Patents by Inventor Yuan Wang

Yuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096853
    Abstract: A semiconductor structure includes a plurality of dies. The plurality of dies are stacked sequentially along a first direction. The first direction is a direction perpendicular to a plane of the dies. Each of the dies includes a base and n first conductive structures penetrating the base along the first direction, where n is greater than or equal to 2. In at least one group of the corresponding first conductive structures in the dies, projections of the group of the first conductive structures in two adjacent layers of the dies along the first direction are not overlapped with each other.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Yuan FANG, Yanwu WANG
  • Publication number: 20240096996
    Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Huan-Chieh Su, Chun-Yuan Chen, Li-Zhen Yu, Lo-Heng Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240099111
    Abstract: There is provided a display substrate, including: a base; light-emitting units on a side of the base; a flat light-shielding functional layer, including a black matrix and a first planarization layer, on a side of the light-emitting units away from the base, light outgoing openings being provided in the black matrix and being in one-to-one correspondence with the light-emitting units, and the first planarization layer at least filling the light outgoing openings; and a color filter layer, including color filter patterns in one-to-one correspondence with the light outgoing openings, on a side of the flat light-shielding functional layer away from the base, an orthographic projection of each color filter pattern on the base covering an orthographic projection of the light outgoing opening corresponding to the color filter pattern on the base. A method for manufacturing a display substrate, a display panel and a display apparatus are further provided.
    Type: Application
    Filed: July 1, 2022
    Publication date: March 21, 2024
    Inventors: Peng HOU, Yuan HE, Huaisen REN, Zhiliang SHAO, Pei LIU, Xiaoyi WANG, Chao YE, Yi PENG
  • Publication number: 20240096754
    Abstract: A semiconductor structure includes a base, a chip stack located on the base, and first conductive structures. The chip stack includes chips stacked in sequence in a direction perpendicular to a plane of the base, a chip includes first and second sub-portions, a first surface of the first sub-portion is flush with that of the second sub-portion, a second surface of the first sub-portion protrudes from that of the second sub-portion, and the first and second surfaces are oppositely arranged. A first conductive structure includes a first conductive bump and a first through-silicon via, the first conductive bump is located between first sub-portions of two adjacent chips, the first through-silicon via penetrates through the first sub-portion in the direction perpendicular to the plane of the base and is connected to the first conductive bump, and the materials of the first conductive bump and the first through-silicon via are same.
    Type: Application
    Filed: August 8, 2023
    Publication date: March 21, 2024
    Inventors: Yuan FANG, Yanwu WANG
  • Patent number: 11932027
    Abstract: A media processing device includes: a housing; a cover rotatable between open and closed positions; a main logic board (MLB) supporting a controller, and having a slot extending into the MLB from an open end at a perimeter of the MLB, the slot traversing the MLB from an upper surface to a lower surface; a receiver affixed to the MLB on a first side of the slot, and an emitter affixed to the MLB on a second side of the slot, to emit radiation detectable by the receiver; and a tab movably coupled to the housing, to obstruct the slot and prevent detection of the radiation by the receiver when the cover is in a first one of the open and closed positions, and to clear the slot and permit detection of the radiation by the receiver when the cover is in the other of the open and closed positions.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: March 19, 2024
    Assignee: Zebra Technologies Corporation
    Inventors: Huanhua Liao, Yunbo Yuan, Zhong Gui Wang
  • Patent number: 11935102
    Abstract: The described implementations enable a seller to sell items through multiple e-commerce channels without having to maintain independent merchant accounts at each channel. For example, a seller may sell items directly and through a management service. When a user request to purchase an item from the seller through the management service is received, the management service sends the purchase information to the seller so that the seller can complete the purchase as if the purchase were being made directly with the seller. Upon completion of the purchase, the seller provides a confirmation back to the management service and provides the item directly to the user.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 19, 2024
    Assignee: Pinterest, Inc.
