Abstract: A medical apparatus and a method of manufacturing the medical apparatus, which have an advantage in cost performance, are provided even if optical fibers are used therein. The medical apparatus includes, therein, a first optical fiber 6322 configured to transmit an optical signal, a second optical fiber 651 configured to transmit an optical signal, and a first optical connector 66 configured to connect the first optical fiber 6322 and the second optical fiber 651.

Abstract: A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.

Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

Abstract: A method for processing a semiconductor wafer comprises: preparing a semiconductor wafer including a main body and a rim, the rim having a greater thickness than the main body and including a projection projecting; supporting the semiconductor wafer with a holding tape; preparing a base including a stage and an outer portion; setting the semiconductor wafer on the base so that the main body is supported by a support surface of the stage; and separating the main body and the rim by cutting an edge portion of the main body in a state in which the main body is supported by the stage. The setting the semiconductor wafer on the base includes setting the semiconductor wafer on the base so that the main body is supported by the stage in a state in which the projection is separated from a head surface of the outer portion of the base.

Abstract: An all-solid-state secondary battery including: a cathode including a cathode active material layer; an anode including an anode current collector, and an anode active material layer on the anode current collector, wherein the anode active material layer includes an anode active material which is alloyable with lithium or forms a compound with lithium; and a solid electrolyte layer between the cathode and the anode, wherein a ratio of an initial charge capacity (b) of the anode active material layer to an initial charge capacity (a) of the cathode active material layer satisfies a condition of Equation 1: 0.01<(b/a)<0.5, wherein a is the initial charge capacity of the cathode active material layer determined from a first open circuit voltage to a maximum charging voltage, and b is the initial charge capacity of the anode active material layer determined from a second open circuit voltage to 0.01 volts vs. Li/Li+.

Abstract: A natural gas liquefying apparatus includes: a precooling unit, which is a treatment unit configured to precool natural gas; a liquefying unit, which is a treatment unit configured to liquefy the natural gas; a refrigerant cooling unit, which is a treatment unit configured to cool a liquefying refrigerant; a compression unit configured to compress vaporized refrigerants; and a pipe rack including air-cooled coolers arrayed and arranged on an upper surface. The treatment units and the compression unit are separately arranged in a first arrangement region and a second arrangement region arranged opposed to each other across a long side of the pipe rack. The pipe rack interposed between the first and second arrangement regions has a region in which no air-cooled cooler is arranged in order to arrange a plurality of pipes, through which refrigerants are allowed to flow, in a direction of a short side of the pipe rack.

Abstract: A light emitting device includes: a base; a phosphor frame positioned inward of edges of a lower face of the base; a light emitting element disposed in an area surrounded by the phosphor frame; and a light transmissive member contacting at least a portion of the edges of the lower face of the base and at least a portion of outer lateral faces of the phosphor frame.

Abstract: An image processing device for an endoscope outputs a video signal to an image display part that displays an observation image based on the video signal. The image display part is configured such that a first side of a display screen that displays the observation image is shorter than a second side intersecting with the first side, and is configured to be set in both a first setting state in which the first side is along a vertical direction and a second setting state in which the second side is along the vertical direction. The image processing device includes: a setting state recognition part configured to recognize the setting state; and a video signal generation part configured to generate the video signal such that the subject image in the observation image has an orientation corresponding to the setting state of the image display part.

Abstract: A spark plug includes a tubular metallic shell, a tubular insulator held in the metallic shell and having an axial hole, a center electrode held at one end of the axial hole, a metallic terminal member held at the other end of the axial hole, and a resistor element disposed between the center electrode and the metallic terminal member in the axial hole and containing glass and an electrically conductive material. The resistor element has a first resistor layer disposed on the center electrode side and closest to the center electrode and containing titanium oxide, and a second resistor layer disposed on the metallic terminal member side in relation to the first resistor layer and whose titanium oxide content is lower than that of the first resistor layer. The titanium oxide content decreases from the center electrode side toward the metallic terminal member side.

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.

Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

Abstract: A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.

Abstract: A light emitting device includes: a base; a phosphor frame positioned inward of edges of a lower face of the base; a light emitting element disposed in an area surrounded by the phosphor frame; and a light transmissive member contacting at least a portion of the edges of the lower face of the base and at least a portion of outer lateral faces of the phosphor frame.

Abstract: A method of manufacturing a light emitting device includes: providing a first member comprising: a base, a plurality of phosphor frames positioned on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame that is adjacent to the first phosphor frame, and a light transmissive member, a portion of which is disposed between the first phosphor frame and the second phosphor frame; disposing a first light emitting element in the first phosphor frame and a second light emitting element in the second phosphor frame, wherein: each light emitting element has an emission face and an electrode forming face located opposite to the emission face, each light emitting element comprises an electrode located on its electrode forming face, and each light emitting element is disposed such that its emission face faces the base; and cutting the light transmissive member.

Abstract: A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

Abstract: A receptacle module for detachably connecting a connector of a distal end device coming into contact with or inserted into a subject includes: a receptacle substrate including a first surface on which a receptacle to which the connector is detachably connected is mounted, and a second surface on an opposite side of the first surface; a patient circuit unit conducted to the distal end device via the receptacle; and a conductive shielding member mounted on the second surface and configured to shield the patient circuit unit from the opposite side.

Abstract: A light-emitting device includes: a base member that includes conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

Abstract: An endoscopic device includes: an insertion portion configured to be inserted into a subject; an imaging unit configure to capture the subject image; a lens unit including a focus lens configured to adjust a focus by moving along an optical axis; a detection processor configured to perform detection processing of positioning a position of the focus lens at an in-focus position based on an image within the detection frame; a lens controller configured to position the focus lens at the in-focus position based on a processing result from the detection processor; a distal end detector configured to detect a distal end of a treatment tool in the captured image based on the captured image; and a detection frame setting unit configured to perform setting processing of setting a position of the detection frame in the captured image based on a position of the distal end of the treatment tool.