Patents by Inventor Yun Yang

Yun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151948
    Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Inventors: Cheng-Chen LIN, Hsin-Hsuan HUANG, Shu-Yun YANG
  • Patent number: 11978664
    Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pang-Sheng Chang, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang, Li-Chieh Wu, Chun-Wei Hsu
  • Patent number: 11973526
    Abstract: An assembly structure for an electronic device protecting casing and an interfacing structure with magnetic connectors includes a protecting casing for protecting a tablet form electronic device and an interfacing device for power or signal transferring to or from the protecting casing. The protecting casing includes a casing side connector. The casing side connector includes an inner connector and an outer connector. The interfacing device includes an interfacing connector. A magnetic connecting device is used for mechanically and magnetically connecting an interfacing connector of the interfacing device with an outer connector of the protecting casing. The magnetic connecting device includes at least one interfacing side magnetic unit which is installed on the interfacing device at the same side installing the interfacing connector, and at least one casing side magnetic unit which is installed one the casing side connector at the same side having the outer connector.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: April 30, 2024
    Assignee: THE JOY FACTORY, INC.
    Inventors: Sampson Yang, Yun-Chang Tsui
  • Patent number: 11969397
    Abstract: The present invention relates to a composition for preventing or treating transplantation rejection or a transplantation rejection disease, comprising a novel compound and a calcineurin inhibitor. A co-administration of the present invention 1) reduces the activity of pathogenic Th1 cells or Th17 cells, 2) increases the activity of Treg cells, 3) has an inhibitory effect against side effects, such as tissue damage, occurring in the sole administration thereof, 4) inhibits various pathogenic pathways, 5) inhibits the cell death of inflammatory cells, and 6) increases the activity of mitochondria, in an in vivo or in vitro allogenic model, a transplantation rejection disease model, a skin transplantation model, and a liver-transplanted patient, and thus inhibits transplantation rejection along with mitigating side effects possibly occurring in the administration of a conventional immunosuppressant alone.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: April 30, 2024
    Assignee: THE CATHOLIC UNIVERSITY OF KOREA INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Mi-La Cho, Dong-Yun Shin, Jong-Young Choi, Chul-Woo Yang, Sung-Hwan Park, Seon-Yeong Lee, Min-Jung Park, Joo-Yeon Jhun, Se-Young Kim, Hyeon-Beom Seo, Jae-Yoon Ryu, Keun-Hyung Cho
  • Publication number: 20240134164
    Abstract: An optical imaging lens assembly includes six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The fifth lens element has negative refractive power. The sixth lens element has positive refractive power.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 25, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Yuan LIAO, Shu-Yun YANG
  • Publication number: 20240131819
    Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.
    Type: Application
    Filed: May 3, 2023
    Publication date: April 25, 2024
    Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
  • Publication number: 20240133473
    Abstract: The application relates to an anti-back-transfer intake structure of a rotating detonation combustion chamber including a Tesla valve communicating with the rotating detonation combustion chamber and arranged at an inlet of the rotating detonation combustion chamber. The Tesla valve includes a casing and a flow passage, the casing is coaxially connected with an outer wall of the rotating detonation combustion chamber, the flow passage is arranged in the casing, and the flow passage has an inlet end for introducing air, and an outlet end connected with an annular passage of the rotating detonation combustion chamber.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Feilong SONG, Yun WU, Xin CHEN, Min JIA, Huimin SONG, Shanguang GUO, Zhao YANG, Jiaojiao WANG
  • Patent number: 11966711
    Abstract: Embodiments of the present disclosure relate to a solution for translation verification and correction. According to the solution, a neural network is trained to determine an association degree among a group of words in a source or target language. The neural network can be used for translation verification and correction. According to the solution, a group of words in a source language and translations of the group of words in a target language are obtained. An association degree among the group of words and an association degree among the translations can be determined by using the trained neural network. Then, whether there is a wrong translation can be determined based on the association degrees. In some embodiments, corresponding methods, systems and computer program products are provided.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: April 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Guang Ming Zhang, Xiaoyang Yang, Hong Wei Jia, Mo Chi Liu, Yun Wang