    Inventors: Chao Wang, Michael Yamartino, Sridatta Kaustubh Thatipamala, Yuan Wei
  • Patent number: 11931363
    Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 19, 2024
    Assignee: NOVARTIS AG
    Inventors: Ho Man Chan, Xiang-Ju Justin Gu, Ying Huang, Ling Li, Yuan Mi, Wei Qi, Martin Sendzik, Yongfeng Sun, Long Wang, Zhengtian Yu, Hailong Zhang, Ji Yue (Jeff) Zhang, Man Zhang, Qiong Zhang, Kehao Zhao
  • Publication number: 20240087579
    Abstract: This application discloses a three-dimensional audio signal coding method and apparatus, and an encoder, and relates to the multimedia field. The method includes: After determining a first quantity of virtual speakers and a first quantity of vote values based on a current frame of a three-dimensional audio signal, a candidate virtual speaker set, and a voting round quantity, the encoder selects a second quantity of representative virtual speakers for the current frame from the first quantity of virtual speakers based on the first quantity of vote values, and further encodes the current frame based on the second quantity of representative virtual speakers for the current frame to obtain a bitstream. This achieves efficient data compression.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Publication number: 20240087580
    Abstract: This application discloses a three-dimensional audio signal coding method. After obtaining a fourth quantity of coefficients for a current frame of a three-dimensional audio signal and frequency domain feature values of the fourth quantity of coefficients, an encoder selects a third quantity of representative coefficients from the fourth quantity of coefficients based on the frequency domain feature values of the fourth quantity of coefficients, and selects a second quantity of representative virtual speakers for the current frame from a candidate virtual speaker set based on the third quantity of representative coefficients, and then encodes the current frame based on the second quantity of representative virtual speakers for the current frame to obtain a bitstream. The encoder selects the representative virtual speakers from the candidate virtual speaker set by using a small quantity of representative coefficients to represent all coefficients.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG
  • Publication number: 20240090150
    Abstract: Provided are a support plate, a display screen, and an electronic device. The support plate includes a first board and a second board. The first board and the second board are arranged back to back, and the first board is configured to be attached to a display panel. The support plate includes a bending area, and the support plate is configured to bend in the bending area along a preset axial line L. First strip-shaped slots are formed on the first board, and second strip-shaped slots distributed in an array at intervals along the axial line L are formed on the second board. The first strip-shaped slots are continuously provided along the axial line L and extend through the first board to form a unified edge structure.
    Type: Application
    Filed: May 11, 2022
    Publication date: March 14, 2024
    Inventors: Yuan Xiong, Zhize Wang, Yujun Zhang, Ning Guo
  • Publication number: 20240088228
    Abstract: A device includes a substrate, a chalcogenide channel layer, a chalcogenide barrier layer, source/drain contacts, and a gate electrode. The chalcogenide channel layer is over the substrate. The chalcogenide barrier layer is over the chalcogenide channel layer. A dopant concentration of the chalcogenide barrier layer is greater than a dopant concentration of the chalcogenide channel layer. The source/drain contacts are over the chalcogenide channel layer. The gate electrode is over the substrate.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Yun-Yuan WANG, Chih-Hsiang HSIAO, I-Chih NI, Chih-I WU
  • Publication number: 20240082160
    Abstract: An amlodipine dry suspension, comprising a diluent, a suspending aid, etc. and being free of surfactants. A preparation method therefor comprises the following steps: a) preparing an aqueous mixture 1 containing amlodipine besylate by using a high-speed homogenization method; b) adding sodium benzoate to the mixture 1, and homogenizing same at a high speed to obtain a mixture 2; and c) granulating the mixture 2 and other components, and then drying same. The raw materials are homogenized and mixed at a high speed, no surfactant is added during the preparation, amlodipine is fully wetted by using a high-speed homogenization process, prescription components are simplified, and the amlodipine dry suspension is more suitable for children to use. Compared with ultrasonic stirring, scaled-up and industrial production are easier to realize for the high-speed homogenization process, and at the same time, the preparation is good in stability and convenient to carry.
    Type: Application
    Filed: December 31, 2021
    Publication date: March 14, 2024
    Inventors: Hanxiong Li, Xianzhu Wang, Weitang Chen, Yuan Chen, Ping Guo, Yongyi Wu, Yongmei Qin, Hongxue Huang, Li Wang
  • Publication number: 20240087578
    Abstract: A three-dimensional audio signal coding method, apparatus, and encoder are described. The method includes, after obtaining a first correlation between a current frame of a three-dimensional audio signal and a representative virtual speaker set for a previous frame, the encoder determines whether the first correlation satisfies a reuse condition, where the first correlation is used to determine whether to reuse the representative virtual speaker set for the previous frame when the current frame is encoded. The method further encodes the current frame based on the representative virtual speaker set for the previous frame when the first correlation satisfies the reuse condition, to obtain a bitstream. A virtual speaker in the representative virtual speaker set for the previous frame is a virtual speaker used for encoding the previous frame of the three-dimensional audio signal.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Patent number: 11929434
    Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: March 12, 2024
    Assignee: eMemory Technology Inc.
