The method includes: After determining a first quantity of virtual speakers and a first quantity of vote values based on a current frame of a three-dimensional audio signal, a candidate virtual speaker set, and a voting round quantity, the encoder selects a second quantity of representative virtual speakers for the current frame from the first quantity of virtual speakers based on the first quantity of vote values, and further encodes the current frame based on the second quantity of representative virtual speakers for the current frame to obtain a bitstream. This achieves efficient data compression.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU