Abstract: The present invention relates to a novel diaminedithiol derivative or a pharmaceutically acceptable salt thereof; radiorhenium or radiotechneticum complex thereof; a composition for treating liver cancer comprising the radiorhenium complex and lipiodol; and, a preparative kit of the composition for treating liver cancer.

Abstract: A semiconductor memory device having a partial activation framework, which provides an efficient page mode operation while operating in a partial activation mode. Control circuits and methods are provided to enable a page mode operation (for read and write data accesses) in a semiconductor memory device (such as a DRAM, FCRAM) having a partial activation framework, resulting in an improved data access speed when data is written/read from memory locations having the same wordline address.

Abstract: A semiconductor memory device and a method of generating a chip selection signal that enable the analysis of the causes of defects of defective memory devices selected by a user from a system with a plurality of memory devices and the fixing the defects are provided. The semiconductor memory device includes a programming register, an input buffer control circuit, and a chip selection circuit. The programming register activates an output signal in response to an address and a command input from the outside. The input buffer control circuit activates the plurality of data input buffer circuits in response to the output signal of the programming register. The chip selection circuit activates a defect detecting & repairing circuit, such as a repair circuit or a test time shortening circuit, when at least one of output signals of the plurality of data input buffer circuits is in a first logic state.

Abstract: The semiconductor memory device includes local input/output (I/O) lines, global I/O lines, and a memory corethat is coupled between a bit line and a complementary bit line. The memory core includes a memory cell array, a bit line equalizer circuit, a PMOS sense amplifier (S/A), a PMOS S/A driving circuit for driving the PMOS S/A, a transmission gate circuit, an NMOS S/A, and an NMOS S/A driving circuit for driving the NMOS S/A. First and second transistors for connecting the local I/O lines to the global I/O lines are installed between adjacent bit lines. The PMOS S/A driving circuit, which is a first driving transistor, and the NMOS S/A driving circuit, which is a second driving transistor, are also installed between adjacent bit lines. Because the semiconductor memory device arranges a PMOS S/A driving circuit, an NMOS S/A driving circuit, and a gating circuit for connecting local I/O lines to global I/O lines, between adjacent bit lines, the chip area is reduced.

Abstract: A semiconductor memory device comprises a write column select line or read column select line for shielding a signal line. The semiconductor memory device may include a signal line, a read column select line, and a write column select line. The signal line may transmit an operation signal related to the operation of the semiconductor memory device. The read column select line may transmit a read column select signal, which may control transfer of a data signal of a bit line to a data line. The write column select line may transmit a write column select signal, which may control transfer of the data signal of the data line to the bit line. One of the read column select line and the write column select line to transmit a deactivated column select signal among the read column select signal and the write column select signal, may be maintained at a predetermined logic level and may shield the signal line.

Abstract: Circuits and methods for refreshing memory banks in a DRAM are provided. A refresh circuit is provided in a DRAM having at least one memory bank and a plurality of word lines connected to memory locations in the memory bank. The word lines are subdivided into first and second groups of subword lines. The refresh circuit includes a delay circuit, a first driving circuit, and a second driving circuit. The delay circuit receives a refresh signal and outputs a delayed refresh signal a predetermined time delay later. The first driving circuit responds to the refresh signal by driving word lines in the first group of subword lines and the second driving circuit responds to the delayed refresh signal by driving word lines in the second group of subword lines.

Abstract: A layout of a bit line sensing control circuit for a semiconductor memory device includes two bit line pairs extending in a first direction. A power contact is arranged between the two bit line pairs. A power gate is arranged around the power contact. A plurality of sense transistors respectively have a plurality of sense transistor gates. The plurality of sense transistor gates are arranged around the power gate. A pair of control line contacts is arranged in a second direction at an adjacent location outside the two bit line pairs. A control line extends in the second direction and is connected to the power gate through the pair of control line contacts. A power line extends in the second direction adjacent to the control line and is connected to an active area surrounded by the power gate through the power contact.

Abstract: A semiconductor memory device and a method of generating a chip selection signal that enable the analysis of the causes of defects of defective memory devices selected by a user from a system with a plurality of memory devices and the fixing the defects are provided. The semiconductor memory device includes a programming register, an input buffer control circuit, and a chip selection circuit. The programming register activates an output signal in response to an address and a command input from the outside. The input buffer control circuit activates the plurality of data input buffer circuits in response to the output signal of the programming register. The chip selection circuit activates a defect detecting & repairing circuit, such as a repair circuit or a test time shortening circuit, when at least one of output signals of the plurality of data input buffer circuits is in a first logic state.

Abstract: A mode selection circuit for a semiconductor memory device includes a timing register for generating first and second control signals in response to a command signal and a first address signal, a programming control signal generator for generating third control signals in response to a second address signal and the first control signal, and a mode selection signal generator for generating mode selection signals in response to a master signal, the second control signal, and the third control signals, wherein the mode selection signals are activated in accordance with a sequential order of activation of the third control signals.

Abstract: A semiconductor memory device includes first and second isolation transistors for electrically connecting/isolating a pair of bitlines to/from a sense amplifier circuit, and a MOS transistor having a source region that is shared with one of sources of the first and second isolation transistors. The MOS transistor may be used as a bitline boosting capacitor.

