Abstract: Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Abstract: Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

Abstract: A solid state imaging device having a back-illuminated type structure in which a lens is formed on the back side of a silicon layer with a light-receiving sensor portion being formed thereon. Insulating layers are buried into the silicon layer around an image pickup region, with the insulating layer being buried around a contact layer that connects an electrode layer of a pad portion and an interconnection layer of the surface side. A method of manufacturing such a solid-state imaging device is also provided.

Abstract: The present disclosure relates to a solid-state imaging element in which the cost reduction of a curved imaging element can be achieved, a method for manufacturing the solid-state imaging element, and an electronic apparatus. A curvature base is formed so as to be curved in a concave shape at a center leaving a small edge. The curvature base is divided into five portions of an element disposition portion and four peripheral portions. This element disposition portion is formed in a porous state. A pore (air bubble) in the porous state is smaller than a pixel size. A porous material such as a ceramic-based material, a metal-based material, or a resin-based material can be used as the porous material, for example. The present disclosure can be applied to a CMOS solid-state imaging element to be used for an imaging device, for example.

Abstract: In a case where a user places a document placed on a document positioning glass plate without sufficiently opening an automatic document feeding device, sheet size information will not be reset and an image may be read based on incorrect size information. Therefore, in the present invention, an angle at which the size information is reset is set to an angle between a first angle at which the automatic document feeding device is closed, and a second angle (?1) at which the automatic document feeding device is moved to open automatically after being released from a holding state by a holding unit.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: A method for preparing a chromatography medium having the properties of high virus adsorption and high fluidity, and a method for producing a virus vaccine using the chromatography medium are provided. The chromatography medium is obtained by forming a sulfated polysaccharide bound with porous particles having an exclusion limit molecular weight of 6000 Da or less when pure water is used as mobile phase and standard polyethylene glycol is used and an average particle size in the range of 30-200 ?m.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: A glass for chemical strengthening contains, in terms of mol percentage based on oxides, SiO2: 60 to 67%, Al2O3: 9 to 13.5%, Na2O: 13.5 to 18.5%, K2O: 0.1 to 3%, MgO: 6 to 10.5%, and TiO2: more than 0% and 5% or less. The glass has a main surface and a back surface opposing the main surface. A tin content in the back surface is larger than a tin content in the main surface. A hydrogen concentration in a depth of 1 to 2 ?m in a sheet thickness direction from a surface of the main surface is gradually decreased in a depth direction.

Abstract: An image reading device includes a turning unit, a hinge, and a reading unit having a reader that reads a sheet image. The hinge turns the turning unit which turns relative to the reading unit. The reader reads, through a reading unit reading glass, an image on a sheet placed on the reading glass. The turning unit includes a pressing plate, a conveying roller, a motor, and a communication unit. The pressing plate presses a sheet against the reading glass when the turning unit is at a position closing the reading glass. The motor rotates the conveying roller to convey a sheet. In a direction perpendicular to a turning axis line direction of the hinge, the motor is disposed on one side of the turning unit. The communication unit is disposed on the other side and receives data from outside of the image reading device.

Abstract: Disclosed is a vehicle lamp including a projection lens, and a light source located behind the projection lens so that light emitted from the light source is irradiated forward through the projection lens. The projection lens includes an upright wall surface formed on a peripheral edge thereof, in which the upright wall surface has a greater longitudinal inclination angle than a front surface of the projection lens. A light control member is located behind the projection lens, in which the light control member is configured to suppress light incident on the projection lens from the light source, from being internally reflected by the upright wall surface.

Abstract: An image forming apparatus, including: a conveyance unit configured to convey a sheet on a conveyance path on which the sheet is conveyed; a first conveyance path opening member configured to open a first portion of the conveyance path; a second conveyance path opening member configured to open a second portion, which is located downstream the first portion, of the conveyance path; a sheet leading edge position detecting unit configured to detect a position of a leading edge of a stopped sheet on the conveyance path; and a determination unit configured to determine, based on a detection result of the sheet leading edge position detecting unit, one of not conveying the stopped sheet, causing the conveyance unit to convey the stopped sheet toward the first portion, and causing the conveyance unit to convey the stopped sheet toward the second portion.

Abstract: An image reading apparatus includes a main body unit, a sheet conveyance unit configured to convey a sheet, a conveyance path, a first image reading portion provided on the main body unit, and configured to read an image on a first surface of the sheet at a first reading position, a second image reading portion provided on the sheet conveyance unit downstream of the first image reading portion in a sheet conveyance direction, and configured to read an image on a second surface opposite from the first surface of the sheet at a second reading position, and a conveyance path securing portion arranged between the first reading position and the second reading position in the sheet conveyance direction, and configured to secure the conveyance path between an upper surface of the main body unit and a lower surface of the sheet conveyance unit.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: A double feed detection sensor unit includes a double feed detection sensor for detecting a document via a hole on a conveyance guide, a control circuit board on which the double feed detection sensor and an element are provided, and a protection member provided to cover the element.

Abstract: The image forming apparatus comprises a photosensitive drum which is replaceable, an intermediate transfer belt unit which is brought into contact with the photosensitive drum to operate and which is replaceable, and a separation motor configured to move the intermediate transfer belt unit in a direction toward the photosensitive drum and in a direction away from the photosensitive drum. The image forming apparatus causes the separation motor to separate the intermediate transfer belt unit and the photosensitive drum from each other in a case where at least one of the photosensitive drum and the intermediate transfer belt unit reaches the replacement timing when the image forming apparatus shifts to a low-power state in which power consumption of the image forming apparatus is suppressed compared with that of the image forming apparatus in a normal operation.