  • Publication number: 20240124998
    Abstract: The titanium-containing oxide slag, low-purity silicon and slagging fluxes are subject to reduction smelting together, and a bulk Si—Ti intermediate alloy is obtained by slag-metal separation; the obtained bulk Si—Ti intermediate alloy is crushed into Si—Ti intermediate alloy particles; and the obtained Si—Ti intermediate alloy particles are used as an anode, metallic molybdenum or metallic nickel as a cathode, metallic titanium as a reference electrode, and NaCl—KCl—NaF together with small amounts of Na3TiF6 or K3TiF6 as a molten salt, to carry out the electrolysis under a high-purity argon atmosphere at a temperature of 973 K. Ti in the Si—Ti intermediate alloy particles dissolved at the anode and deposited at the cathode, while Si in the Si—Ti intermediate alloy particles fell off from the anode as metallic silicon powder.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Yun LEI, Shiding WANG, Dongfang YANG, Wenhui MA, Zhanchao LI, Yakun ZHANG
  • Patent number: 11957264
    Abstract: A multifunctional cooker includes a cooker body and an upper cover assembly. The upper cover assembly is provided with a heating assembly and a wind power assembly, and the multifunctional cooker is provided with a first member cooperated with the upper cover assembly. The first member is provided with an air duct, and the first member realizes sealing of the cooker body or realizes releasing of the sealing of the cooker body through a state change of the air duct. The first member is capable of releasing pressure when the pressure inside the cooker body exceeds a threshold.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: April 16, 2024
    Assignee: GUANGDONG SHUNDE OUNING TECHNOLOGY ELECTRICAL APPLIANCE CO., LTD.
    Inventors: Zhenxiong Huang, Yun Yang
  • Patent number: 11961886
    Abstract: Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a substrate and nanostructures suspended over the substrate. The semiconductor structure also includes a gate structure wrapping around the nanostructures and a source/drain structure attached to the nanostructures. The semiconductor structure also includes a contact vertically over the source/drain structure and a first conductive structure vertically over the gate structure. The semiconductor structure also includes a second conductive structure in contact with a top surface of the first conductive structure and a top surface of the contact and including an extending portion laterally sandwiched between the first conductive structure and the contact.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jia-Heng Wang, Pang-Chi Wu, Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang
  • Patent number: 11953654
    Abstract: An image capturing lens system includes, in order from an object side to an image side, a first lens element with positive refractive power having an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, a second lens element with negative refractive power having an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof, a third lens element with positive refractive power having an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof, and a fourth lens element with negative refractive power having an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 9, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che Hsueh, Hsin-Hsuan Huang, Shu-Yun Yang
  • Patent number: 11954758
    Abstract: This disclosure provides systems, devices, apparatus, and methods, including computer programs encoded on storage media, for dynamic wave pairing. A graphics processor may allocate one or more GPU workloads to one or more wave slots of a plurality of wave slots. The graphics processor may select a first execution slot of a plurality of execution slots for executing the one or more GPU workloads. The selection may be based on one of a plurality of granularities. The graphics processor may execute, at the selected first execution slot, the one or more GPU workloads at the one of the plurality of granularities.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: April 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yun Du, Andrew Evan Gruber, Zilin Ying, Chunling Hu, Baoguang Yang, Yang Xia, Gang Zhong, Chun Yu, Eric Demers
  • Patent number: 11950928
    Abstract: A wearable sensor and method for providing a wearable sensor are disclosed. In a first aspect, the wearable sensor comprises a first module, wherein the first module comprises a top layer, a printed circuit board (PCB) layer, and a bottom layer. The bottom layer comprises a double adhesive layer that adheres to both the PCB layer and the user. The bottom layer includes at least two openings to house at least two electrodes for monitoring of a user. The wearable sensor further comprises a second module coupled to the first module, wherein the first module is disposable and the second module is reusable. In a second aspect, the method comprises providing the aforementioned wearable sensor.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 9, 2024
    Assignee: Vital Connect, Inc.
