Abstract: A device for simulating carbon dioxide storage in a deep saline aquifer, including a CO2 gas source, first and second valves, first and second pressure pumps, first, second and third pressure gauges, a water storage tank, a simulation box, a first flow meter, a gas-liquid separator, a recycling tank, a microcomputer-display assembly, a structure plate, core holders, an injection pipeline, a connection pipeline, a baffle, a piezometer, a second flow meter, a heater, a lifter and an acoustic logging tool. The CO2 gas source, the first valve, the first pressure pump and the first pressure gauge for gas injection. The water storage tank, a second pressure pump and a second pressure gauge for water injection. The second valve, the third pressure gauge, the first flow meter, the gas-liquid separator and the recycling tank form an output pipeline.

Abstract: The disclosure provides an optical waveguide assembly. The optical waveguide assembly includes: optical waveguide plates, where there are a plurality of optical waveguide plates, the plurality of optical waveguide plates are provided in an overlaid manner, each optical waveguide plate is provided with an in-coupling structure, a turning structure, an out-coupling structure and a diffraction inhibition layer, the turning structure and the out-coupling structure on the same optical waveguide plate are located on two side surfaces of the optical waveguide plate respectively, projections of the turning structure and the out-coupling structure on the optical waveguide plate are at least partially overlapped, and the diffraction inhibition layer is located between the out-coupling structure and the optical waveguide plate. Each turning structure includes a plurality of cellular elements. The disclosure solves a problem of non-uniform display efficiency of an optical waveguide assembly in the related art.

Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Abstract: A handheld electronic device is provided. The handheld electronic device includes a screen, a back cover, a frame, a main board, and a heat conduction structure. The frame is arranged between the screen and the back cover. The frame and the back cover define a space. The main board is arranged in the space, and includes a front surface and a back surface. The front surface faces the screen and includes a heat source. The heat conduction structure extends from the front surface to the back surface, and includes a first end and a second end opposite to each other. The first end is arranged at the heat source, and the second end extends to the back cover.

Abstract: A wall-mounted air conditioner includes a housing and a heat exchanger. A front surface of the housing is provided with a first air inlet; the heat exchanger is arranged in the housing and opposite the first air inlet; and the heat exchanger is curved or bent towards the first air inlet.

Abstract: A wall-mounted air conditioner includes: a housing, a fan wheel, and a heat exchanger. A first air inlet is formed on the front of the housing, the fan wheel and the heat exchanger are disposed within the housing, at least a portion of the heat exchange is located between the first air inlet and the fan wheel, and the distance between either of upper and lower ends of the heat exchanger and the fan wheel is less than the distance between a middle portion of the heat exchanger and the fan wheel and.

Abstract: Disclosed is a combined LED grow lighting system, comprising an LED light track and at least one LED light strip which slidably connects with and longitudinally slides along the LED light track; wherein a remote control signal receiver to receive a remote control signal is configured within the LED light track, a processing device for processing the remote control signal received by the remote control signal receiver to generate a control signal for controlling a power of LED in each LED light strip is connected with each LED light strip, respectively; an LED constant current power supply and a constant current control circuit are configured within the LED light strip, and the constant current control circuit is connected with the processing device and receives the control signal regarding the power of the LED light strip sent from the processing device to control the LED constant current power supply.

Abstract: The disclosure provides a portable electronic device, including: a housing, a heat dissipation component, a bracket, a cover structure, and a plurality of pivotal linkage rods. The housing includes a heat dissipation opening. The heat dissipation component is disposed in the housing and corresponds to the heat dissipation opening. The bracket is disposed in the housing and encloses the heat dissipation component. The cover structure is configured to move between a close position covering the heat dissipation opening and an open position exposing the heat dissipation opening. Each of the plurality of pivotal linkage rods is pivotally connected between the bracket and the cover structure, and is configured to be driven to rotate, to drive the cover structure to move between the close position and the open position.

Abstract: A functional module is provided. The functional module is applied to an electronic device, and includes a housing, a functional member, and a motor assembly. Both the functional member and the motor assembly are disposed in the housing. The motor assembly includes a motor and an output shaft. The motor is configured to drive the output shaft to rotate. The output shaft protrudes from one side of the housing.

Abstract: A connector assembly includes a cage having at least one inserting passageway and a heat sink frame positioned above the inserting passageway, the heat sink module is assembled to the heat sink frame, the heat sink module includes a movable plate, a heat sink, a pressure-applying spring and a supporting spring; the movable plate has a pushed portion which enters into the inserting passageway, the pressure-applying spring is provided between the movable plate and the heat sink, the supporting spring upwardly and elastically supports the heat sink; the movable plate is capable of moving relative to the heat sink frame between a first position which is in the front and a second position which is in the rear, the heat sink is capable of moving relative to the heat sink frame between a release position which is in the up and a contact position which is in the down.

Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

Abstract: The present disclosure discloses a transceiver apparatus having self-calibration mechanism that includes a signal transmission path, a signal receiving path, a path switching circuit, a transceiver circuit and a self-calibration circuit. The path switching circuit includes a switch to switch a connection relation among an antenna, the signal transmission path and the signal receiving path. The transceiver circuit is coupled to the signal transmission path and the signal receiving path. The self-calibration circuit controls the transceiver circuit to transmit a transmission signal through the signal transmission path to the path switching circuit and receives a leakage signal generated according to the transmission signal through the signal receiving path, so as to perform a self-calibration process on the transceiver circuit based on the transmission signal and the leakage signal. The leakage signal has a leakage signal strength larger than a predetermined level.

Abstract: The present invention relates to a method for manufacturing a dispersion solution comprising nanoparticles of a rigid conjugated polymer having a dihedral angle from 0° to 20°, the method comprising the steps of: a) dissolving the rigid conjugated polymer in a first solvent system; b) combining the dissolved rigid conjugated polymer with a second solvent system thus obtaining a precipitate comprising the rigid conjugated polymer; c) collecting the precipitate comprising the rigid conjugated polymer; d) re-dispersing the precipitate in a third solvent system thus obtaining a dispersion solution comprising nanoparticles of the rigid conjugated polymer.

Abstract: An example connector assembly includes a guide shielding cage with a cage body and an upper heat sink bracket. The cage body includes upper window. A lower wall of the upper heat sink bracket is formed with a window corresponding to the upper window. The connector assembly also includes an upper heat sink module including a heat dissipating member. The heat dissipating member is capable of moving between a releasing position which is higher and an acting position which is lower relative to the upper insertion space. The cage body further includes fixing pieces positioned at two sides of the top wall and extend upwardly. The lower wall of the upper heat sink bracket engages with the fixing pieces of the cage body, and the upper heat sink bracket further comprises a latching piece which extends from the lower wall and latches into the top wall of the cage body.

Abstract: The present application provides a touch sensing circuit, which comprises a plurality of analog front-end circuits, a noise processing circuit, and a compensation circuit. The analog front-end circuits generate a plurality of output signals according to a plurality of sensing signals. The noise processing circuit is coupled to the analog front-end circuits and generates an average noise according to the output signals. The compensation circuit is coupled to the noise processing circuit and compensates the output signals according to the average noise. By applying the touch sensing circuit of the present application, the influence of common-mode noise may be suppressed and the sensitivity of sensing touches may be improved.

Abstract: Semiconductor devices, integrated circuits and methods of forming the same are provided. In one embodiment, a semiconductor device includes a metal-insulator-metal structure which includes a bottom conductor plate layer including a first opening and a second opening, a first dielectric layer over the bottom conductor plate layer, a middle conductor plate layer over the first dielectric layer and including a third opening, a first dummy plate disposed within the third opening, and a fourth opening, a second dielectric layer over the middle conductor plate layer, and a top conductor plate layer over the second dielectric layer and including a fifth opening, a second dummy plate disposed within the fifth opening, a sixth opening, and a third dummy plate disposed within the sixth opening. The first opening, the first dummy plate, and the second dummy plate are vertically aligned.

Abstract: Passive devices are provided. In an embodiment, a passive device includes a substrate comprising a first region and a second region, a first lower contact feature and a second lower contact feature in a dielectric layer and directly over the first region and the second region, respectively, a first vertical stack of conductive features disposed over the first region, a metal-insulator-metal (MIM) capacitor disposed over the second region and comprising a vertical stack of conductor plates, a first contact via extending through the first vertical stack of conductive features and electrically coupled to the first lower contact feature, and a second contact via extending through a portion of the vertical stack of conductor plates and electrically coupled to the second lower contact feature. A number of conductive features penetrated by the first contact via is different than a number of conductor plates penetrated by the second contact via.

Abstract: A device structure according to the present disclosure includes a passivation layer, a first conductor plate layer disposed on the passivation layer, a second conductor plate layer disposed over the first conductor layer, a third conductor plate layer disposed over the second conductor layer, and a fourth conductor plate layer disposed over the third conductor layer. The second conductor plate layer encloses the first conductor plate layer and the fourth conductor plate layer encloses the third conductor plate layer. The device structure, when used in a back-end-of-line passive device, reduces leakage and breakdown due to corner discharge effect.

Abstract: A method of manufacturing a semiconductor device includes forming a first conductive layer over a first insulating layer and forming a first dielectric layer over the first conductive layer. A second conductive layer is formed over a first portion of the first dielectric layer. A second dielectric layer is formed over the second conductive layer. A third conductive layer is formed over the second dielectric layer and the second portion of the first dielectric layer. A third dielectric layer is formed over the third conductive layer. A first conductive contact is formed contacting the first conductive layer. A second conductive contact is formed contacting the third conductive layer. The second conductive layer is an electrically floating layer.

Abstract: A voltage-controlled oscillator device includes first and second voltage-controlled oscillators, a first switch group including two first switches, and a second switch group including two second switches. The first voltage-controlled oscillator includes a first inductor group, a first negative resistance circuit and a first voltage output terminal group. The second voltage-controlled oscillator includes a second inductor group, a second negative resistance circuit and a second voltage output terminal group. For the first switch group, first control terminals are electrically connected to the first voltage output terminal group, first input terminals are electrically connected to the second voltage output terminal group, first output terminals are electrically connected.