    Inventors: Chih-Hsin Chen, Shih-Chen Wang, Tsung-Mu Lai, Wen-Hao Ching, Chun-Yuan Lo, Wei-Chen Chang
  • Patent number: 11928503
    Abstract: Embodiments are directed to deploying a workload on the best/highest performance node. Nodes configured to accommodate a request for a workload are selected. Information is collected on each of the selected nodes and the workload. Predicted response times expected for the workload running on each of the selected nodes are determined. The workload is deployed on a node of the selected nodes, the node having a corresponding predicted response time for the workload, the workload being deployed on the node based at least in part on the corresponding predicted response time.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Qi Feng Huo, Yuan Yuan Wang, Da Li Liu, Lei Li, Yan Song Liu
  • Patent number: 11925472
    Abstract: The present disclosure describes a fast-scanning optical-resolution photoacoustic (fsOR-PAE) endoscope for imaging vasculature within tissues in vivo that includes an ultrasonic transducer and a scanning mirror within a lumen of an elongate casing. The scanning mirror is configured to direct the laser pulses from the pulsed laser source to a focal spot outside the casing in a scanning pattern via an imaging window formed in the casing. The scanning mirror is further configured to direct a plurality of photoacoustic signals from the focal spot to the ultrasonic transducer via the imaging window.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 12, 2024
    Assignees: Washington University, California Institute of Technology
    Inventors: Lihong Wang, Konstantin Maslov, Methodius Tuuli, Molly Stout, George Macones, Chiye Li, Junhui Shi, Yuan Qu
  • Publication number: 20240077608
    Abstract: Disclosed are a method and system for evaluating sonar self-noise at a ship design stage. The method includes: building a ship structure full-scale geometric simulation model; acquiring loss factors and sonar transducer space outfitting acoustic absorption coefficient material parameters; acquiring mechanical excitation, hydrodynamic excitation, and propeller excitation; inputting the loss factors and the sonar transducer space outfitting acoustic absorption coefficient material parameters into an established statistical energy evaluation model, and applying a mechanical excitation to a face plate of foundation of the built ship structure full-scale geometric simulation model, applying a hydrodynamic excitation to the surface of a ship hull, and applying a propeller excitation to a stern shaft to perform calculation of sonar self-noise of a ship to obtain total spectral density level of the sonar self-noise; and evaluating spectral density level calculation results by index requirements.
    Type: Application
    Filed: October 24, 2023
    Publication date: March 7, 2024
    Inventors: Haichao LI, Jiawei XU, Fuzhen PANG, Cong GAO, Yuhang TANG, Jiajun ZHENG, Xueren WANG, Zhe ZHAO, Xuhong MIAO, Yuan DU
  • Publication number: 20240079779
    Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Yuan Tao, Yiren Wang, Ana Papio Toda, Jingni Zhong, Han Wang, Hao Xu, Hongfei Hu, Mattia Pascolini, Eric W. Bates, Peter A. Dvorak, Allegra Shum
  • Publication number: 20240079778
    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Enrique Ayala Vazquez, Ming-Ju Tsai, Yiren Wang, Yuan Tao, Hao Xu, Sidharath Jain, Haozhan Tian, Yuancheng Xu, Eric W. Bates, Peter A. Dvorak, Harlan S. Dannenberg, Rees S. Parker, Obinna O. Onyemepu, Victor C. Lee, Han Wang, Hongfei Hu
  • Publication number: 20240079784
    Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Victor C. Lee, Jingni Zhong, Ming Chen, Bhaskara R. Rupakula, Yiren Wang, Yuan Tao, Christopher Q. Ma, Zhiheng Zhou, Sherry Cao, Kevin M. Froese, Hao Xu, Hongfei Hu, Mattia Pascolini