    Inventors: Yun Yang, Azin Sahabi
  • Publication number: 20240108817
    Abstract: An implantable microneedle and a manufacturing method therefor is disclosed. The implantable microneedle includes a coating layer for covering at least one part of the surface of a tip part of the microneedle. When exposed to moisture, the coating layer can be separated from the tip part of the microneedle and thus be implanted.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Inventors: Seung Yun YANG, Sang-Gu YIM, Young Jun HWANG
  • Publication number: 20240114125
    Abstract: According to one aspect, a method includes obtaining a sensor assembly that includes at least a first camera and a second camera, and positioning the sensor assembly in an enclosure of a sensor testing system. The enclosure has a first enclosure target and a second enclosure target affixed thereon, and includes a sensor arrangement. The sensor testing assembly further includes a computing arrangement and a data acquisition arrangement, The method also includes performing a first test on the sensor assembly by providing commands to the sensor assembly using the computing arrangement, and monitoring the sensor assembly during the first test. Monitoring the sensor assembly includes obtaining data from the sensor assembly and/or the sensor arrangement, and providing the data to the data acquisition arrangement. Finally, the method includes processing the data, wherein processing the data includes determining whether the data indicates that the sensor assembly passes the first test.
    Type: Application
    Filed: September 20, 2023
    Publication date: April 4, 2024
    Applicant: Nuro, Inc.
    Inventors: Fan Yang, Samuel Cheng, Yun Zhang, Brian Hufnagel, Tarik Snyder, Jordan Aaron, Biyu Ye
  • Patent number: 11949591
    Abstract: The present disclosure provides a method (100) in a network node advertising a Binding Segment Identifier, BSID. The method (100) includes: receiving (110) a first echo request packet containing a first target Forwarding Equivalence Class, FEC, stack including an FEC associated with the BSID; and transmitting (120), in response to a Time To Live, TTL, expiration associated with the first echo request packet, a first echo reply packet to an initiating network node initiating the first echo request packet, the first echo reply packet containing an indicator indicating that the FEC is to be replaced by a set of FECs.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 2, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Ying Lu, Shuo Yang, Wei Sun, Jinfeng Zhao, Yun Lin
  • Patent number: 11949961
    Abstract: A computer-implemented method for optimizing the placement of previously selected breaks in a media item is provided herein. Embodiments of the method include steps of identifying a break in a media item, the break being associated with a first break point at a first time during playback of the media item. The method may also include steps of dynamically adjusting the placement of the breaks within the media item based on the performance of the media item.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: April 2, 2024
    Assignee: GOOGLE LLC
    Inventors: Yun Shi, Jianfeng Yang, Ramesh Sarukkai, Zindziswa Lara McCormick
  • Patent number: 11945658
    Abstract: A platform for processing a workpiece includes a transmission mechanism, a plurality of workstations and a plurality of movable vehicles. The transmission mechanism transports the workpiece to be processed to one of the plurality of workstations. Each movable vehicle includes a processing module and a docking interface adapted to connect with a docking station of each workstation. The movable vehicles are each adapted to move in and out of each workstation, and each processing module is adapted to process the workpiece transmitted to the workstation after the movable vehicle is moved in and positioned in the workstation.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: April 2, 2024
    Assignees: TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Qingdao) Ltd.
    Inventors: Jian Cao, Lvhai (Samuel) Hu, Dandan (Emily) Zhang, Fengchun (Fred) Xie, An (Joshua) Yang, Yun (Shanghai) Liu, Wenhe Ma, Peng Ji, Zongjie (Jason) Tao, Roberto Francisco-Yi Lu, Tao Xu
  • Patent number: D1024460
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: April 23, 2024
    Assignee: PLANDDO CO., LTD.
    Inventors: Tsung-Te Sun, Chao-Shun Liang, Chia-Hsin Wu, Ping-Yun Su, Yu-Huai Yang