Abstract: An image reading apparatus includes a first stacking unit having a stacking surface, and an abutment portion that abuts a document stacked on the stacking surface, a feeding unit, a reading unit, a second stacking unit, a detection unit, a rotating shaft, a drive unit, and a control unit. The second stacking unit receives the document fed by the feeding unit and read by the reading unit. The detection unit detects presence or absence of the document stacked on the second stacking unit. The drive unit rotates the first stacking unit around the rotating shaft rotatably supporting the first stacking unit. Based on the detection of the absence of the document on the second stacking unit by the detection unit, the control unit controls the drive unit to rotate the first stacking unit in a direction with which the abutment portion is lowered.

Abstract: Provided is a digital switch including: a plurality of input-side memories, which are arranged in a one-to-one correspondence with a plurality of input ports, and are configured to accumulate time-division multiplexed data; a plurality of output-side memories, which are arranged in a one-to-one correspondence with a plurality of output ports, and are configured to accumulate time-division multiplexed data; and a switch matrix configured to receive, as input, the time-division multiplexed data read out in every cycle from each of the plurality of input-side memories, and execute routing for selecting, in accordance with a connection control signal received from outside, any one of the plurality of output-side memories such that the time-division multiplexed data read out in every cycle is output from each of the plurality of output ports without causing a difference in delay, to output the time-division multiplexed data.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

Abstract: Provided is a technology relating to an image forming apparatus configured to calculate a toner usage amount per day. The image forming apparatus stores the calculated toner usage amount per day in a list when a toner usage history is permitted to be stored, and avoids storing the calculated toner usage amount per day in the list when the usage history is inhibited from being stored. When the toner usage history is permitted to be stored, the image forming apparatus extracts a feature amount indicating a toner consumption tendency exhibited by a user based on the toner usage amount per day corresponding to a predetermined period stored in the list, and avoids extracting the feature amount when the toner usage history is inhibited from being stored.

Abstract: An information processing apparatus that is capable of improving estimating accuracy of a usable period of a fixing device. The information processing apparatus enables communication with an image forming apparatus to which one of fixing devices is selectively attachable. A controller obtains information about a type of a fixing device attached, determines a remaining period of a second fixing device based on second data about a consumption amount of the second fixing device in a case where a first fixing device of a first type is replaced with the second fixing device of a second type, and determines a remaining period of a third fixing device based on first data about a consumption amount of the first fixing device and third data about a consumption amount of the third fixing device in a case where the first fixing device is replaced with the third fixing device of the first type.

Abstract: An information processing apparatus that is capable of improving estimating accuracy of a usable period of a fixing device. The information processing apparatus enables communication with an image forming apparatus to which one of fixing devices is selectively attachable. A controller obtains information about a type of a fixing device attached, determines a remaining period of a second fixing device based on second data about a consumption amount of the second fixing device in a case where a first fixing device of a first type is replaced with the second fixing device of a second type, and determines a remaining period of a third fixing device based on first data about a consumption amount of the first fixing device and third data about a consumption amount of the third fixing device in a case where the first fixing device is replaced with the third fixing device of the first type.

Abstract: An information processing apparatus that is capable of reducing a delay of delivery of a consumable even if a history of a consumption amount of a consumable is erased. The information processing apparatus that enables communication with an image forming apparatus equipped with a replaceable consumable. The information processing apparatus includes a memory that stores data related to a consumption amount of the consumable, and a controller configured to determine a future change of a remaining amount of the consumable from the data stored in the memory, issue a delivery request that requests delivery of a replacement consumable according to the future change of the remaining amount of the consumable, and receive user instruction information. The controller issues the delivery request in a case where a predetermined condition related to the remaining amount is satisfied in a predetermined period from reception of the user instruction information.

Abstract: An information processing apparatus that is capable of reducing a delay of delivery of a consumable even if a history of a consumption amount of a consumable is erased. The information processing apparatus enables communication with an image forming apparatus that has a consumable. The information processing apparatus includes a memory that stores data related to a consumption amount of the consumable, a controller configured to determine a future change of a remaining amount of the consumable from the data stored in the memory based on a first determination condition, control a timing at which a delivery request that urges delivery of a replacement consumable is output based on the future change, and receive user instruction information. The controller determines the future change from the data stored in the memory based on a second determination condition that is different from the first determination condition after receiving the user instruction information.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: The present disclosure relates to a backside illumination type solid-state imaging device, a manufacturing method for a backside illumination type solid-state imaging device, an imaging apparatus, and electronic equipment by which the manufacturing cost can be reduced. A singulated memory circuit and a singulated logic circuit are laid out in a horizontal direction and are embedded by an oxide film and flattened, and then are stacked so as to be contained in a plane direction under a solid-state imaging element. The present disclosure can be applied to an imaging apparatus.

Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

Abstract: Provided is a technology relating to an image forming apparatus configured to calculate a toner usage amount per day. The image forming apparatus stores the calculated toner usage amount per day in a list when a toner usage history is permitted to be stored, and avoids storing the calculated toner usage amount per day in the list when the usage history is inhibited from being stored. When the toner usage history is permitted to be stored, the image forming apparatus extracts a feature amount indicating a toner consumption tendency exhibited by a user based on the toner usage amount per day corresponding to a predetermined period stored in the list, and avoids extracting the feature amount when the toner usage history is inhibited from being stored.

Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

Abstract: Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: An image reading device includes a turning unit, a hinge, and a reading unit having a reader that reads a sheet image. The hinge turns the turning unit which turns relative to the reading unit. The reader reads, through a reading unit reading glass, an image on a sheet placed on the reading glass. The turning unit includes a pressing plate, a conveying roller, a motor, and a communication unit. The pressing plate presses a sheet against the reading glass when the turning unit is at a position closing the reading glass. The motor rotates the conveying roller to convey a sheet. In a direction perpendicular to a turning axis line direction of the hinge, the motor is disposed on one side of the turning unit. The communication unit is disposed on the other side and receives data from outside of the image reading device.

Abstract: An image reading apparatus includes a projection portion arranged between a first reading position of a first image reading portion and a second reading position of a second image reading portion in a sheet conveyance direction. The projection portion projects from one of an upper surface of a main body unit and a lower surface of a sheet conveyer and is arranged outside an area through which a sheet on a conveyance path passes in a width direction orthogonal to the sheet conveyance direction. A gap of the conveyance path in a height direction between the upper surface of the main body unit and the lower surface of the sheet conveyer is secured by the projection portion abutting against the other of the upper surface and the lower surface outside the area.