Abstract: A semiconductor memory device comprises a memory cell array, at least one redundant cell control, a sense amplifier, and at least one redundant cell. The memory cell array receives and outputs data through data I/O line groups. The redundant cell control stores a defective cell address, generates a redundant cell enable control signal when the defective cell address is equal to an input cell address, generates a redundant cell read control signal during a read operation in response to the redundant cell enable control signal, and generates a redundant cell write control signal during a write operation in response to the redundant cell enable control signal. The sense amplifier is connected to an I/O line group commonly connected to the data I/O line groups, amplifies and outputs data outputted from the memory cell array during the read operation, and is disabled in response to the redundant cell read control signal.

Abstract: A semiconductor memory device includes first and second isolation transistors for electrically connecting/isolating a pair of bitlines to/from a sense amplifier circuit, and a MOS transistor having a source region that is shared with one of sources of the first and second isolation transistors. The MOS transistor may be used as a bitline boosting capacitor.

Abstract: A semiconductor memory device comprises a memory cell array, a defective address programming means, a redundant enable signal generating means, an output means, and a mode control signal setting means. The memory cell array comprises a plurality of memory cells. The defective address programming means programs a redundant control signal and a defective address of a defective memory cell among the plurality of the memory cells at a package level in response to a first control signal and an address signal applied from an external portion. The redundant enable signal generating means generates a comparison coincident signal in response to the redundant control signal when the address is consistent with the defective address. The output means outputs the comparison coincident signal to an external portion in response to a second control signal during a test operation.

Abstract: A semiconductor memory device comprises a memory cell array, a defective address programming means, a redundant enable signal generating means, an output means, and a mode control signal setting means. The memory cell array comprises a plurality of memory cells. The defective address programming means programs a redundant control signal and a defective address of a defective memory cell among the plurality of the memory cells at a package level in response to a first control signal and an address signal applied from an external portion. The redundant enable signal generating means generates a comparison coincident signal in response to the redundant control signal when the address is consistent with the defective address. The output means outputs the comparison coincident signal to an external portion in response to a second control signal during a test operation.

Abstract: A layout of a bit line sensing control circuit for a semiconductor memory device includes two bit line pairs extending in a first direction. A power contact is arranged between the two bit line pairs. A power gate is arranged around the power contact. A plurality of sense transistors respectively have a plurality of sense transistor gates. The plurality of sense transistor gates are arranged around the power gate. A pair of control line contacts is arranged in a second direction at an adjacent location outside the two bit line pairs. A control line extends in the second direction and is connected to the power gate through the pair of control line contacts. A power line extends in the second direction adjacent to the control line and is connected to an active area surrounded by the power gate through the power contact.

Abstract: A semiconductor memory device comprises a memory cell array, at least one redundant cell control, a sense amplifier, and at least one redundant cell. The memory cell array receives and outputs data through data I/O line groups. The redundant cell control stores a defective cell address, generates a redundant cell enable control signal when the defective cell address is equal to an input cell address, generates a redundant cell read control signal during a read operation in response to the redundant cell enable control signal, and generates a redundant cell write control signal during a write operation in response to the redundant cell enable control signal. The sense amplifier is connected to an I/O line group commonly connected to the data I/O line groups, amplifies and outputs data outputted from the memory cell array during the read operation, and is disabled in response to the redundant cell read control signal.

Abstract: A mode selection circuit for a semiconductor memory device includes a timing register for generating first and second control signals in response to a command signal and a first address signal, a programming control signal generator for generating third control signals in response to a second address signal and the first control signal, and a mode selection signal generator for generating mode selection signals in response to a master signal, the second control signal, and the third control signals, wherein the mode selection signals are activated in accordance with a sequential order of activation of the third control signals.

Abstract: A semiconductor memory device including a plurality of memory blocks having associated with one or more circuit blocks therearound, and a plurality of input/output lines associated with the memory blocks, is disclosed. The input/output lines are divided into at least a first group and a second group. First portions of the input/output lines of the first group are arranged between the adjacent memory blocks while first portions of the input/output lines of the second group are arranged within the circuit blocks around the adjacent memory blocks. Second portions of the input/output lines of the first group are arranged on the circuits blocks around the memory blocks while second portions of the input/output lines of the second group are arranged between the adjacent memory blocks.

Abstract: A semiconductor memory device including a plurality of memory blocks, and a plurality of input/output lines associated with the memory blocks, is disclosed. The input/output lines are divided into at least a first group and a second group. A first parts of the input/output lines of the first group are arranged between adjacent memory blocks while first parts of the input/output lines of the second group are arranged on circuit blocks around the adjacent memory blocks, and second parts of the input/output lines of the first group are arranged on the circuits blocks around the memory blocks while second parts of the input/output lines of the second group are arranged between the adjacent memory blocks.

Abstract: Integrated circuit memory devices include a rectangular integrated circuit memory device substrate that includes a pair of short sides, a pair of long sides and a pair of opposing faces. The substrate also includes an array of memory cells and peripheral circuits therein. A plurality of spaced apart rows of input/output pads on one of the faces extend parallel to the short sides. The face is free of (i.e. does not include) a row of input/output pads that extends parallel to the long sides. The input/output pads are preferably arranged on the integrated circuit memory device substrate, relative to the circuits in the integrated circuit memory device substrate. More specifically, the integrated circuit memory device includes a plurality of memory cell array blocks, first decoder blocks and second decoder blocks in the substrate. A respective first decoder block extends parallel to the short sides adjacent a respective memory cell array block and opposite a short side.