Patents by Inventor Yuan Wen

Yuan Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11141103
    Abstract: A vital-sign detection system is provided. The vital-sign detection system includes a vital-sign detection device and a controller. The vital-sign detection device is enabled to detect a vital-sign of a user. The controller determines whether the gets in the bed and controls the vital-sign detection device to switch to a disabled mode from a first enabled mode in response to the user getting in the bed. During a period when the vital-sign detection device is in the disabled mode, the controller determines whether the user falls asleep. In response to the user falling asleep, the controller controls the vital-sign detection device to switch to a second enabled mode from the disabled mode.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: October 12, 2021
    Assignee: MEDIATEK INC.
    Inventors: Yuan-Wen Ting, Tsan-Jieh Chen
  • Publication number: 20210119064
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Publication number: 20210022669
    Abstract: A vital-sign detection system is provided. The vital-sign detection system includes a vital-sign detection device and a controller. The vital-sign detection device is enabled to detect a vital-sign of a user. The controller determines whether the gets in the bed and controls the vital-sign detection device to switch to a disabled mode from a first enabled mode in response to the user getting in the bed. During a period when the vital-sign detection device is in the disabled mode, the controller determines whether the user falls asleep. In response to the user falling asleep, the controller controls the vital-sign detection device to switch to a second enabled mode from the disabled mode.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 28, 2021
    Inventors: Yuan-Wen TING, Tsan-Jieh CHEN
  • Patent number: 10886834
    Abstract: A power converter and a method for receiving an input voltage and providing an output voltage is presented. The power converter has a switching circuit to generate the output voltage. The switching circuit has a first switch, a switch control circuit arranged to selectively operate the first switch in a first state or a second state. There is a ripple reduction circuit to set a first state duration based on a property of a load current. The load current is a current that the power converter provides to a load that is coupled to the output voltage.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: January 5, 2021
    Assignee: Dialog Semiconductor (UK) Limited
    Inventors: Der Ju Hung, Yu Ta Lin, Yuan Wen Hsiao, Chi-Chia Huang, Chia Wen Tsai
  • Patent number: 10879406
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Publication number: 20200343289
    Abstract: An image sensor device is provided. The image sensor device includes a semiconductor substrate having a first side, a second side opposite to the first side, and at least one light-sensing region close to the first side. The image sensor device includes a dielectric feature covering the second side and extending into the semiconductor substrate. The dielectric feature in the semiconductor substrate surrounds the light-sensing region. The image sensor device includes a reflective layer in the dielectric feature in the semiconductor substrate, wherein a top portion of the reflective layer protrudes away from the second side, and a top surface of the reflective layer and a top surface of the insulating layer are substantially coplanar.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh FANG, Ming-Chi WU, Ji-Heng JIANG, Chi-Yuan WEN, Chien-Nan TU, Yu-Lung YEH, Shih-Shiung CHEN, Kun-Yu LIN
  • Patent number: 10784150
    Abstract: A semiconductor structure includes a semiconductive substrate including a first surface and a second surface opposite to the first surface, a shallow trench isolation (STI) including a first portion at least partially disposed within the semiconductive substrate and tapered from the first surface towards the second surface, and a second portion disposed inside the semiconductive substrate, coupled with the first portion and extended from the first portion towards the second surface, and a void enclosed by the STI, wherein the void is at least partially disposed within the second portion of the STI.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ching-Chung Su, Jiech-Fun Lu, Jian Wu, Che-Hsiang Hsueh, Ming-Chi Wu, Chi-Yuan Wen, Chun-Chieh Fang, Yu-Lung Yeh
  • Patent number: 10771735
    Abstract: A data cable, electronic system and method for transmitting MIPI signals are provided. The electronic system includes a first electronic device configured to generate at least one pair of MIPI (Mobile Industry Processor Interface) differential signals, and a data cable and a second electronic device connected to the first electronic device via the data cable. The data cable is configured to receive the at least one pair of MIPI differential signals from the first electronic device, and perform impedance matching and shielded grounding processing on the at least one pair of MIPI differential signals, and transmit the processed at least one pair of MIPI differential signals to the second electronic device.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: September 8, 2020
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Yuan Wen, Jian Xiong
  • Patent number: 10749639
    Abstract: A wireless transmit receive unit (WTRU) is configured in dual connectivity with a master cell group and a secondary cell group. Uplink (UL) data is sent in an active one of the master cell group and the secondary cell group as an active UL transmission cell group. It is determined whether a UL transmission is to be switched to an alternate one of the master cell group and the secondary cell group and the UL traffic is switched from the active UL transmission cell group to the alternate cell group in response to the determination that the UL transmission is to be switched.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: August 18, 2020
    Assignee: MEDIATEK INC.
    Inventors: Yu-Syuan Jheng, Yuanyuan Zhang, Yuan-Wen Ting, Pei-Shan Kao
  • Patent number: 10734427
    Abstract: A method for forming an image sensor device is provided. The method includes providing a semiconductor substrate including a front surface, a back surface opposite to the front surface, at least one light-sensing region close to the front surface, and a first trench surrounding the light-sensing region. The method includes forming an insulating layer over the back surface and in the first trench. A void is formed in the insulating layer in the first trench, and the void is closed. The method includes removing the insulating layer over the void to open up the void. The opened void forms a second trench partially in the first trench. The method includes filling a reflective structure in the second trench. The reflective structure has a light reflectivity ranging from about 70% to about 100%.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: August 4, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Fang, Ming-Chi Wu, Ji-Heng Jiang, Chi-Yuan Wen, Chien-Nan Tu, Yu-Lung Yeh, Shih-Shiung Chen, Kun-Yu Lin
  • Patent number: 10727749
    Abstract: A dual rail power supply system and a method for providing a first voltage and a second voltage to a load are presented. The power supply system draws a load current from the dual rail power supply system. The system has a first voltage rail for coupling to a first terminal of the load, a second voltage rail for coupling to a second terminal of the load, a first power converter to provide the first voltage at the first voltage rail, a second power converter to provide the second voltage at the second voltage rail, a third power converter comprising a first output coupled to the first voltage rail and a second output coupled to the second voltage rail. The third power converter generates a slave current and provides the slave current to the load such that the load current comprises the slave current, during a first mode.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: July 28, 2020
    Assignee: Dialog Semiconductor (UK) Limited
    Inventors: Cheng-Teng Chen, Ruei-Hong Peng, Yuan Wen Hsiao, Alan Somerville
  • Publication number: 20200220670
    Abstract: Blockage detection in a wireless transmit receive unit includes performing a radio link measurement on one or more reference signals. The radio link measurement is compared to a comparing threshold and a blockage condition is indicated in response to the comparing of the radio link measurement meeting a threshold criterion on the comparing threshold.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 9, 2020
    Applicant: MEDIATEK INC.
    Inventors: Yu-Syuan Jheng, Yuanyuan Zhang, Yuan-Wen Ting, Pei-Shan Kao
  • Patent number: 10707361
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: July 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Patent number: 10686377
    Abstract: There is presented a boost converter and an associated method for starting the boost converter. The boost converter includes an input terminal for receiving an input voltage, an output terminal for providing an output voltage, a low-side power switch and a high-side power switch coupled at a switching node, and a voltage regulator coupled to the high-side power switch. The boost converter is also provided with a controller for operating the boost converter in a start-up phase. In the start-up phase the controller controls the boost converter to generate an intermediate voltage and increase the intermediate voltage to a predetermined value. The intermediate voltage is then provided to the voltage regulator to obtain a drive voltage. The high side power switch is then driven to increase the output voltage linearly up to a start-up voltage.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: June 16, 2020
    Assignee: Dialog Semiconductor (UK) Limited
    Inventors: Edward Lu, Stella Su, Yuan Wen Hsiao, Der-Ju Hung
  • Patent number: 10623149
    Abstract: Blockage detection in a wireless transmit receive unit includes performing a radio link measurement on one or more reference signals. The radio link measurement is compared to a comparing threshold and a blockage condition is indicated in response to the comparing of the radio link measurement meeting a threshold criterion on the comparing threshold.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: April 14, 2020
    Assignee: MEDIATEK INC.
    Inventors: Yu-Syuan Jheng, Yuanyuan Zhang, Yuan-Wen Ting, Pei-Shan Kao
  • Publication number: 20200111923
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 9, 2020
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Patent number: 10553733
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: February 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Publication number: 20200020816
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Publication number: 20190252241
    Abstract: A semiconductor structure includes a semiconductive substrate including a first surface and a second surface opposite to the first surface, a shallow trench isolation (STI) including a first portion at least partially disposed within the semiconductive substrate and tapered from the first surface towards the second surface, and a second portion disposed inside the semiconductive substrate, coupled with the first portion and extended from the first portion towards the second surface, and a void enclosed by the STI, wherein the void is at least partially disposed within the second portion of the STI.
    Type: Application
    Filed: April 25, 2019
    Publication date: August 15, 2019
    Inventors: Ching-Chung SU, Jiech-Fun LU, Jian WU, Che-Hsiang HSUEH, Ming-Chi WU, Chi-Yuan WEN, Chun-Chieh FANG, Yu-Lung YEH
  • Patent number: 10333403
    Abstract: Adaptive-on-time techniques to improve the frequency variations inherent in constant-on-time COT converters are presented. A switching converter contains a power switch; a pulse generator adapted to generate a pulsed signal to switch the power switch on with a switching frequency; a ramp generator adapted to generate a ramp signal; and a controller adapted to detect a parameter of the ramp signal, compare the parameter with a reference value, and to generate a control signal based on the comparison to control the switching frequency. This allows controlling a switching frequency of the converter without increasing a noise level of the converter.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: June 25, 2019
    Assignee: Dialog Semiconductor (UK) Limited
    Inventors: Chi-Chia Huang, Yuan-Wen Hsiao